ROK 101 007 BluetoothTM Multi Chip Module Key Features * Pre-qualified Bluetooth 1.1 Module * Multi Point Operation, 7 slaves * RF output power class 2 * FCC and ETSI approved * Multiple interfaces for different applications * UART for data (HCI interface) * PCM for voice * USB for voice and data (HCI interface) * I2C interface for controlling of external I2C devices * Internal crystal oscillator * HCI firmware over USB and UART included Description ROK 101 007 is a module for implementing Bluetooth functionality into various electronic devices. The module consists of three major parts; a baseband controller, a flash memory and a radio that operates in the globally available 2.4 - 2.5 GHz free ISM band. Both data and voice transmission is supported by the module. Communication between the module and the host controller is carried out using a full-speed USB interface compliant with USB Specification 2.0 or a UART/PCM interface. When using the USB interface, the module appears as a USB slave device and e therefore requires no PC resources. ROK 101 007, which is compliant with Bluetooth version 1.1, is a Class 2 Bluetooth Module (0 dBm) and is typeapproved. The module supports all Bluetooth profiles. Suggested Applications * Computers and peripherals * Handheld devices and accessories * Access points The Bluetooth trademarks are owned by Bluetooth SIG, Inc., U.S.A. ROK 101 007 voltage r regulato crystal radio baseband USB flash UART PCM Figure 1. Block Diagram. HCI 0 1 2 3 cm Baseband Radio Figure 2. Actual size of the Bluetooth Module and also showing the HW and FW stack. 2 antenna interface ROK 101 007 Absolute Maximum Ratings Parameter Symbol Min Storage temperature TStg Operating temperature TAmb VCC VCC VCC_IO VCC_IO Input low voltage VIL -0.5 Input high voltage VIH Typ Max Unit -30 +85 C 0 +75 C -0.3 +7.0 V -0.8 +3.6 V Temperature Power Supply Digital Inputs V VCC_IO+0.3 V Antenna Port Input RF power In-band Out of band 15 15 dBm dBm Recommended Operating Conditions Parameter Condition Symbol Min Typ Max Unit TAmb 0 +23 +75 C Supply Voltage VCC 3.175 3.3 7.0 V I/O Ports Supply Voltage VCC_IO 2.7 3.3 3.6 V Max Unit Temperature Ambient temperature, Test Power Supply Electrical Characteristics Unless otherwise noted, the specification applies for TAmb = 0 to +75C, VCC = 3.3 V and VSWR = 2:1. DC Specifications Parameter Condition Symbol Min Typ Logical Input High Except ON signal VIH1 0.7xVCC_IO VCC_IO V Logical Input Low Except ON & RESET# signal VIL1 0 0.3xVCC_IO V Logical Input High ON signal only VIH2 2.0 VCC V Logical Input Low ON signal only VIL2 0 0.4 V RESET# Input Low RESET# signal only VRESET 0 0.4 V Digital Inputs Digital Outputs Logical Output High VOH 0.9xVCC_IO VCC_IO V Logical Output Low VOL 0 0.1xVCC_IO V Average Current Consumption ICC + ICC_IO HW Shutdown state `ON' is low and `VCC_IO' is grounded IShw 1 Idle state After HCI - reset IIdle 3.9 6 mA Connection Master mode Slave mode ICM ICS 35 34 45 45 mA mA IHold 32 40 mA Hold mode A Park mode Beacon interval 1.28s IPark 32 40 mA Sniff mode Sniff interval 1.28s ISniff 32 40 mA Page Scan Mandatory page scan mode IPSM 39 52 mA IISM 37 52 mA Inquiry mode 3 ROK 101 007 Parameter Condition Symbol Min Typ Max Unit Timing Performance System start-up time from power on RESET# signal duration Sink current > 1 mA Firmware timer resolution 400 ms 1 ms 6.55 ms PCM Timing Information PCM clock frequency Master mode Slave mode fPCM_CLK fPCM_CLK 2000 128 2000 8 kHz kHz PCM sample rate sync. frequency fPCM_SYNC kHz PCM clock high period tCCH 200 PCM clock low period tCCL 200 PCM_SYNC (setup) to PCM_CLK (fall) tPSS 100 1000 ns PCM_SYNC pulse length tPSH 200 460 ns PCM_X in (setup) to PCM_CLK (fall) tDSL 100 ns PCM_X in (hold) from PCM_CLK (fall) tDSH 100 ns PCM_X in out valid from PCM_CLK (rise) tPDLP 150 ns Symbol Min ns ns RF Specifications Parameter Condition Typ Max Unit General Antenna load 50 Transmitter Performance TX power -6 Spurious emissions TX mode +2 30 MHz - 1 GHz 1 GHz - 12.75 GHz 1.8 GHz - 1.9 GHz 5.15 GHz - 5.3 GHz +4 dBm -36 -30 -47 -47 dBm dBm dBm dBm -71 dBm Receiver Performance (BER 0.1%) Sensitivity level -77 Max input level 0 Spurious Emissions RX mode 30 MHz - 1 GHz 1 GHz - 12.75 GHz Out-of-band blocking 30-1910 MHz 1910-2000 MHz 2000-2399 MHz 2484-3000 MHz 3000-12750 MHz +13 dBm -74 -60 -57 -47 +4 -10 -27 -27 -10 dBm dBm dBm dBm dBm PCM_CLK tPSS PCM_SYNC tPSH tDSH tDSL PCM_X in MSB MSB-1 MSB-2 MSB-1 MSB-2 tPDLP PCM_X out Figure 3. PCM timing. 