TLEGF1100D(VA1-T11 - Toshiba America Electronic Components, Inc.

TLEGF1100D(T11

LED Lamps InGaN

TLEGF1100D(T11

1. Applications

Applications

• General Lighting

• Backlighting

• Pilot Lamps

2. Features

Features

(1) Size: 3.2 (L) mm × 2.9 (W) mm × 1.9 (H) mm

(2) Luminous intensity: IV = 1100 mcd (typ.) @IF = 20 mA

(3) Emitting material: InGaN

(4) Color: Green

(5) High heat-resistant type: Topr/Tstg = -40 to 100

(6) Designed to be mounted with automatic pick-and-place equipment

(7) Reflow soldering is possible

(8) Standard embossed tape packing: 4-mm pitch: T11 type (2,000 pcs/reel), 8-mm tape/reel

3. Packaging and Internal Circuit

Packaging and Internal Circuit

1: Anode

2: Cathode

4-3V1S

2012-02-24

Rev.1.0

TLEGF1100D(T11

4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a = 25

= 25

= 25



)

)

Characteristics

Forward current (DC)

Reverse voltage

Power dissipation

Operating temperature

Storage temperature

Symbol

Topr

Tstg

Note

See Fig. 4.1

Max

126

-40 to 100

Unit



Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Fig.

Fig. 4.1

4.1

4.1 Forward Current Derating, I

Forward Current Derating, I

Forward Current Derating, IF

F - T

- T

- Ta

5. Handling Precautions

Handling Precautions

• ESD withstand voltage according to MIL STD 883D, Method 3015.7: ≥ 1000 V

When handling this LED, take the following measures to prevent the LED from being damaged or

otherwise adversely affected.

1. Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.

2. Operators handling laser diodes must be grounded via a high resistance (about 1 MΩ). A conductive

strap is good for this purpose.

3. Ground all tools including soldering irons.

• Since this product is intended to be used for display lighting, the measurement standard is based on the

spectral sensitivity of the human eye. It is not intended to be used for any applications other than display

lighting (e.g., sensors and light communications systems.)

2012-02-24

Rev.1.0

TLEGF1100D(T11

6. Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, Ta

a = 25

= 25

= 25



)

)

Characteristics

Forward voltage

Reverse current

Symbol

Note Test Condition

IF = 20 mA

VR = 5 V

Min

2.7



Typ.

3.4



Max

4.2

Unit

µA

7. Optical Characteristics (Unless otherwise specified, T

Optical Characteristics (Unless otherwise specified, T

Optical Characteristics (Unless otherwise specified, Ta

a = 25

= 25

= 25



)

)

Characteristics

Luminous intensity (on-axis)

Peak emission wavelength

Spectral line half width

Dominant wavelength

Symbol

λP

∆λ

λd

Note

See Table 7.1

Test Condition

IF = 20 mA

Min

500



518

Typ.

1100

518

528

Max

2500



538

Unit

mcd

Table

Table 7.1

7.1

7.1 Luminous Intensity Rank (Note)

Luminous Intensity Rank (Note)

Rank

UA2

VA1

VA2

WA1

WA2

XA1

Test Condition

IF = 20 mA, Ta = 25

Luminous Intensity (Min)

500

630

800

1000

1250

1600

Luminous Intensity (Max)

800

1000

1250

1600

2000

2500

Unit

mcd

Note: This LED lamp is sorted into luminous intensity ranks shown above. Each reel includes the same rank LEDs.

Let the delivery ratio of each rank be unquestioned.

Rank notations:The luminous intensity ranks are printed on labels as shown below:

Example: UA2

UA2: Luminous intensity rank

2012-02-24

Rev.1.0

TLEGF1100D(T11

8. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 8.1

8.1

8.1 I

F - V

- V

- VF

FFig.

Fig.

Fig. 8.2

8.2

8.2 Relative Luminous Intensity - I

Relative Luminous Intensity - I

Relative Luminous Intensity - IF

Fig.

