Bluetooth™
Multi Chip Module
Key Features
• Pre-qualied Bluetooth 1.1 Module
• Multi Point Operation, 7 slaves
• RF output power class 2
• FCC and ETSI approved
• Multiple interfaces for different
applications
• UART for data (HCI interface)
• PCM for voice
• USB for voice and data (HCI interface)
• I2C interface for controlling of external
I2C devices
• Internal crystal oscillator
• HCI rmware over USB and UART
included
ROK 101 007
e
The Bluetooth trademarks are owned by Bluetooth SIG, Inc., U.S.A.
Description
ROK 101 007 is a module for implementing
Bluetooth functionality into various electronic devices.
The module consists of three major parts; a baseband
controller, a ash memory and a radio that operates in
the globally available 2.4 – 2.5 GHz free ISM band.
Both data and voice transmission is supported by the
module. Communication between the module and the
host controller is carried out using a full-speed USB
interface compliant with USB Specication 2.0 or a
UART/PCM interface. When using the USB interface,
the module appears as a USB slave device and
therefore requires no PC resources. ROK 101 007,
which is compliant with Bluetooth version 1.1, is
a Class 2 Bluetooth Module (0 dBm) and is type-
approved. The module supports all Bluetooth proles.
Suggested Applications
• Computers and peripherals
• Handheld devices and accessories
• Access points
2
ROK 101 007
Figure 1. Block Diagram.
Figure 2. Actual size of the Bluetooth Module and also showing the HW and FW stack.
0 1 2 3 cm
Radio
Baseband
HCI
voltage
regulator
antenna
interface
USB
UART
PCM
crystal
radio
flash
baseband
3
ROK 101 007
Absolute Maximum Ratings
Parameter Symbol Min Typ Max Unit
Temperature
Storage temperature TStg -30 +85 °C
Operating temperature TAmb 0 +75 °C
Power Supply
VCC VCC -0.3 +7.0 V
VCC_IO VCC_IO -0.8 +3.6 V
Digital Inputs
Input low voltage VIL -0.5 V
Input high voltage VIH VCC_IO+0.3 V
Antenna Port
Input RF power In-band 15 dBm
Out of band 15 dBm
Recommended Operating Conditions
Parameter Condition Symbol Min Typ Max Unit
Temperature
Ambient temperature, Test TAmb 0 +23 +75 °C
Power Supply
Supply Voltage VCC 3.175 3.3 7.0 V
I/O Ports Supply Voltage VCC_IO 2.7 3.3 3.6 V
Electrical Characteristics
Unless otherwise noted, the specication applies for TAmb = 0 to +75°C, VCC = 3.3 V and VSWR = 2:1.
DC Specications
Parameter Condition Symbol Min Typ Max Unit
Digital Inputs
Logical Input High Except ON signal VIH1 0.7xVCC_IO VCC_IO V
Logical Input Low Except ON & RESET# signal VIL1 0 0.3xVCC_IO V
Logical Input High ON signal only VIH2 2.0 VCC V
Logical Input Low ON signal only VIL2 0 0.4 V
RESET# Input Low RESET# signal only VRESET 0 0.4 V
Digital Outputs
Logical Output High VOH 0.9xVCC_IO VCC_IO V
Logical Output Low VOL 0 0.1xVCC_IO V
Average Current
Consumption ICC + ICC_IO
HW Shutdown state ‘ON’ is low and ‘VCC_IO’ is grounded IShw 1 µA
Idle state After HCI – reset IIdle 3.9 6 mA
Connection Master mode ICM 35 45 mA
Slave mode ICS 34 45 mA
Hold mode IHold 32 40 mA
Park mode Beacon interval 1.28s IPark 32 40 mA
Sniff mode Sniff interval 1.28s ISniff 32 40 mA
Page Scan Mandatory page scan mode IPSM 39 52 mA
