F-213-1 HSEC8-125-01-L-DV-A HSEC8-149-01-L-DV-A (0,80 mm) .0315" HSEC8-DV SERIES TM VERTICAL EDGE RATE CARD SOCKET Mates with (1,60 mm) .062" TM SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HSEC8-DV Insulator Material: Black Liquid Crystal Polymer Contact: BeCu Plating: Au or Sn over 50" (1,27 m) Ni Current Rating: 1.9A per contact @ 30C Temperature Rise (See website for details) Operating Temp: -55C to +125C Card Insertion Depth: (3,15 mm) .125" nominal RoHS Compliant: Yes Processing: Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (10-60) STANDARD & CUSTOM CARDS AVAILABLE * Standard high speed interface cards for 19 mm, 25 mm & 30 mm mated heights, single-ended & differential applications. See HSC8 Series. * (2,36 mm) .093" thick card * Custom cards for low-cost stack height customization * Samtec supplied card layout/ artwork to make your own cards * Specialty card shapes Mates with: 1,60 mm thick cards, ECDP, HSC8 (R) fina HSEC8 1 Note: Some lengths, styles and options are non-standard, non-returnable. POSITIONS PER ROW CARD THICKNESS PLATING OPTION DV POSITIONS PER ROW 09 13* 25* 37 40 49* 50 60 E D E (4.50) .177 (11,80) .458 (6,10) .240 (15,00) .591 (6,10) .240 (24,60) .969 (18,10) .713 (34,20) 1.346 (18,90) .744 (36,60) 1.441 (22,90) .902 (43,80) 1.724 (22,90) .902 (44,60) 1.756 (26,90) 1.059 (52,60) 2.071 Positions where no dimensions are given do not have keying feature. *Mates with ECDP Series. D 02 01 No. of Positions x (0,80) .0315 + (4,60) .181 (1,75) .070 -BL = Board Locks (40, 50, 60 only) (Other sizes available. Contact Samtec.) -L = Latching Option (13, 25, 37, 49 only) -L2 = ECDP Latching 09, 13, 25, 49 only (For use with ECDP) CABLE CONNECTOR (7,00) (5,60) .276 .220 01 ECDP-04 ECDP-08 ECDP-16 ECDP-32 10, 20 & 30 OTHER OPTION = (5,50 mm) .217" DIA Polyimide Film Pick & Place Pad = 10" (0,25 m) Gold on contact, Matte Tin on tail Note: Other Gold plating options available. Contact Samtec. No. of Positions x (0,80) .0315 + (7,80) .307 A -K -L = (1,60 mm) .062" thick card (13, 25, 49 only available with -L or -L2 option; 09 only available with -L2 option; 37 only available with -L option) (0,80) .0315 PCB to -DV -DV to ECDP -01 09, 10, 13, 20, 25, 30, 37, 40, 49, 50, 60 -DV to -DV HIGH SPEED CABLE APPLICATIONS Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling 8 GHz / 16 Gbps 9 GHz / 18 Gbps Differential Pair Signaling 10.5 GHz / 21 Gbps 14 GHz / 28 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Complete test data available at www.samtec.com?HSEC8-DV or contact sig@samtec.com 02 Note: While optimized for 50 applications, this connector with alternative signal/ground patterns may also perform well in certain 75 applications. Contact Samtec for further information. -EM to -DV l i nch.com HSEC8 7,98 mm Stack Height APPLICATION SPECIFIC OPTION Guide rails and pass-through options. Call Samtec. BOARD-TO-BOARD APPLICATIONS -WT HSEC8-109-L2 HSEC8-113-L2 HSEC8-125-L2 HSEC8-149-L2 = Weld tab -TR = Tape & Reel (7,98) .314 (7,98) .314 (1,32) (7,80) .052 .307 (1,12) .044 DIA No. of Positions x(0,80) .0315 + (2,20) .087 (4,25) .167 WWW.SAMTEC.COM -L -BL