Fig. 8.3

8.3

8.3 Relative Luminous Intensity - T

Relative Luminous Intensity - T

Relative Luminous Intensity - Ta

aFig.

Fig.

Fig. 8.4

8.4

8.4 Wavelength Characteristic

Wavelength Characteristic

Fig.

Fig. 8.5

8.5

8.5 Radiation Pattern

Radiation Pattern

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2012-02-24

Rev.1.0

TLEGF1100D(T11

9. Packing

Packing

9.1.

9.1. Moisture-Proof Packing

Moisture-Proof Packing

These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid

moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air

before soldering and the device should therefore be stored under the following conditions:

• This moisture proof bag may be stored unopened within 12 months at the following conditions.

Temperature: 5 to 30

Humidity: 90% (max)

• After opening the moisture proof bag, the device should be assembled within 4 weeks in an environment of

5 to 30/60% RH or below.

• If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to

pink) or the expiration date has passed, the device should be baked in taping with reel.

After baking, use the baked device within 72 hours, but perform baking only once.

Baking conditions: 60±5, for 12 to 24 hours.

Expiration date: 12 months from sealing date, which is imprinted on the label affixed.

• Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.

Furthermore, prevent the devices from being destructed against static electricity for baking of it.

• If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not

throw or drop the packed devices.

2012-02-24

Rev.1.0

TLEGF1100D(T11

10.

10. Mounting Method

Mounting Method

10.1.

10.1. Precautions when Mounting

Precautions when Mounting

• Do not apply force to the plastic part of the LED under high-temperature conditions.

• To avoid damaging the LED plastic, do not apply friction using a hard material.

• When installing the PCB in a product, ensure that the device does not come into contact with other

cmponents.

• For this product, silicone is used as the encapsulated material. Therefore the top surface of this product is

soft. Please do not stress on the encapsulated part of LEDs to avoid affecting the reliability of the product.

When using the mounting devices, please use the picking up nozzle that does not affect the silicone resin.

10.2.

10.2. Soldering

Soldering

Following show examples of reflow soldering.

• Temperature Profile (see following figures.)

Fig.

Fig. 10.2.1

10.2.1

10.2.1 Temperature Profile for Pb Soldering

Temperature Profile for Pb Soldering

(Example)

Fig.

Fig. 10.2.2

10.2.2

10.2.2 Temperature Profile for Lead(Pb)-free

Temperature Profile for Lead(Pb)-free

Soldering (Example)

• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed

the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering

under the above conditions.

• Please perform the first reflow soldering with reference to the above temperature profile and within 4

weeks of opening the package.

• If a second reflow process is necessary, reflow soldering should be performed within 168 hours of the first

reflow under the above conditions. Storage conditions before the second reflow soldering: 30, 60% RH

(max)

• Do not perform wave soldering.

• Manual soldering with a soldering iron should meet the following conditions:

Temperature at tip of iron: 300 (max)

Soldering iron capacity: 25 W

Time: 3 seconds (max) (only once at each soldering point)

10.3.

10.3. Land Pattern Dimensions for Reference Only

Land Pattern Dimensions for Reference Only

Fig.

Fig. 10.3.1

10.3.1

10.3.1 Land Pattern Dimensions for Reference Only (Unit: mm)

Land Pattern Dimensions for Reference Only (Unit: mm)

2012-02-24

Rev.1.0

TLEGF1100D(T11

11.

11. Cleaning

Cleaning

When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed

that these solvents have no effect on semiconductor devices in our dipping test (under the recommended

conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition,

using condition and etc.

Recommended cleaning solvents

ASAHI CLEAN AK-225AES: (made by ASAHI GLASS)

KAO CLEANTHROUGH 750HS: (made by KAO)

PINE ALPHA ST-100S: (made by ARAKAWA CHEMICAL)

2012-02-24

Rev.1.0

TLEGF1100D(T11

12.

