LINEAR INTEGRATED CIRCUIT CHIPS GENERAL DESCRIPTION Motorola now offers a very broad selection of linear integrated circuit chips. Among the types of circuits which compose the linear family there are: . Operational Amplifiers Voltage Regulators Comparators . Drivers and Receivers . Sense Amplifiers . D/A and A/D Converters As a general rule of thumb, all linear chips from Motorola are 100% unit probed to the D.C. parameters given in Volume 6 of the Semiconductor Data Library. Far specific information on electrical parameters which are probed contact the nearest Motorola Sales Office. mmooOmp STANDARD FEATURES FOR LINEAR INTEGRATED CIRCUIT CHIPS All linear integrated circuit chips... are 100% electrically tested to sufficient param- eter limits (min/max) to permit distinct identi- fication as either premium or industrial versions @ employ phosphorsilicate passivation which pro- tects the entire active surface area including metallization interconnects during shipping and handling : @ are 100% visually inspected to a modified cri- teria per MIL-STD-883, Method 2010, Condi- tion B @ incorporate a minimum of 4000 A gold backing to ensure positive adherence bonding GENERAL PHYSICAL CHARACTERISTICS OF LINEAR CHIPS The following characteristics represent the vast majority of all Motorola linear chips. Since an indi- vidual chip type may vary slightly, contact your local sales office for information regarding physical charac- teristics critical to a specific application. The overall size and final metallization patterns are shown in the following pages; however the geometries shown and MIC numbers listed are current at the date of print- ing. Since we are constantly striving to improve the quality, performance, and yield of our linear devices we cannot be responsible for changes at future dates. Please contact your local Motorola Sales representative for the most current information. A. Chips thickness: 8 + 1 mil B. Passivation: Phosphorsilicate C. Passivation thickness: 5kA + 1k D. Metallization: Aluminum E. Metallization thickness: 12kA + 2kA F. Back metallization: Gold, alloyed G. Bonding pad dimensions: Typical 4.0 mil x 5.0 mil H. Overall chip dimensions: See pages that follow for individual device type. Tolerance of +5 mils should be allowed. HANDLING PRECAUTIONS Although passivation on all chips provides protec- tion in shipping and handling, care should be exercised to prevent damaging the face of the chip. A vacuum pickup is most useful for this purpose; tweezers are not recommended. There are four basic requirements for handling devices in a prudent manner: 1. Store the chips in a covered or sealed container 2. Store devices in an environment of no more than 30% relative humidity 3. Process the chips in a non-inert atmosphere not exceeding 100C, or in an inert atmosphere not exceeding 400C. 4. Processing equipment should conform to the minimum standards that are normally em- ployed by semiconductor manufacturers. Motorolas engineering staff is available for consul- tation in the event of correlation or processing prob- lems encountered in the use of Motorola linear chips. For assistance, please contact your nearest Motorola sales representative. CHIP AND WAFER PACKAGING Chips Motorolas linear integrated circuit chips come Packaged to the customer in the Multi-Pak carrier. Refer to page 1-11, Figure 7. Wafers Motorolas linear integrated circuit wafers come packaged to the customer in the Wafer-Pak plastic bow. The wafer has been probed and rejects are designated by a red color dot on the die surface. Refer to page 1-8, Figure 2. HOW TO ORDER LINEAR CHIPS OR WAFERS FROM MOTOROLA 1. Remove all suffix package designators from the desired device type. (EXAMPLE: MC1741CP1 now becomes MC1741C) 