Aluminum Electrolytic Capacitors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EEE-169 –
2. Mounting
2.1 Considerations before using
(1) Do not reuse capacitors that have been installed and energized.
(2) Capacitors may generate transient recovery voltages. In this case, discharge them using a resistor of approx. 1 kΩ.
(3) Capacitors stored for a long time may have a larger current leak.
In this case, dispose the voltage using a resistor of approx. 1 kΩ.
(4) Do not drop capacitors onto a fl oor, etc.
Do not use dropped capacitors because they may be damaged mechanically or electrically.
(5) Do not use corrupted capacitors.
If a capacitor s seal is deteriorated, then its performance will be degraded, life reduced, and/or the electrolyte
will leak.
2.2 Capacitor insertion
(1) Check the capacitor ratings (capacitance and voltage) before mounting.
(2) Check the capacitor polarity before mounting.
(3) Check the capacitor lead and hole intervals and land size before mounting.
If these intervals are different, then stress will be applied to the inside of the capacitor through its leads when they
are inserted into the board holes, leading to short-circuiting or other failures.
(4) When an automatic mounter is used, the force to clinch and fi x capacitor leads must not be excessive.
When capacitor leads are clinched and fi xed onto a circuit board, the leads may be pulled and a large force applied
to the capacitor if there are missing cogs or the gap between the clinching section and the circuit board is too small.
If this is the case, then the capacitor may break down.
For surface-mount type capacitors, if the mounting pressure is excessive, then current leaks may increase,
short-circuiting may occur, or the capacitor may break down and come off.
2.3 Manual soldering
(1) Solder capacitors under the soldering conditions (temperature and time) as described in the specifi cations or at
350 °C for three seconds or less.
(2) If the capacitor lead terminals must be pre-processed in order to align the gaps between the terminals and holes,
place them before soldering to prevent stress from being applied to the capacitor body.
(3) If it is necessary to manually remove soldered capacitors, repair them after the solder has suffi ciently melted to
prevent stress from being applied to the capacitor terminals.
(4) Do not touch the capacitor body with the soldering iron tip. Otherwise, a hole may occur on the capacitor exterior
sleeve. The sleeve may break or become damaged.
2.4 Flow soldering
(1) Do not immerse the capacitor body in a solder bath. The capacitor’s inner pressure could increase and the capacitor
will break down.
(2) Solder capacitors under the soldering conditions (temperature and time) described in the specifi cations.
(3) When soldering, do not allow other components to fall or touch the capacitors.
When soldering, if resistors, ceramic capacitors, or other components (with a high heat conductance) fall and their
lead terminals or metallic sections touch the capacitor, then local thermal stress can occur causing the capacitor’s
exterior sleeve to break down. This phenomenon is identical to short-circuiting.
(4) Prevent fl ux from adhering to anything other than the terminals.
2.5 Re ow soldering for chip capacitors
(1) Surface-mount type capacitor are exclusively for refl ow soldering. When refl ow solder is used an ambient heat condition
system such as the simultaneous use of infrared and hot-air is recommended.
✽ This system cannot be used for fl ow or dip soldering.
(2) Soldering capacitors under the soldering conditions (pre-heating, soldering temperature and time) described in the
specifi cations.
(3) Refl ow-solder only once.
If you need to apply refl ow soldering twice, then make sure to contact us.
(4) Do not reuse the installed surface-mount type capacitors.
(5) The crack on top marking might be occurred by refl ow heat stress.
But please acknowledge that it does not infl uence the reliability of the product.
(6) VPS (Vapor Phase Soldering) refl ow can cause signifi cant characteristics change and/ or mounting failure due to
deformation by acute temperature rise. VPS is acceptable provided that the process does not exceed recommended
refl ow profi le and temperature rise is less than 3degC/sec. Please contact Panasonic for detailed conditions.
2.6 Other soldering considerations
If the chip capacitor temperature becomes very high due to pre-heating or hardening of the fi xing resin, then the
capacitor exterior sleeve may shrink or crack. If capacitors are passed through a heat-curing furnace, then the ambient
temperature must be 150°C or less and the duration must be two minutes or less.
2.7 Capacitor handling after soldering
(1) Do not tilt, bring down, or twist the capacitors soldered to the printed circuit board; otherwise a torque will be generated
with the capacitor circumference as the fulcrum. As a result, a large force will be applied to the inside of the ele-
ment through the terminals and the capacitor may break down.
(2) Do not hold the capacitors soldered to the printed circuit board to carry the board; otherwise the board s entire
weight will be applied to the inside of the element through the terminals and the capacitor may break down.
(3) Do not hit the capacitors soldered to the printed circuit board with foreign objects. When stacking printed circuit
boards, do not hit the capacitors with circuit boards or other components (terminals, etc.)
03 May. 2014