Inquiry mode IISM 37 52 mA
4
ROK 101 007
Parameter Condition Symbol Min Typ Max Unit
Timing Performance
System start-up time 400 ms
from power on
RESET# signal duration Sink current > 1 mA 1 ms
Firmware timer resolution 6.55 ms
PCM Timing Information
PCM clock frequency Master mode fPCM_CLK 2000 kHz
Slave mode fPCM_CLK 128 2000 kHz
PCM sample rate sync. fPCM_SYNC 8 kHz
frequency
PCM clock high period tCCH 200 ns
PCM clock low period tCCL 200 ns
PCM_SYNC (setup) to tPSS 100 1000 ns
PCM_CLK (fall)
PCM_SYNC pulse length tPSH 200 460 ns
PCM_X in (setup) to PCM_CLK (fall) tDSL 100 ns
PCM_X in (hold) from PCM_CLK (fall) tDSH 100 ns
PCM_X in out valid from PCM_CLK (rise) tPDLP 150 ns
RF Specications
Parameter Condition Symbol Min Typ Max Unit
General
Antenna load 50 Ω
Transmitter Performance
TX power -6 +2 +4 dBm
Spurious emissions 30 MHz – 1 GHz -36 dBm
TX mode 1 GHz – 12.75 GHz -30 dBm
1.8 GHz – 1.9 GHz -47 dBm
5.15 GHz – 5.3 GHz -47 dBm
Receiver Performance (BER ≤ 0.1%)
Sensitivity level -77 -71 dBm
Max input level 0 +13 dBm
Spurious Emissions 30 MHz – 1 GHz -74 -57 dBm
RX mode 1 GHz - 12.75 GHz -60 -47 dBm
Out-of-band blocking 30-1910 MHz +4 dBm
1910-2000 MHz -10 dBm
2000-2399 MHz -27 dBm
2484-3000 MHz -27 dBm
3000-12750 MHz -10 dBm
MSB MSB-1 MSB-2
PCM_CLK
PCM_SYNC
PCM_X in
PCM_X out
tPSS
tPSH
tDSL
tDSH
tPDLP
MSB MSB-1 MSB-3MSB-2
Figure 3. PCM timing.
5
ROK 101 007
Pin Description
Pin Pin Name Type Direction Description
A1 PCM_IN CMOS In PCM data, see note 1
A2 PCM_OUT CMOS Out PCM data, see note 1
A3 PCM_SYNC CMOS In/Out Sets the PCM data sampling rate, see note 1
A4 PCM_CLK CMOS In/Out PCM clock that sets the PCM data rate, see note 1
A5 RXD CMOS Input RX data to the UART
A6 RTS CMOS Input Flow control signal, Request To Send data from UART, see note 1
B1 D+ CMOS In/Out USB data pin
B2 D- CMOS In/Out USB data pin
B3 GND Power Power Signal ground
B4 WAKE_UP CMOS Output Indicates that the module wants to be attached to the USB. Active High.
B5 TXD CMOS Output TX data from the UART
B6 CTS CMOS Output Flow control signal, Clear To Send data from UART
C1 DETACH CMOS Input Indicates that the USB host wants to detach the module. Active High.
C2 ON Power Input When tied to VCC, the module is enabled.
C3 I2C_CLK CMOS Output I2C clock signal
C4 VCC_IO Power Power External supply rail to the Input / Output ports
C5 NC - - Do not connect
C6 VCC Power Power Supply Voltage
R1 GND Power Power Signal ground
R2 GND Power Power Signal ground
R3 RESET# CMOS Input Active low reset, see note 2
R4 NC - - Do not connect
R5 NC - - Do not connect
R6 NC - - Do not connect
T1 GND Power Power Signal Ground
T2 ANT RF In/Out 50 Ω Antenna connection
T3 GND Power Power Signal Ground
T4 NC Power Power Test point, internal voltage regulator - Do not connect
T5 NC - - Do not connect
T6 I2C_DATA CMOS In/Out I2C data signal
Notes
1. 100 kΩ pull-up resistors to VCC_IO are used on the module. PCM signals direction is programmable.
2. RESET# signal must be fed from an open drain output.
T R C B A
6
5
4
3
2
1
Figure 4. Pinout drawing.
6
ROK 101 007
Figure 5. Mechanical dimensions.