4 MSB dBm dBm MSB-3 ROK 101 007 Pin Description Pin Pin Name Type Direction Description A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 T1 T2 T3 T4 T5 T6 PCM_IN PCM_OUT PCM_SYNC PCM_CLK RXD RTS D+ DGND WAKE_UP TXD CTS DETACH ON I2C_CLK VCC_IO NC VCC GND GND RESET# NC NC NC GND ANT GND NC NC I2C_DATA CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS Power CMOS CMOS CMOS CMOS Power CMOS Power Power Power Power CMOS Power RF Power Power CMOS In Out In/Out In/Out Input Input In/Out In/Out Power Output Output Output Input Input Output Power Power Power Power Input Power In/Out Power Power In/Out PCM data, see note 1 PCM data, see note 1 Sets the PCM data sampling rate, see note 1 PCM clock that sets the PCM data rate, see note 1 RX data to the UART Flow control signal, Request To Send data from UART, see note 1 USB data pin USB data pin Signal ground Indicates that the module wants to be attached to the USB. Active High. TX data from the UART Flow control signal, Clear To Send data from UART Indicates that the USB host wants to detach the module. Active High. When tied to VCC, the module is enabled. I2C clock signal External supply rail to the Input / Output ports Do not connect Supply Voltage Signal ground Signal ground Active low reset, see note 2 Do not connect Do not connect Do not connect Signal Ground 50 Antenna connection Signal Ground Test point, internal voltage regulator - Do not connect Do not connect I2C data signal Notes 1. 100 k pull-up resistors to VCC_IO are used on the module. PCM signals direction is programmable. 2. RESET# signal must be fed from an open drain output. T R C B A 6 5 4 3 2 1 Figure 4. Pinout drawing. 5 ROK 101 007 Mechanical Specification 32.8 0.2 0.2 1.6 5.05 0.2 7.85 0.2 7.85 0.2 14.1 15.7 0.2 0.2 14.1 0.2 16.8 2.95 max without solder balls Detail A Co-planarity 0.1 mm 0.54 0.2 approx 0.2 mm Detail A Figure 5. Mechanical dimensions. 6 5 4 3 2 1 CBA 22.22 23.5 24.76 TR 5.72 6.98 3.12 4.39 5.66 6.93 8.2 9.47 6 0.2 0.2 1.6 Pad size: 35 mil = 0.889 mm Tolerance on placement: 0.02 mm ROK 101 007 Functional Description Bluetooth Module stack The ROK 101 007 is a complete Bluetooth module that has been specified and designed according to the Bluetooth System v1.1. Its implementation is based on a highperformance integrated radio transceiver (PBA 313 01/3), a baseband controller, a flash memory and surrounding secondary components. ROK 101 007 has five major operational blocks. Figure 6 illustrates the interaction of the various blocks. The functionality of each block is as follows: 1. Radio functionality is achieved by using the Bluetooth Radio, PBA 313 01/3. 2. The baseband controller is an ARM7-Thumb based chip that controls the operation of the radio transceiver via one of the interface methods; USB or UART. Additionally, the baseband controller has a PCM Voice interface and I2C interface. 3. A Flash memory is used together with the baseband controller. Please, refer also to the Firmware section. 4. The power management block regulates and filters the supply voltage. 5. The internal clock frequency is 13 MHz and is generated from a crystal oscillator. I2C_DATA I2C_CLK TXD RXD RTS CTS DETACH WAKE_UP D+ DPCM_IN PCM_OUT PCM_SYNC PCM_CLK C4 T6 C3 2 B5 A5 A6 B6 UART C1 B4 B1 Baseband 4 Voltage Regulation C2 Bluetooth Radio Interface The Bluetooth module is a class 2 device with 4 dBm maximum output power with no power control needed. Nominal range of the module with a typical antenna is up to a range of 10 m (at 0 dBm). It is compliant with FCC and ETSI regulations in the ISM band. Baseband Bluetooth uses an ad-hoc net structure with a maximum of eight active units in a single piconet. By default the first unit setting up a connection is the master of the link. (See Application Note 1/1522-ROK 101 007 Uen.) The master transmits in the even timeslots and the slave transmits in the odd timeslots. For full duplex transmission, a Time-Division Duplex (TDD) scheme is VCC_IO VCC ON ADDR USB 3 B2 A1 A2 A3 C6 The Host Controller Interface (HCI) handles the communication by the transport layer through the UART or USB interface with the host. The Baseband and radio provides a secure and reliable radio link for higher layers. The following sections describe the Bluetooth module stack in more detail, see also figure 7. It is implemented in accordance with and complies with the Specification of the Bluetooth System v1.1. B3 R1 DATA CTRL PCM FLASH Memory R2 T1 T3 A4 R5 R6 T4 T5 R4 R5 R6 T4 T5 C5 POR 1 T2 GND GND HCI GND GND GND NC NC NC NC NC NC NC NC NC NC Baseband Radio ANT PBA 313 01/3 5 13MHz Crystal Figure 6. Simplified Block Diagram. R3 RESET# Figure 7. HW/FW parts included in the Ericsson Buetooth module. 