ALPHA & OMEGA SEMICONDUCTOR, LTD. Document No. PO00052 Version E TO251A PACKAGE OUTLINE E b3 wu ay -G- 1 2 3// 4 | J bl rhe eH fell RECOMMENDED LAND PATTERN NOTE UNIT: mm El 1 i A; C A Ee _ ---+w hs rAe y DIMENSION IN MILLIMETERS DIMENSIONS IN INCHES | MIN. NOM. MAX. MIN. NOM. MAX. A 2.18 2.29 2.39 0.086 0.090 0.094 a2| 089 | 1.14 0.035 | 0.045 b 0.63 0.76 0.85 0.025 0.030 0.033 b2 | o7e | - 1.05 0.030 | 0.041 bs | 495 | 5.46 0.195 | 0.215 c 0.46 0.51 0.61 0.018 0.020 0.024 c2 | 046 | 0.61 0.018 | - 0.024 D 5.97 6.10 6.22 0.235 0.240 0.245 pi { 5.21 | -- | 0.205 | - [| - D2 0.508 BSC 0.02 BSC E 6.35 6.60 6.73 0.250 0.260 0.265 E1 | 4318 | -- [| 0.17 [| [| E2 1.524 BSC 0.06 BSC e 2.29 BSC. 0.090 BSC. et 4.57 BSC. 0.180 BSC. L 370 | 405 | 4.40 0.146 | 0.159 | 0.173 L1 1.05 REF. 0.041 REF. i2 | o89 | | 1.27 0.035 | - | 0.050 1, PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND GATE BURRS. MOLD FLASH SHOULD BE LESS THAN 6 MILS. 2, DIMENSION L IS MEASURED IN GAUGE PLANE 3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED 4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 5. REFER TO JEDEC TO-252 (AA)