SN54HC04, SN74HC04 www.ti.com SCLS078E - DECEMBER 1982 - REVISED OCTOBER 2010 HEX INVERTERS Check for Samples: SN54HC04, SN74HC04 FEATURES 1 Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-mA Max ICC Typical tpd = 8 ns 4-mA Output Drive at 5 V Low Input Current of 1 mA Max 3 12 4 11 5 10 6 9 7 8 6A 6Y 5A 5Y 4A 4Y 2A NC 2Y NC 3A 3 2 4 20 19 18 5 17 1 6A VCC VCC 6 16 7 15 14 8 6Y NC 5A NC 5Y 9 10 11 12 13 4Y 13 4A 14 2 1Y 1 3Y 1A 1Y 2A 2Y 3A 3Y GND 1A NC SN54HC04...FK PACKAGE (TOP VIEW) SN54HC04...J OR W PACKAGE SN74HC04...D, DB, N, NS, OR PW PACKAGE (TOP VIEW) GND NC * * * * * * NC - No internal connection DESCRIPTION/ORDERING INFORMATION The 'HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic. ORDERING INFORMATION PACKAGE (1) TA PDIP - N SOIC - D -40C to 85C -55C to 125C (1) Reel of 1000 SN74HC04N Reel of 1000 SN74HC04DE4 Reel of 2500 SN74HC04DRG3 Tube of 250 SN74HC04DT SOP - NS Reel of 2000 SSOP - DB Reel of 2000 TSSOP - PW ODERABLE PART NUMBER SN74HC04N SN74HC04NSR SN74HC04NSRG4 SN74HC04DBR SN74HC04DBRE4 Tube of 90 SN74HC04PW Reel of 2000 SN74HC04PWR Tube of 250 SN74HC04PWT CDIP - J Reel of 1000 SNJ54HC04J CFP - W Reel of 900 SNJ54HC04W LCCC -FK Reel of 2200 SNJ54HC04FK TOP-SIDE MARKING HC04 HC04 HC04 HC04 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1982-2010, Texas Instruments Incorporated SN54HC04, SN74HC04 SCLS078E - DECEMBER 1982 - REVISED OCTOBER 2010 www.ti.com Table 1. FUNCTION TABLE (EACH INVERTER) INPUT A OUTPUT Y H L L H LOGIC DIAGRAM (POSITIVE LOGIC) A Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX -0.5 7 UNIT VCC Supply voltage range IIK Input clamp current (2) VI < 0 or VI > VCC 20 mA IOK Output clamp current (2) VO < 0 20 mA IO Continuous output current VO = 0 to VCC 25 mA 50 mA Continuous current through VCCor GND qJA Tstg (1) (2) (3) Package thermal impedance (3) D package 86 N package 80 NS package 76 PW package 113 Storage temperature range -60 V C/W 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) SN54HC04 VCC Supply voltage VIH High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V SN74HC04 MIN NOM MAX MIN NOM MAX 2 5 6 2 5 6 1.5 1.5 3.15 3.15 4.2 4.2 VCC = 2 V VIL Low-level input voltage VCC = 4.5 V VCC = 6 V VI Input voltage VO Output voltage 0 0 VCC = 2 V t/v Input transition rise or fall rate (1) 2 Operating free-air temperature 0.5 1.35 1.8 1.8 VCC 0 V VCC V 1000 500 500 VCC = 4.5 V 400 -55 125 V VCC 1000 VCC = 6 V TA 0.5 0 V V 1.35 VCC UNIT ns 400 -40 85 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright (c) 1982-2010, Texas Instruments Incorporated Product Folder Link(s): SN54HC04, SN74HC04 SN54HC04, SN74HC04 www.ti.com SCLS078E - DECEMBER 1982 - REVISED OCTOBER 2010 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -20 mA VI = VIH or VIL VOH IOH = -4 mA IOH = -5.2 mA II SN54HC04 MAX MIN SN74HC04 MAX MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 UNIT MAX V 5.34 0.002 0.1 0.1 0.1 IOL = 20 mA 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 VI = VCC or 0 6V 0.1 100 1000 1000 nA VI = VCC or 0, IO = 0 6V 2 40 20 mA 10 10 10 pF IOL = 5.2 mA ICC TYP 2V VI = VIH or VIL VOL TA = 25C MIN Ci 2 V to 6 V 3 V Switching Characteristics over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) VCC tpd A Y tt Y TA = 25C MIN SN54HC04 MIN SN74HC04 TYP MAX MAX MIN 2V 45 95 125 120 4.5 V 9 19 29 24 6V 8 16 25 20 2V 38 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 UNIT MAX ns ns Operating Characteristics TA = 25C Cpd PARAMETER TEST CONDITIONS Power dissipation capacitance per inverter No load Copyright (c) 1982-2010, Texas Instruments Incorporated Product Folder Link(s): SN54HC04, SN74HC04 TYP 20 UNIT pF Submit Documentation Feedback 3 SN54HC04, SN74HC04 SCLS078E - DECEMBER 1982 - REVISED OCTOBER 2010 www.ti.com PARAMETER MEASURMENT INFORMATION From Output Under Test Test Point Input 0V CL = 50 pF (see Note A) 50% 10% 90% In-Phase Output 90% tr tPHL tPLH LOAD CIRCUIT Input VCC 50% 50% 0V 90% tPHL VOH 50% 10% Out-of-Phase Output VOL tf tPLH 90% 50% 10% tf VOLTAGE WAVEFORMS INPUT RISE AND FALL TIMES 90% tr VCC 50% 10% 50% 10% 50% 10% 90% tf VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 Submit Documentation Feedback Copyright (c) 1982-2010, Texas Instruments Incorporated Product Folder Link(s): SN54HC04, SN74HC04 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 5962-8409801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type 84098012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8409801CA ACTIVE CDIP J 14 1 TBD Call TI Call TI 8409801DA ACTIVE CFP W 14 1 TBD Call TI Call TI JM38510/65701B2A ACTIVE LCCC FK 20 1 TBD JM38510/65701BCA ACTIVE CDIP J 14 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type A42 N / A for Pkg Type JM38510/65701BDA NRND CFP W 14 1 TBD M38510/65701B2A ACTIVE LCCC FK 20 1 TBD M38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type M38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type SN54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN74HC04D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) SN74HC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) Addendum-Page 1 Samples (Requires Login) 5962-8409801VCA CU SN (3) Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 29-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Pb-Free (RoHS) SN74HC04N ACTIVE PDIP N 14 OBSOLETE PDIP N 14 TBD CU NIPDAU N / A for Pkg Type Call TI Call TI SN74HC04NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN74HC04NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWLE OBSOLETE TSSOP PW 14 SN74HC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC04FK ACTIVE LCCC FK 20 1 TBD SNJ54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54HC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type TBD Addendum-Page 2 CU NIPDAU N / A for Pkg Type Call TI Samples (Requires Login) SN74HC04DT SN74HC04N3 (3) Call TI POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 : * Catalog: SN74HC04, SN54HC04 * Automotive: SN74HC04-Q1, SN74HC04-Q1 * Military: SN54HC04 * Space: SN54HC04-SP NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2012 * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC04NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC04PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC04PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC04DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC04DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC04DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC04DRG4 SOIC D 14 2500 367.0 367.0 38.0 SN74HC04DRG4 SOIC D 14 2500 333.2 345.9 28.6 SN74HC04DT SOIC D 14 250 367.0 367.0 38.0 SN74HC04NSR SO NS 14 2000 367.0 367.0 38.0 SN74HC04PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC04PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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