7 ROK 101 007 used. Packets are sent over the air in timeslots with a nominal length of 625 s. A packet can be extended to a maximum of 5 timeslots (DM5 and DH5 packets) and is then sent by using the same RF channel for the entire packet. Two types of connections are provided, Asynchronous Connectionless Link (ACL) for data and the Synchronous Connection Oriented Link (SCO) for voice. Three 64 kb/s voice channels can be supported simultaneously. Furthermore, there are also packets used for link control purposes. A variety of different packet types with error correction schemes and data rates can be used over the air interface, see table 1. Also asymmetric communication is available for high-speed communication in one direction. The Baseband provides the link setup and control routines for the layers above. Furthermore, the Baseband also provides Bluetooth security like encryption, authentication and key management. Please refer to the Specification of the Bluetooth System v1.1 part B for in-depth information regarding the Baseband. Firmware (FW) The module includes firmware for the host controller interface, HCI, and the link manager, LM. The FW resides in the Flash and is available in object code format. The module supports Device Firmware Upgrade (DFU) over UART or USB. An Application Note, 3/1522-ROK 101 007 Uen, describing the flash procedure is available. Type User Payload (bytes) FEC CRC Symmetric Max. rate Asymmetric Max.rate ID na na na na na NULL na na na na na POLL na na na na na FHS 18 2/3 yes na na Type User Payload (bytes) FEC DM1 1 0-17 2/3 DH1 1 0-27 DM3 2 0-121 DH3 2 DM5 The Link Manager in each Bluetooth module can communicate with another Link Manager by using the Link Manager Protocol (LMP) which is a peer to peer protocol, see figure 8. The LMP messages have the highest priority and are used for link-setup, security, control and power saving modes. The receiving Link Manager filters out the message and does not need to acknowledge the message to the transmitting LM due to the reliable link provided by the Baseband and the radio. LM to LM communication can take place without actions taken by the host. Discovery of features at other Bluetooth enabled devices nearby can be found and saved for later use by the host. Please refer to the Specification of the Bluetooth System v1.1 part C for in-depth information regarding the LMP. Host Control Interface (HCI) The HCI provides a uniform command I/F to the Baseband and Link Manager and also to HW status registers. The HCI I/F is accessed through UART or USB. There are three different types of HCI packets: * HCI command packets - from host to Bluetooth module HCI. * HCI event packets - from Bluetooth module HCI to host. * HCI data packets - going both ways. It is not necessary to make use of all different commands and events for an application. If the application is aimed at a pre-specified profile, the capabilities of such a profile is necessary to adjust to - see Specification of the Bluetooth System v1.1 Profiles and Application Note 5/1522-ROK 101 007 Uen. a) With the HCI UART Transport Layer on top of HCI, the module will communicate with a host through the UART I/F. The PCM I/F is also available for communicating voice. Link control packets Payload Header (bytes) Link Manager (LM) Asymmetric Max rate (kb/s) CRC Symmetric Max. rate (kb/s) Forward Reverse yes 108.8 108.8 108.8 no yes 172.8 172.8 172.8 2/3 yes 258.1 387.2 54.4 0-183 no yes 390.4 585.6 86.4 2 0-224 2/3 yes 286.7 477.8 36.3 DH5 2 0-339 no yes 433.9 723.2 57.6 Aux1 1 0-29 no no 185.6 185.6 185.6 b) With the HCI USB Transport Layer on top of the HCI, the module will communicate with a host through the USB. Detach and Wake_up signals are also available for notebook implementations. Please refer to the Specification of the Bluetooth System v1.1 part H: 1-4 for in-depth information regarding the HCI and different transport layers. ACL packets Type Payload header (bytes) User Payload (bytes) FEC CRC Symmetric Max. rate (kb/s) HV1 na 10 1/3 no 64.0 HV2 na 20 2/3 no 64.0 HV3 na 30 no no 64.0 DV 1D 10+(0-9) D 2/3 D Yes D 64.0+57.6 D SCO packets Table 1: Link Control Packets Table, ACL Packets Table, SCO packets. 