TJ150F06M3L - Toshiba America Electronic Components, Inc.

TJ150F06M3L

MOSFETs Silicon P-Channel MOS (U-MOS)

TJ150F06M3L

1. Applications

Applications

• Relay Drivers

• Motor Drivers

2. Features

Features

(1) Low drain-source on-resistance: RDS(ON) = 4.3 mΩ (typ.) (VGS = -10 V)

(2) Low leakage current: IDSS = -10 µA (max) (VDS = -60 V)

(3) Enhancement mode: Vth = -2.0 to -3.0 V (VDS = -10 V, ID = -1 mA)

3. Packaging and Internal Circuit

Packaging and Internal Circuit

1: Gate

2: Drain (Heatsink)

3: Source

TO-220SM(W)

4. Absolute Maximum Ratings (Note) (T

Absolute Maximum Ratings (Note) (T

Absolute Maximum Ratings (Note) (Ta

a = 25

= 25

= 25



 unless otherwise specified)

unless otherwise specified)

Characteristics

Drain-source voltage

Gate-source voltage

Drain current (DC)

Drain current (pulsed)

Power dissipation

Single-pulse avalanche energy

Avalanche current

Channel temperature

Storage temperature

(Tc = 25)

(Note 1)

(Note 2)

(Note 3)

Symbol

VDSS

VGSS

IDP

EAS

IAR

Tch

Tstg

Rating

-60

-20/+10

-150

-450

300

430

-150

175

-55 to 175

Unit



Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

2012-01-13

Rev.1.0

TJ150F06M3L

5. Thermal Characteristics

Thermal Characteristics

Characteristics

Channel-to-case thermal resistance

Symbol

Rth(ch-c)

Max

0.5

Unit

/W

Note 1: Ensure that the channel temperature does not exceed 175.

Note 2: VDD = -25 V, Tch = 25 (initial), L = 26 µH, RG = 25 Ω, IAR = -150 A

Note 3: The definitions of the absolute maximum channel and storage temperatures are based on AEC-Q101.

Note: This transistor is sensitive to electrostatic discharge and should be handled with care.

2012-01-13

Rev.1.0

TJ150F06M3L

6. Electrical Characteristics

Electrical Characteristics

6.1.

6.1. Static Characteristics (T

Static Characteristics (T

Static Characteristics (Ta

a = 25

= 25

= 25



 unless otherwise specified)

unless otherwise specified)

Characteristics

Gate leakage current

Drain cut-off current

Drain-source breakdown voltage

Gate threshold voltage

Drain-source on-resistance

(Note 4)

Symbol

IGSS

IDSS

V(BR)DSS

V(BR)DSX

Vth

RDS(ON)

Test Condition

VGS = -16/+10 V, VDS = 0 V

VDS = -60 V, VGS = 0 V

ID = -10 mA, VGS = 0 V

ID = -10 mA, VGS = 10 V

VDS = -10 V, ID = -1 mA

VGS = -6 V, ID = -75 A

VGS = -10 V, ID = -75 A

Min



-60

-50

-2.0



Typ.



4.7

4.3

Max

±10

-10



-3.0

6.1

5.6

Unit

µA

mΩ

Note 4: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-

source breakdown voltage is lowered in this mode.

6.2.

6.2. Dynamic Characteristics (T

Dynamic Characteristics (T

Dynamic Characteristics (Ta

a = 25

= 25

= 25



 unless otherwise specified)

unless otherwise specified)

Characteristics

Input capacitance

Reverse transfer capacitance

Output capacitance

Switching time (rise time)

Switching time (turn-on time)

Switching time (fall time)

Switching time (turn-off time)

Symbol

Ciss

Crss

Coss

ton

toff

Test Condition

VDS = -10 V, VGS = 0 V, f = 1 MHz

See Fig. 6.2.1

Min



Typ.

12500

880

1750

465

1760

Max



Unit

Fig.

Fig. 6.2.1

6.2.1

6.2.1 Switching Time Test Circuit

Switching Time Test Circuit

6.3.

6.3. Gate Charge Characteristics (T

Gate Charge Characteristics (T

Gate Charge Characteristics (Ta

a = 25

= 25

= 25



 unless otherwise specified)

unless otherwise specified)

Characteristics

Total gate charge (gate-source plus

gate-drain)

Gate-source charge 1

Gate-drain charge

Symbol

Qgs1

Qgd

Test Condition

VDD ≈ -48 V, VGS = -10 V, ID = -150 A

Min



Typ.

420

112

Max



Unit

6.4.

