2N5401RLRAG - ON Semiconductor

March, 2007 − Rev. 2 1Publication Order Number:

2N5401/D

2N5401

Preferred Device

Amplifier Transistors

PNP Silicon

Features

•These are Pb−Free Devices*

MAXIMUM RATINGS

Rating Symbol Value Unit

Collector − Emitter V oltage VCEO 150 Vdc

Collector − Base Voltage VCBO 160 Vdc

Emitter − Base Voltage VEBO 5.0 Vdc

Collector Current − Continuous IC600 mAdc

Total Device Dissipation @ TA = 25°C

Derate above 25°CPD625

5.0 mW

mW/°C

Total Device Dissipation @ TC = 25°C

Derate above 25°CPD1.5

12 W

mW/°C

Operating and Storage Junction

Temperature Range TJ, Tstg −55 to +150 °C

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W

Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques Reference

Manual, SOLDERRM/D. Preferred devices are recommended choices for future use

and best overall value.

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

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COLLECTOR

BASE

EMITTER

12312

BENT LEAD

TAPE & REEL

AMMO PACK

STRAIGHT LEAD

BULK PACK

TO−92

CASE 29

STYLE 1

MARKING DIAGRAM

5401

AYWW G

A = Assembly Location

Y = Year

WW = W ork Week

G= Pb−Free Package

(Note: Microdot may be in either location)

2N5401

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS

Collector−Emitter Breakdown Voltage (Note 1)

(IC = 1.0 mAdc, IB = 0) V(BR)CEO 150 − Vdc

Collector−Base Breakdown Voltage

(IC = 100 mAdc, IE = 0) V(BR)CBO 160 −Vdc

Emitter−Base Breakdown Voltage

(IE = 10 mAdc, IC = 0) V(BR)EBO 5.0 − Vdc

Collector Cutoff Current

(VCB = 120 Vdc, IE = 0)

(VCB = 120 Vdc, IE = 0, TA = 100°C)

ICBO −

−50

Emitter Cutoff Current

(VEB = 3.0 Vdc, IC = 0) IEBO − 50 nAdc

ON CHARACTERISTICS (Note 1)

DC Current Gain

(IC = 1.0 mAdc, VCE = 5.0 Vdc)

(IC = 10 mAdc, VCE = 5.0 Vdc)

(IC = 50 mAdc, VCE = 5.0 Vdc)

hFE 50

−

240

−

Collector−Emitter Saturation Voltage

(IC = 10 mAdc, IB = 1.0 mAdc)

(IC = 50 mAdc, IB = 5.0 mAdc)

VCE(sat) −

−0.2

0.5

Vdc

Base−Emitter Saturation V oltage

(IC = 10 mAdc, IB = 1.0 mAdc)

(IC = 50 mAdc, IB = 5.0 mAdc)

VBE(sat) −

−1.0

1.0

Vdc

SMALL−SIGNAL CHARACTERISTICS

Current−Gain — Bandwidth Product

(IC = 10 mAdc, VCE = 10 Vdc, f = 100 MHz) fT100 300 MHz

Output Capacitance

(VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cobo − 6.0 pF

Small−Signal Current Gain

(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hfe 40 200 −

Noise Figure

(IC = 250 mAdc, VCE = 5.0 Vdc, RS = 1.0 kW, f = 1.0 kHz) NF − 8.0 dB

1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%.

ORDERING INFORMATION

Device Package Shipping†

2N5401G TO−92

(Pb−Free) 5000 Unit / Bulk

2N5401RLRAG TO−92

(Pb−Free) 2000 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

2N5401

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Figure 1. DC Current Gain

IC, COLLECTOR CURRENT (mA)

100

150

200

0.1

h , CURRENT GAIN

0.5 2.0 3.0 100.2 0.3

1.0 5.0

TJ = 125°C

25°C

−55°C

20 30 50 100

VCE = − 1.0 V

VCE = − 5.0 V

Figure 2. Collector Saturation Region

IB, BASE CURRENT (mA)

1.0

0.1 0.5 2.0 100.2 1.0 5.0 20 50

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.005 0.01 0.02 0.05

Figure 3. Collector Cut−Off Region

VBE, BASE−EMITTER VOLTAGE (VOLTS)

VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)

, COLLECTOR CURRENT (A)μIC

103

0.10.3 0.2

102

101

100

10−1

10−2

10−3

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

IC = 1.0 mA 10 mA 30 mA 100 mA

VCE = 30 V

IC = ICES

TJ = 125°C

75°C

25°C

REVERSE FORWARD

2N5401

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Figure 4. “On” Voltages

IC, COLLECTOR CURRENT (mA)

0.4

0.6

0.7

1.0

0.2

Figure 5. Temperature Coefficients

IC, COLLECTOR CURRENT (mA)

V, VOLTAGE (VOLTS)

TJ = 25°C

VCE(sat) @ IC/IB = 10

2.5

0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100

C, CAPACITANCE (pF)

100

TJ = 25°C

Cibo

Figure 6. Switching Time Test Circuit

VR, REVERSE VOLTAGE (VOLTS)

0.9

0.8

0.5

0.3

0.1

VBE(sat) @ IC/IB = 10

0.3 3.0 30

V, TEMPERATURE COEFFICIENT (mV/ C)°θ

Figure 7. Capacitances

10.2 V

Vin

10 ms

INPUT PULSE

VBB

+8.8 V

100

5.1 k

0.25 mF

Vin 100 1N914

Vout

VCC

−30 V

3.0 k

tr, tf ≤ 10 ns

DUTY CYCLE = 1.0%

Values Shown are for IC @ 10 mA

0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 1000.3 3.0 30

2.0

1.5

1.0

0.5

−0.5

−1.0

−1.5

−2.0

−2.5

TJ = −55°C to 135°C

qVC for VCE(sat)

qVB for VBE(sat)

Cobo

1.0

2.0

3.0

5.0

7.0

0.2 0.5 1.0 2.0 5.0 10 200.3 3.0

0.7 7.0

t, TIME (ns)

1000

100

200

300

500

700

0.2 0.5 1.0 2.0 5.0 10 200.3 3.0 30 50 100 200

IC, COLLECTOR CURRENT (mA)

Figure 8. Turn−On Time

IC/IB = 10

TJ = 25°C

td @ VBE(off) = 1.0 V

VCC = 120 V

tr @ VCC = 30 V

tr @ VCC = 120 V

t, TIME (ns)

2000

100

200

300

500

700

0.2 0.5 1.0 2.0 5.0 10 200.3 3.0 30 50 100 200

IC, COLLECTOR CURRENT (mA)

Figure 9. Turn−Off Time

1000 tf @ VCC = 120 V

tf @ VCC = 30 V

ts @ VCC = 120 V

IC/IB = 10

TJ = 25°C

2N5401

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PACKAGE DIMENSIONS

TO−92 (TO−226)

CASE 29−11

ISSUE AM

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SECTION X−X

SEATING

PLANE DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.175 0.205 4.45 5.20

B0.170 0.210 4.32 5.33

C0.125 0.165 3.18 4.19

D0.016 0.021 0.407 0.533

G0.045 0.055 1.15 1.39

H0.095 0.105 2.42 2.66

J0.015 0.020 0.39 0.50

K0.500 −−− 12.70 −−−

L0.250 −−− 6.35 −−−

N0.080 0.105 2.04 2.66

P−−− 0.100 −−− 2.54

R0.115 −−− 2.93 −−−

V0.135 −−− 3.43 −−−

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION:

MILLIMETERS.

3. CONTOUR OF PACKAGE BEYOND

DIMENSION R IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN

P AND BEYOND DIMENSION K MINIMUM.

SECTION X−X

SEATING

PLANE DIM MIN MAX

MILLIMETERS

A4.45 5.20

B4.32 5.33

C3.18 4.19

D0.40 0.54

G2.40 2.80

J0.39 0.50

K12.70 −−−

N2.04 2.66

P1.50 4.00

R2.93 −−−

V3.43 −−−

STRAIGHT LEAD

BULK PACK

BENT LEAD

TAPE & REEL

AMMO PACK

STYLE 1:

PIN 1. EMITTER

2. BASE

3. COLLECTOR

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2N5401/D

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