Mechanical Specication
2.95 max
without solder balls
Pad size: 35 mil = 0.889 mm
Tolerance on placement: 0.02 mm
approx 0.2 mm
Detail A
Detail A
16.8 0.2
0.54 0.2
Co-planarity 0.1 mm
9.47
32.8 0.2
14.1 0.2
7.85 0.2
1.6 0.2
15.7 0.2
14.1 0.2
7.85 0.2
5.05 0.2
TRCB A
6
1
2
3
4
5
5.72
6.98
22.22
23.5
24.76
1.6 0.2
3.12
4.39
5.66
6.93
8.2
7
ROK 101 007
Figure 6. Simplied Block Diagram.
Radio
Baseband
HCI
Figure 7. HW/FW parts included in the Ericsson Buetooth
module.
Functional Description
The ROK 101 007 is a complete Bluetooth module that
has been specied and designed according to the Bluetooth
System v1.1. Its implementation is based on a high-
performance integrated radio transceiver (PBA 313 01/3),
a baseband controller, a ash memory and surrounding
secondary components.
ROK 101 007 has ve major operational blocks. Figure 6
illustrates the interaction of the various blocks. The func-
tionality of each block is as follows:
1. Radio functionality is achieved by using the Bluetooth
Radio, PBA 313 01/3.
2. The baseband controller is an ARM7-Thumb based
chip that controls the operation of the radio trans-
ceiver via one of the interface methods; USB or
UART. Additionally, the baseband controller has a
PCM Voice interface and I2C interface.
3. A Flash memory is used together with the baseband
controller. Please, refer also to the Firmware section.
4. The power management block regulates and lters
the supply voltage.
5. The internal clock frequency is 13 MHz and is
generated from a crystal oscillator.
ANT
T2
FLASH
Memory
13MHz
Crystal
Voltage
Regulation
GND
B3
R1
R2
T1
C6 VCC
C4 VCC_IO
C2 ON
RESET#
POR
NC
NC
NC
NC
NC
R4
R5
R6
T4
T5
T6
C3
ADDR
DATA
CTRL
R3
C5 NC
PBA 313 01/3
Baseband
TXD
RTS
RXD
CTS
A5
A6
B5
B6
UART
PCM_OUT
PCM_CLK
PCM_IN
PCM_SYNC
A1
A2
A3
A4
PCM T3
GND
GND
GND
GND
I2C_DATA
I2C_CLK
NC
NC
NC
NC
R5
R6
T4
T5
USB
WAKE_UP
D-
DETACH
D+
C1
B4
B1
B2
2
4
3
1
5
Bluetooth Module stack
The Host Controller Interface (HCI) handles the
communication by the transport layer through the UART
or USB interface with the host. The Baseband and radio
provides a secure and reliable radio link for higher layers.
The following sections describe the Bluetooth module
stack in more detail, see also gure 7. It is implemented
in accordance with and complies with the Specication
of the Bluetooth System v1.1.
Bluetooth Radio Interface
The Bluetooth module is a class 2 device with 4 dBm
maximum output power with no power control needed.
Nominal range of the module with a typical antenna is up
to a range of 10 m (at 0 dBm). It is compliant with FCC
and ETSI regulations in the ISM band.
Baseband
Bluetooth uses an ad-hoc net structure with a maximum
of eight active units in a single piconet. By default the
rst unit setting up a connection is the master of the
link. (See Application Note 1/1522-ROK 101 007 Uen.)
The master transmits in the even timeslots and the
slave transmits in the odd timeslots. For full duplex
transmission, a Time-Division Duplex (TDD) scheme is
8
ROK 101 007
Table 1: Link Control Packets Table, ACL Packets Table,
SCO packets.
Figure 8. Link manager.
used. Packets are sent over the air in timeslots with a
nominal length of 625 µs. A packet can be extended
to a maximum of 5 timeslots (DM5 and DH5 packets)
and is then sent by using the same RF channel for the
entire packet. Two types of connections are provided,
Asynchronous Connectionless Link (ACL) for data and
the Synchronous Connection Oriented Link (SCO) for
voice. Three 64 kb/s voice channels can be supported
simultaneously. Furthermore, there are also packets used
for link control purposes. A variety of different packet
types with error correction schemes and data rates
can be used over the air interface, see table 1. Also
asymmetric communication is available for high-speed
communication in one direction. The Baseband provides
the link setup and control routines for the layers
above. Furthermore, the Baseband also provides
Bluetooth security like encryption, authentication and key
management. Please refer to the Specication of the
Bluetooth System v1.1 part B for in-depth information
regarding the Baseband.
