PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/07102BEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
JM38510/07102BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30103B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30103BEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
JM38510/30103BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54LS112AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN54S112J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SN74LS112AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS112ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112AD OBSOLETE SOIC D 16 TBD Call TI Call TI
SN74S112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S112ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SNJ54LS112AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS112AJ ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54LS112AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S112FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S112J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
SNJ54S112W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 2
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/07102BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/07102BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
JM38510/30103B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30103BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/30103BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SN54LS112AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54S112J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74LS112AD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS112ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112AD OBSOLETE SOIC D 16 TBD Call TI Call TI
SN74S112AN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S112AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S112ANE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S112ANSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S112ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54LS112AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS112AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SNJ54LS112AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
SNJ54S112FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S112J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SNJ54S112W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS112ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LS112ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74S112ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS112ADR SOIC D 16 2500 333.2 345.9 28.6
SN74LS112ANSR SO NS 16 2000 346.0 346.0 33.0
SN74S112ANSR SO NS 16 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
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