8 LMP LM LC RF LM LC Physical layer Figure 8. Link manager. RF ROK 101 007 Module HW Interfaces PCM Voice Interface UART Interface The UART implemented on the module is an industry standard 16C450 and supports the following baud rates: 300, 600, 900, 1200, 1800, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400 and 460800 bits/s. See table 1 regarding data rates for different packet types. 128 byte FIFOs are associated with the UART. Four signals will be provided for the UART interface. TxD & RxD are used for data flow and RTS & CTS are used for flow control. Please refer to the Specification of the Bluetooth System v1.1 part H: 4 regarding the HCI and UART transport layers. USB Interface The module is a USB full-speed class device (12 Mbps) that has the full functionality of a USB slave and is compliant to the USB 2.0 specification (If VCC_IO > 3.11 V). Data transfer occurs on the bi-directional ports, D+ & D-. Additionally, there are two side band signals for a notebook application. Two side band signals, Wake_up and Detach, are used to control the state from which the notebook resumes. When the host is in a power down mode, Wake_up wakes the host up when the Bluetooth system receives an incoming connection. The host indicates that it is in Suspend mode by using the Detach signal. See Application Note 2/1522ROK 101 007 Uen. The standard PCM interface has a sample rate of 8 kHz (PCM_SYNC). The PCM clock is variable between 200 kHz and 2.0 MHz. The PCM data can be linear PCM (13-16 bit), -Law (8 bit) or A-Law (8 bit). The PCM I/F can be either master or slave providing or receiving the PCM_SYNC, see figure 9. Redirection of PCM_OUT and PCM_IN can be accomplished as well. Over the air the encoding is programmable to be CVSD, A-Law or -Law. Preferably the robust CVSD encoding should be used. I2C Interface A master I2C I/F is available on the module. This is used to control external I2C devices. The control of the I2C pins are performed by Ericsson specific HCI commands available in the FW implementation. See Application Note 4/1522-ROK 101 007 Uen. Antenna The ANT pin should be connected to a 50 antenna interface, thereby supporting the best signal strength performance, VSWR should not be higher than 2:1. Ericsson Microelectronics can recommend application specific antennas. PCM_CLK tPSS PCM_SYNC tPSH tDSH tDSL PCM_X in MSB MSB-1 MSB-2 MSB-1 MSB-2 MSB-3 tPDLP PCM_X out MSB Figure 9. PCM timing. 9 ROK 101 007 Design Guidelines Power-up Sequence Antenna There is no need for a power up sequence if VCC, ON and VCC_IO are tied together. A power up sequence, if used, shall be applied accordingly: Connection of the supply rails, GND and then VCC; then the ON signal should be applied in order to initiate the internal regulators; and finally the VCC_IO supply rail can be activated, see figure 10 and table 2 for timing information. The power-down sequence is similar to the power-up procedure but in the reverse format. Therefore, the disconnection of the signals shall be as follows: VCC_IO, ON, VCC and finally GND. It is very important to keep the antenna output routing at 50 (VSWR 2:1) all the way to the antenna in order to maintain the radio performance listed in this data sheet and thereby the FCC and ETSI approvals. For the routing underneath the module, the modules ground plane should be considered. RESET# The assignment of the RESET# input is to generate a reset signal to the module. During power-up the reset signal is set low automatically so that power supply glitches are avoided. Therefore no reset should be required after power-up. When implementing an external RESET#, the signal should be fed from an open drain output. Power There are three inputs to the Voltage Management section (VCC, VCC_IO, ON). VCC is the supply voltage that is typically 3.3 V. A separate power supply rail (VCC_IO) is provided for the I/O ports, UART, PCM and USB. VCC_IO can either be connected to VCC or to a dedicated supply rail, which is the same as the logical interface of the host. The ON signal is controlling the internal regulators on or off. Shielding / EMC Requirements The module has its own RF shielding and is approved according to the standards by FCC and ETSI. If the approval number is not visible on the outside when the module is utilized in the final