Firmware (FW)
The module includes rmware for the host controller
interface, HCI, and the link manager, LM. The FW resides
in the Flash and is available in object code format. The
module supports Device Firmware Upgrade (DFU) over
UART or USB. An Application Note, 3/1522-ROK 101 007
Uen, describing the ash procedure is available.
User Payload Symmetric Asymmetric
Type (bytes) FEC CRC Max. rate Max.rate
ID na na na na na
NULL na na na na na
POLL na na na na na
FHS 18 2/3 yes na na
Link control packets
Asymmetric
Payload User Symmetric Max rate (kb/s)
Header Payload Max. rate
Type (bytes) (bytes) FEC CRC (kb/s) Forward Reverse
DM1 1 0-17 2/3 yes 108.8 108.8 108.8
DH1 1 0-27 no yes 172.8 172.8 172.8
DM3 2 0-121 2/3 yes 258.1 387.2 54.4
DH3 2 0-183 no yes 390.4 585.6 86.4
DM5 2 0-224 2/3 yes 286.7 477.8 36.3
DH5 2 0-339 no yes 433.9 723.2 57.6
Aux1 1 0-29 no no 185.6 185.6 185.6
ACL packets
Symmetric
Payload header User Payload Max. rate
Type (bytes) (bytes) FEC CRC (kb/s)
HV1 na 10 1/3 no 64.0
HV2 na 20 2/3 no 64.0
HV3 na 30 no no 64.0
DV 1D 10+(0-9) D 2/3 D Yes D 64.0+57.6 D
SCO
p
ackets
Link Manager (LM)
The Link Manager in each Bluetooth module can
communicate with another Link Manager by using the
Link Manager Protocol (LMP) which is a peer to peer
protocol, see gure 8. The LMP messages have the
highest priority and are used for link-setup, security,
control and power saving modes. The receiving Link
Manager lters out the message and does not need to
acknowledge the message to the transmitting LM due
to the reliable link provided by the Baseband and the
radio. LM to LM communication can take place without
actions taken by the host. Discovery of features at other
Bluetooth enabled devices nearby can be found and
saved for later use by the host. Please refer to the
Specication of the Bluetooth System v1.1 part C for
in-depth information regarding the LMP.
Host Control Interface (HCI)
The HCI provides a uniform command I/F to the
Baseband and Link Manager and also to HW status
registers. The HCI I/F is accessed through UART or USB.
There are three different types of HCI packets:
• HCI command packets – from host to Bluetooth
module HCI.
• HCI event packets – from Bluetooth module HCI to
host.
• HCI data packets – going both ways.
It is not necessary to make use of all different commands
and events for an application. If the application is aimed
at a pre-specied prole, the capabilities of such a
prole is necessary to adjust to – see Specication of
the Bluetooth System v1.1 Proles and Application Note
5/1522-ROK 101 007 Uen.
a) With the HCI UART Transport Layer on top of HCI,
the module will communicate with a host through
the UART I/F. The PCM I/F is also available for
communicating voice.
b) With the HCI USB Transport Layer on top of the HCI,
the module will communicate with a host through the
USB. Detach and Wake_up signals are also available
for notebook implementations. Please refer to the
Specication of the Bluetooth System v1.1 part H:
1-4 for in-depth information regarding the HCI and
different transport layers.
9
ROK 101 007
Module HW Interfaces
UART Interface
The UART implemented on the module is an industry
standard 16C450 and supports the following baud rates:
300, 600, 900, 1200, 1800, 2400, 4800, 9600, 19200,
38400, 57600, 115200, 230400 and 460800 bits/s. See
table 1 regarding data rates for different packet types.
128 byte FIFOs are associated with the UART. Four
signals will be provided for the UART interface. TxD &
RxD are used for data ow and RTS & CTS are used
for ow control. Please refer to the Specication of the
Bluetooth System v1.1 part H: 4 regarding the HCI and
UART transport layers.