12. Tape Specifications

Tape Specifications

12.1.

12.1. Product number format

Product number format

The type of package used for shipment is denoted by a symbol suffix after the part number. The method of

classification is as below. (this method, however does not apply to products whose electrical characteristics differ

from standard Toshiba specifications)

Example: TLEGF1100D(T11

Toshiba part number: TLEGF1100D

Tape type: T11(4-mm pitch)

12.2.

12.2. Tape Dimensions

Tape Dimensions

Table

Table 12.2.1

12.2.1

12.2.1 Tape Dimensions (Unit: mm)

Tape Dimensions (Unit: mm)

Dimensions

Tolerance

1.5

+0.1/-0

1.75

±0.1

4.0

±0.1

0.3

±0.05

3.5

±0.05

1.5

±0.1

2.0

±0.05

8.0

±0.3

4.0

±0.1

2.9

±0.1

3.7

±0.1

2.3

±0.1

Fig.

Fig. 12.2.1

12.2.1

12.2.1 Tape Dimensions

Tape Dimensions

12.3.

12.3. Reel Specification

Reel Specification

12.3.1.

12.3.1. Reel Dimensions

Reel Dimensions

Fig.

Fig. 12.3.1.1

12.3.1.1

12.3.1.1 Reel Dimensions

Reel Dimensions

2012-02-24

Rev.1.0

TLEGF1100D(T11

12.3.2.

12.3.2. Tape Leader and Trailer

Tape Leader and Trailer

Fig.

Fig. 12.3.2.1

12.3.2.1

12.3.2.1 Tape Leader and Trailer

Tape Leader and Trailer

2012-02-24

Rev.1.0

TLEGF1100D(T11

12.4.

12.4. Packing Form

Packing Form

Each reel is sealed in an aluminum pack with silica gel. Packing quantity is as shown below.

• Reel: 2,000 pcs

• Carton: 10,000 pcs

12.5.

12.5. Label Format

Label Format

Label example for TLEGF1100D(T11 and label location are as shown below.

12.5.1.

12.5.1. Label Example

Label Example

Fig.

Fig. 12.5.1.1

12.5.1.1

12.5.1.1 Label Example

Label Example

12.5.2.

12.5.2. Label Details

Label Details

No. (# refer to the

above label example)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

Information for Toshiba Use

Part No.

ADD code

Lot code

Rank symbol

Storage condition after opening

Packing quantity

Key code

Country of origin

Remarks

TLEGF1100D(T11

Notation explanation

(O Assembled in Japan, sales for domestic and overseas customers

(J Assembled in overseas factory, sales for domestic customers

(T Assembled in overseas factory, sales for overseas customers

Example: 270xxxxx

Example: UA2

Use under 5 to 30/60%RH within 4 weeks

Example: 2,000 pcs

Example: 12345

Example: JAPAN

12.5.3.

12.5.3. Label Location

Label Location

Fig.

Fig. 12.5.3.1

12.5.3.1

12.5.3.1 Label Position on the Reel

Label Position on the Reel

Label Position on the Reel Fig.

Fig.

Fig. 12.5.3.2

12.5.3.2

12.5.3.2 Label Position on the Carton

Label Position on the Carton

Aluminum pack: The aluminum pack in which the reel is supplied also has the label attached to center of one side.

2012-02-24

Rev.1.0

TLEGF1100D(T11

13.

13. Internal Circuit

Internal Circuit

1: Anode

2: Cathode

Fig.

Fig. 13.1

13.1

13.1 Internal Circuit

Internal Circuit

Package Dimensions

Package Dimensions Unit: mm

Weight: 0.035 g (typ.)

Package Name(s)

TOSHIBA: 4-3V1S

Nickname: PLCC2

2012-02-24

Rev.1.0

TLEGF1100D(T11

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/

or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

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infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange

and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology

are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2012-02-24

Rev.1.0