6.4. Source-Drain Characteristics (T

Source-Drain Characteristics (T

Source-Drain Characteristics (Ta

a = 25

= 25

= 25



 unless otherwise specified)

unless otherwise specified)

Characteristics

Reverse drain current (DC)

Reverse drain current (pulsed)

Diode forward voltage

Reverse recovery time

Reverse recovery charge

(Note 5)

Symbol

IDR

IDRP

VDSF

trr

Qrr

Test Condition



IDR = -75 A, VGS = 0 V

IDR = -150 A, VGS = 0 V

dIDR/dt = 50 A/µs

Min



Typ.



Max

-150

-450



Unit

Note 5: Ensure that the channel temperature does not exceed 175.

2012-01-13

Rev.1.0

TJ150F06M3L

7. Marking (Note)

Marking (Note)

Fig.

Fig. 7.1

7.1

7.1 Marking

Marking

Note: A line under a Lot No. identifies the indication of product Labels.

Not underlined: [[Pb]]/INCLUDES > MCV

Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS

compatibility of Product.

The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on

the restriction of the use of certain hazardous substances in electrical and electronic equipment.

2012-01-13

Rev.1.0

TJ150F06M3L

8. Moisture-Proof Packing

Moisture-Proof Packing

This device is packed in a moisture-proof laminated aluminum bag.

8.1.

8.1. Precautions for Transportation and Storage (Note)

Precautions for Transportation and Storage (Note)

(1) Avoid excessive vibration during transportation.

(2) Do not toss or drop the packed devices to avoid ripping of the bag.

(3) After opening the moisture-proof bag, the devices should be assembled within two weeks in an

environment of 5 to 30 and RH70% or below. Perform reflow at most twice.

(4) The moisture-proof bag may be stored unopened for up to 24 months at 5 to 30 and RH90% or below.

(5) If, upon opening the bag, the moisture indicator card shows humidity of 30% or above (the color of the

30% dot has changed from blue to pink) or the expiration date has passed, the devices should be baked as

follows:

Baking conditions: 125 for 48 hours.

Note: Since the tape materials are not heat-proof, devices should be placed on either heat-proof trays or aluminum

magazines when baking.

The humidity indicator shows an approximate ambient humidity at 25.

If the ambient humidity is below 30%, the color of all the indicator dots is blue.

If, upon opening the bag, the color of the 30% dot has changed from blue to pink, the

devices should be baked before assembly.

Fig.

Fig. 8.1.1

8.1.1

8.1.1 Humidity Indicator

Humidity Indicator

2012-01-13

Rev.1.0

TJ150F06M3L

9. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 9.1

9.1

9.1 I

D - V

- V

- VDS

DS Fig.

Fig.

Fig. 9.2

9.2

9.2 I

D - V

- V

- VDS

Fig.

Fig. 9.3

9.3

9.3 I

D - V

- V

- VGS

GS Fig.

Fig.

Fig. 9.4

9.4

9.4 V

VDS

DS - V

- V

- VGS

Fig.

Fig. 9.5

9.5

9.5 R

RDS(ON)

DS(ON)

DS(ON) - I

- I

- ID

DFig.

Fig.

Fig. 9.6

9.6

9.6 R

RDS(ON)

DS(ON)

DS(ON) - T

- T

- Ta

2012-01-13

Rev.1.0

TJ150F06M3L

Fig.

Fig. 9.7

9.7

9.7 I

IDR

DR - V

- V

- VDS

DS Fig.

Fig.

Fig. 9.8

9.8

9.8 Capacitance - V

Capacitance - V

Capacitance - VDS

Fig.

Fig. 9.9

9.9

9.9 V

Vth

th - T

- T

- Ta

aFig.

Fig.

Fig. 9.10

9.10

9.10 Dynamic Input/Output Characteristics

Dynamic Input/Output Characteristics

Fig.

Fig. 9.11

9.11

9.11 P

D - T

- T

- Tc

(Guaranteed Maximum)

2012-01-13

Rev.1.0

TJ150F06M3L

Fig.

Fig. 9.12

9.12

9.12 r

rth

th/R

/Rth(ch-c)

th(ch-c)

th(ch-c) - t

- t

- tw

(Guaranteed Maximum)

Fig.

Fig. 9.13

9.13

9.13 Safe Operating Area

Safe Operating Area

(Guaranteed Maximum)

Fig.

Fig. 9.14

9.14

9.14 E

EAS

AS - T

- T

- Tch

(Guaranteed Maximum)

Fig.

Fig. 9.15

9.15

9.15 Test Circuit/Waveform

Test Circuit/Waveform

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2012-01-13

Rev.1.0

TJ150F06M3L

Package Dimensions

Package Dimensions Unit: mm

Weight: 1.07 g (typ.)

Package Name(s)

TOSHIBA: 2-10W1S

Nickname: TO-220SM(W)

2012-01-13

Rev.1.0

TJ150F06M3L

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/

or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange

and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology

are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2012-01-13

Rev.1.0