product, an exterior label must state that there is a transmitter module inside the product. Ground Ground should be distributed with very low impedance as a ground plane. Connect all GND pins to the ground plane. Assembly Guidelines Solder Paste The ROK 101 007 module is made for surface mounting and the SSP connection pads have been formed after printing eutectic Tin/Lead solder paste. To assembly the module, flux must be applied at the target surface. This can either be done by fluxing the area (this is only preferable if fluxing is a part of the assembly process) or by just printing solder paste on the pads (flux is included in the paste). A preferred solder paste height is 127m (5 mil). Soldering Profile It must be noted that the module should not be allowed to be hanging upside down in the reflow operation. This means that the module has to be assembled on the side of the PCB that is soldered last. The reflow process should be a regular surface mount soldering profile (full convection strongly preferred); the ramp-up should not be higher than 3 C/s and with a peak temperature of 210-225 C during 10-20 seconds. Max sloping rate should not be higher than 4 C/s (see example of reflow profile in figure 11). tr VCC ON td_on td td_off tr_on t tf_on td_VCC_IO_o td_VCC_IO_o ff VCC_IO Figure 10. Power up sequence. Min Nom tr Unit 1 ms t r_on 60 s t f_on 60 s t d_on tr t d_off s max 120 s 200 100 max rising 3C/s 0 t d_on s t d_off s 183 C max sloping 4C/s 150 50 t dvcc_io_on 10-20s 250 s t dvcc_io_off Table 2. Power up parameters. 10 Max Temperature (C) Parameter Temperature profile 0 50 100 60-125 s 150 Time (s) Figure 11. Eutectic SnPb-solder profile. 200 250 ROK 101 007 Pad Size Reel marking It is recommended that the pads on the PCB should have a diameter of 0.7-0.9 mm. The surface finish on the PCB pads should be Nickel/Gold or a flat Tin/Lead surface or OSP (Organic Surface Protection). The reel, reel box and dry pack has a label with the following information: Placement The placement machine should be able to recognize odd LGA combinations (all ball recognition preferred) and be able to pick the component asymmetrically. The module contains a flat pick-area of 10 mm diameter minimum. The centre of gravity of the module is situated a few mm to the `left' from the centre of the module - towards the large Bluetooth radio. It is thus recommended to change the offset in the assembly unit such that the nozzle picks the module just `left' from the gap. Experience shows that this will result in proper assembly. The weight of the module is typically 2.8 g. Storage Keep the component in its dry pack when not yet using the reel. After removal from the dry pack ensure that the modules are soldered onto the PCB within 48 hours. Module marking Each module is marked on the shield with the following information: 1. Ericsson logotype 2. Product No with index 3. Revision state 4. Manufacturing unit code 5. Production year and week 6. Serial number 7. Bluetooth trademark 8. FCC product code 9. See manual for RTA approval 10. CE marking 1. 2. 3. 4. 5. 6. 7. 8. Ericsson product number with revision Customer product number with revision Quantity Reel-ID. (Batch No) Factory code Manufacturing date Country of origin Ericsson logotype 1-6 above is also printed in BAR-code format Ordering Information Package Part No. 30 SSP ROK 101 007/2 Packaging The modules will be delivered in a tape & reel and dry pack, protecting them from ESD and mechanical shock. The tape width is 44 mm and the pitch is 24 mm. The diameter of the reel is 13 inches and it contains 500 modules. Abbreviations ASIC BER CMOS DCE HCI ISM PCB PCM RX SIG SSP TX UART USB - Application Specific Integrated Circuit Bit Error Rate Complementary Metal Oxide Semiconductor Data Circuit terminating Equipment Host Controller Interface Industrial Scientific and Medical Printed Circuit Board Pulse Code Modulation Receive Special Interest Group Screen Solder Print Transmit Universal Asynchronous Receiver Transmitter Universal Serial Bus 11 Information given in this data sheet is believed to be accurate and reliable. No responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice. Ericsson Microelectronics SE-164 81 Kista, Sweden +46 8 757 50 00 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int + 46 8 757 47 00, Fax: +46 8 757 47 76 Preliminary Data Sheet EN/LZT 146 66 R1A (c) Ericsson Microelectronics AB, December 2001