USB Interface
The module is a USB full-speed class device (12 Mbps)
that has the full functionality of a USB slave and is
compliant to the USB 2.0 specication (If VCC_IO >
3.11 V). Data transfer occurs on the bi-directional ports,
D+ & D-. Additionally, there are two side band signals for
a notebook application. Two side band signals, Wake_up
and Detach, are used to control the state from which
the notebook resumes. When the host is in a power
down mode, Wake_up wakes the host up when the
Bluetooth system receives an incoming connection.
The host indicates that it is in Suspend mode by
using the Detach signal. See Application Note 2/1522-
ROK 101 007 Uen.
PCM Voice Interface
The standard PCM interface has a sample rate of 8 kHz
(PCM_SYNC). The PCM clock is variable between
200 kHz and 2.0 MHz. The PCM data can be linear PCM
(13-16 bit), µ-Law (8 bit) or A-Law (8 bit). The PCM I/F
can be either master or slave providing or receiving the
PCM_SYNC, see gure 9. Redirection of PCM_OUT and
PCM_IN can be accomplished as well. Over the air the
encoding is programmable to be CVSD, A-Law or µ-Law.
Preferably the robust CVSD encoding should be used.
I2C Interface
A master I2C I/F is available on the module. This is used
to control external I2C devices. The control of the I2C
pins are performed by Ericsson specic HCI commands
available in the FW implementation. See Application Note
4/1522-ROK 101 007 Uen.
Antenna
The ANT pin should be connected to a 50 Ω antenna
interface, thereby supporting the best signal strength
performance, VSWR should not be higher than 2:1.
Ericsson Microelectronics can recommend application
specic antennas.
MSB MSB-1 MSB-2
PCM_CLK
PCM_SYNC
PCM_X in
PCM_X out
tPSS
tPSH
tDSL
tDSH
tPDLP
MSB MSB-1 MSB-3MSB-2
Figure 9. PCM timing.
10
ROK 101 007
Design Guidelines
Power-up Sequence
There is no need for a power up sequence if VCC, ON
and VCC_IO are tied together. A power up sequence, if
used, shall be applied accordingly:
Connection of the supply rails, GND and then VCC; then
the ON signal should be applied in order to initiate the
internal regulators; and nally the VCC_IO supply rail
can be activated, see gure 10 and table 2 for timing
information. The power-down sequence is similar to the
power-up procedure but in the reverse format. Therefore,
the disconnection of the signals shall be as follows:
VCC_IO, ON, VCC and nally GND.
RESET#
The assignment of the RESET# input is to generate a
reset signal to the module. During power-up the reset
signal is set low automatically so that power supply
glitches are avoided. Therefore no reset should be
required after power-up. When implementing an external
RESET#, the signal should be fed from an open drain
output.
Power
There are three inputs to the Voltage Management
section (VCC, VCC_IO, ON). VCC is the supply voltage
that is typically 3.3 V. A separate power supply rail
(VCC_IO) is provided for the I/O ports, UART, PCM and
USB. VCC_IO can either be connected to VCC or to a
dedicated supply rail, which is the same as the logical
interface of the host. The ON signal is controlling the
internal regulators on or off.
VCC
ON
VCC_IO
td_VCC_IO_o td_VCC_IO_o
ff
td_off
td_on
td
tr
tr_on
t
tf_on
Parameter Min Nom Max Unit
tr1 ms
tr_on 60 µs
tf_on 60 µs
td_on trµs
td_off µs
tdvcc_io_on td_on µs
tdvcc_io_off td_off µs
Figure 10. Power up sequence.
Table 2. Power up parameters.
Antenna
It is very important to keep the antenna output routing at
50 Ω (VSWR ≤ 2:1) all the way to the antenna in order
to maintain the radio performance listed in this data
sheet and thereby the FCC and ETSI approvals. For
the routing underneath the module, the modules ground
plane should be considered.
Shielding / EMC Requirements
The module has its own RF shielding and is approved
according to the standards by FCC and ETSI. If the
approval number is not visible on the outside when the
module is utilized in the nal product, an exterior label
must state that there is a transmitter module inside the
product.
Ground
Ground should be distributed with very low impedance
as a ground plane. Connect all GND pins to the ground
plane.