2. Add a C to the prefix designator if individual chips are desired. (EXAMPLE: MC1741C now is McC1741C) Add a W to the prefix designator if a wafer is de- sired. (EXAMPLE: MC1741C now is MCW1741C) 3. When ordering chips, two options are available: a. The ~1 suffix designator will deliver to you 10 chips per Multi-Pak, up to 1000 chips. (EXAMPLE: MCC1741C-1} 5-2IAAT TATA MCC830 Series (0 to +75C) MCC930 Series (55 to +125C) MDTL integrated circuits provide an excellent balance of speed, power dissipation, and noise immunity for general purpose digital applications. The line includes many multifunction types. Additional logic power is provided by the wired OR capability of the basic MDTL gate. Type Wafer Chip Mask Size Oto 75C | 55 to +125C Function Set # | (Mils) MCC830 MCC930 Exp. Dual 4-Input NAND Gate 18N 38x39 MCC831 MCC931 Clocked Flip-Flop 56H 55x55 MCC832 MCC932 Exp. Dual 4-Input Buffer 84N 39x40 MCC833 MCC933 Dual 4-Input Expander 32H 30x30 MCC834 MCC934 Hex Inverter 57H 47x64 MCC835 MCC935 Hex Inverter (w/o Output Resistors) 4AE 44x44 MCC836 MCC936 Hex Inverter 4AE 44x44 MCC837 MCC937 Hex Inverter 4AE 44x44 MCC838 MCC938 Decade Counter 84L 60x66 MCC839 MCC939 Divide by Sixteen Counter 84L 60x66 MCcC840 MCC940 Hex Inverter (w/o Input Diodes) 4AE 44x44 MCC841 MCC941 Hex Inverter (w/o Output Resistors and Input Diodes) 4AE 44x44 MCC842 MCC942 Dual D Flip-Flop Plus Gates 72A 59x59 MCC844 MCC944 Exp. Dual 4-Input Power Gate 84N 39x40 MCC845 MCC945 Clocked Flip-Flop 47P 44x46 MCC846 MCC946 Quad 2-Input NAND Gate 98M 40x41 MCC847 MCC947 Quad 2-Input Gate Expander 86D 39x41 MCC848 McCc948 Clocked Flip-Flop 47P 44x46 Mccs49 MCcC949 Quad 2-Input NAND Gate (2K Pullups) 98M 40x41 MCC850 MCC950 Pulse Triggered Binary B93 60x60 MCC851 MCC951 Monostable Muitivibrator 29H 55x55 MCC852 MCC952 Dual J-K Flip Flop (common Clock and CD) 45N 60x62 MCC853, MCC953, Dual J-K Flip Flop (Separate Clock and SD) 45N 60x62 MCC855 MCC955 Dual J-K Flip Flop (2K Pullup Resistor) 45N 60x62 MCC856 MCC956 Dual J-K Flip Flop (2K Pullup Resistor) 45N 60x62 MCC857 MCC957 Quad 2-input Buffer 14P 44x49 MCC858 MCC958 Quad 2-Input NAND Power Gate 14P 44x49 MCC861 MCC961 Exp. Dual 4-Input NAND Gate (2K Pullup) 18N 38x39 MCC862 MCC962 Triple 3-Input NAND Gate 83N 39x41 MCC863 MCC963 Triple 3-Input NAND Gate (2K Pullups) 83N 39x41 MCC1800 MCC1900 Dual 6-Input NAND Gate 62C 34x35 MCC1801 MCcC1901 Dual 5-Input NAND Gate (2K Pullups) 62C 34x35 MCC1802 McC1902 Exp. 8-Input NAND Gate 62C 34x35 MCC1803 MCC1903 Exp. 8-Input NAND Gate (2K Pullups) 62C 34x35 MCC1804 MCC1904 10-Input NAND Gate 62C 34x35 MCC1805 MCC1905 10-Input NAND Gate (2K Pullup Resistor) 62C 34x35 MCC1806 MCC1906 Quad 2-input AND Gate 7DM 46x48 MCC1807 McCC1907 Quad 2-Input AND Gate (2K Pullup Resistor) 7DM 46x48 MCC1808 MCC1908 Quad 2-Input OR Gate 7DM 46x48 MCC1809 MCC1909 Quad 2-Input OR Gate (2K Pullup Resistor) 70M 46x48 MCC1810 MCC1910 Quad 2-Input NOR Gate 7DM 46x48 MCC1811 MCC1911 Quad 2-Input NOR Gate (2K Puilup Resistor) 7DM 46x48 Mcc1812 MCCc1912 Quad 2-Input Exclusive OR Gate 2AB 48x53 McCC1813 MCC1913 Quad Latch 16C 74x57 McC1814 MCC1914 Quad Latch 16C 74x57 MCC1818 MCC1918 Quad 2-Input NAND Gate 98M 40x41 MCC1820 High Voltage Hex Inverter 4AE 42x50 7-39ATT LVLVLTTTTTEPET TTT TTT MDTL MCC830/930 Series FEV ULV ELUTE TTT NTT MCC830/MCC930 Expandable Dual 4-Input NAND Gate 38 x 39 (18N) PIN CONNECTIONS 4 3 (1) 1 (1) iA 6 (8) (7)* 2 (1) 4 (1) 5 1 3 yo9 14 (1) 10 UL . 42 1 8 (8) (7) (1) 13 13 "4 6=1- 2-4-5. (3) 10 1 12 * Applies to MC861/MC961 Voc = Pin 14 GND = Pin? MCC831/MCC931 Clocked Flip Flop 55 x 55 (56H) PIN CONNECTIONS 3 Le | 3-{s s 2 1 Sy Ys ~P ate oCP__oir 14 12[Cy c 4 9 17-2 Cp ~___I 12 Vec = Pin 14 GND =Pin7 All dimensions are in mils. 7-40