Assembly Guidelines
Solder Paste
The ROK 101 007 module is made for surface mounting
and the SSP connection pads have been formed after
printing eutectic Tin/Lead solder paste. To assembly the
module, ux must be applied at the target surface. This
can either be done by uxing the area (this is only
preferable if uxing is a part of the assembly process) or
by just printing solder paste on the pads (ux is included
in the paste). A preferred solder paste height is 127µm
(5 mil).
Soldering Prole
It must be noted that the module should not be allowed
to be hanging upside down in the reow operation. This
means that the module has to be assembled on the
side of the PCB that is soldered last. The reow process
should be a regular surface mount soldering prole (full
convection strongly preferred); the ramp-up should not
be higher than 3 °C/s and with a peak temperature
of 210-225 °C during 10-20 seconds. Max sloping rate
should not be higher than 4 °C/s (see example of reow
prole in gure 11).
Figure 11. Eutectic SnPb-solder prole.
Temperature profile
0
50
100
150
200
250
0 50 100 150 200 250
Time
(
s
)
Temperature (˚C)
max 120 s
60-125 s
183 C
10-20s
max rising 3˚C/s
max sloping 4˚C/s
11
ROK 101 007
Pad Size
It is recommended that the pads on the PCB should have
a diameter of 0.7-0.9 mm. The surface nish on the PCB
pads should be Nickel/Gold or a at Tin/Lead surface or
OSP (Organic Surface Protection).
Placement
The placement machine should be able to recognize odd
LGA combinations (all ball recognition preferred) and be
able to pick the component asymmetrically. The module
contains a at pick-area of 10 mm diameter minimum.
The centre of gravity of the module is situated a few mm
to the ‘left’ from the centre of the module - towards the
large Bluetooth radio. It is thus recommended to change
the offset in the assembly unit such that the nozzle picks
the module just ‘left’ from the gap. Experience shows
that this will result in proper assembly. The weight of the
module is typically 2.8 g.
Storage
Keep the component in its dry pack when not yet using
the reel. After removal from the dry pack ensure that the
modules are soldered onto the PCB within 48 hours.
Module marking
Each module is marked on the shield with the following
information:
1. Ericsson logotype
2. Product No with index
3. Revision state
4. Manufacturing unit code
5. Production year and week
6. Serial number
7. Bluetooth trademark
8. FCC product code
9. See manual for RTA approval
10. CE marking
Reel marking
The reel, reel box and dry pack has a label with the
following information:
1. Ericsson product number with revision
2. Customer product number with revision
3. Quantity
4. Reel-ID. (Batch No)
5. Factory code
6. Manufacturing date
7. Country of origin
8. Ericsson logotype
1-6 above is also printed in BAR-code format
Ordering Information
Package Part No.
30 SSP ROK 101 007/2
Packaging
The modules will be delivered in a tape & reel and dry
pack, protecting them from ESD and mechanical shock.
The tape width is 44 mm and the pitch is 24 mm. The
diameter of the reel is 13 inches and it contains 500
modules.
Abbreviations
ASIC - Application Specic Integrated Circuit
BER - Bit Error Rate
CMOS - Complementary Metal Oxide Semiconductor
DCE - Data Circuit terminating Equipment
HCI - Host Controller Interface
ISM - Industrial Scientic and Medical
PCB - Printed Circuit Board
PCM - Pulse Code Modulation
RX - Receive
SIG - Special Interest Group
SSP - Screen Solder Print
TX - Transmit
UART - Universal Asynchronous Receiver Transmitter
USB - Universal Serial Bus
Ericsson Microelectronics
SE-164 81 Kista, Sweden
+46 8 757 50 00
www.ericsson.com/microelectronics
For local sales contacts, please refer to our website
or call: Int + 46 8 757 47 00, Fax: +46 8 757 47 76
Preliminary Data Sheet
EN/LZT 146 66 R1A
© Ericsson Microelectronics AB, December 2001
Information given in this data sheet is believed to be accurate and reliable.
No responsibility is assumed for the consequences of its use nor for any
infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent
or patent rights of Ericsson Microelectronics. These products are sold only
according to Ericsson Microelectronics’ general conditions of sale, unless
otherwise conrmed in writing. Specications subject to change without
notice.