GBU6J - FAIRCHILD SEMICONDUCTOR

GBU6A - GBU6M — Bridge Rectifiers

GBU6A - GBU6M Rev. 1.2.1 1

October 2013

GBU6A - GBU6M

Bridge Rectifiers

Features

• Glass-Passi vated Junction

• Surge Overload Rating: 175 A Peak

• Reliable Low-Cost Construction Utilizing Molded

Plastic Technique

• Ideal for Printed Circuit Board

• UL Certified: UL #E258596

Ordering Informations

Absolute Maximum Ratings(1)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the re co mmen ded operating cond iti ons an d s tres si ng the parts to these levels is not re co mme nde d. In addi-

tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.

Note:

1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.

Part Number Marking Package Packing Method

GBU6A GBU6A GBU 4L Rail

GBU6B GBU6B GBU 4L Rail

GBU6D GBU6D GBU 4L Rail

GBU6G GBU6G GBU 4L Rail

GBU6J GBU6J GBU 4L Rail

GBU6K GBU6K GBU 4L Rail

GBU6M GBU6M GBU 4L Rail

Symbol Parameter Value Units

6A 6B 6D 6G 6J 6K 6M

VRRM Maximum Repetitive Reverse Voltage 50 100 200 400 600 800 1000 V

VRMS Maximum RMS Bridge Input Voltage 35 70 140 280 420 560 700 V

VRDC Reverse Voltage (Rated VR) 50 100 200 400 600 800 1000 V

IF(AV) Average Recitified Forwa rd Curren t TA = 100°C6.0 A

IFSM Non-Repetitive Peak Forward Surge Current

8.3 ms Single Half-Sine-Wave 175 A

TSTG Storage Temperature Range -55 to +150 °C

TJOperating Junction Temperature -55 to +150 °C

+~~-

GBU

GBU6A - GBU6M — Bridge Rectifiers

GBU6A - GBU6M Rev. 1.2.1 2

Thermal Characteristics

Values are at TA = 25°C unless otherwise noted.

Notes:

2. Device mounted on PCB with 0.5 x 0.5 inch (12 x 12 mm ).

3. Device mounted on Al plate with 2.6 x 1.4 x 0.06 inch (6.5 x 3.5 x 0.15 cm).

Electrical Characteristics

Values are at TA = 25°C unless otherwise noted.

Symbol Parameter Value Units

PDPower Dissipation 12 W

RθJA Thermal Resistance per Leg, Junction to Ambient(2) 18.6 °C/W

RθJL Thermal Resistance per Leg, Junction to Lead(3) 3.1 °C/W

Symbol Parameter Value Units

VFForward Voltage, per Element 6.0 A 1.0 V

IRReverse Current, per Element at Rated VRTA = 25°C5.0μA

TA = 125°C500 μA

I2t I2t Rating for Fusing t < 8.35 ms 127 A2s

GBU6A - GBU6M — Bridge Rectifiers

GBU6A - GBU6M Rev. 1.2.1 3

Typical Performance Characteristics

Figure 1. Forward Current Derating Curve Figure 2. F orward Voltage Characteristics

Figure 3. Reverse Current vs. Reverse Voltage Figure 4. Non-Repetitive Surge Current

Figure 5. Total Capacitance

0 50 100 150

Ambient Temperature [ºC]

Average Rectified Forward Current, IF [A]

MOUNTED ON PC BOARD,

TA 0.5" (12.7mm) LEAD LENGTH

60Hz RESISTIVE OR INDUCTIVE LOAD

HEAT- SINK

MOUNTING, TC

4x4x0 .15"

COPPER PLATE

0.7 0.8 0.9 1 1.1 1.2 1.3 1.4

0.1

100

Forward Voltage, VF [V]

Forward Current, IF [A]

T = 25 C

Pulse Width = 300μ

μμ

μs

1% Duty Cycle

0 20406080100120140

0.01

0.1

Percent of Rated Peak Reverse Voltage [%]

Reverse Current, IR [mA]

T = 100 C

T = 25 C

12 51020 50100

105

140

175

Number of Cycles at 60Hz

Peak Forward Surge Current, IFSM [A]

T = 105 C

1 5 10 50 100

100

400

Reverse Voltage, VR [V]

Total Capacitance, CT [pF]

T = 25 C

f = 1.0 MHz

Visg = 50m Vp-p

GBU6A - GBU6M — Bridge Rectifiers

GBU6A - GBU6M Rev. 1.2.1 4

Physical Dimension

Figure 6. 4-LEAD, GBU, THROUGH-HOLE, MOLDED PACKAGE (ACTIVE)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notic e. Please note the revision and/or date on t he drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specification s do not expand the terms of Fairchild’s worldwide ter ms and conditions, specifically the

warranty therein, which covers Fairchild produ cts.

Always visit Fairchild Semiconduct or’s online packaging are a for the most recent package drawings :

http://www.fairchildsemi.com/dwg/GB/GBU04A.pdf.

22.30

21.80

7.90

7.40 2.16

1.65

1.27

1.02

(4X)

2.54

2.16

(2X)

3.91

2.03

1.65

(2X)

2.03

1.52

3.20

45°

5.33

4.83

(3X)

1.90 TYP

~ ~

3.56

3.30

9°

TYP

9°

TYP

2.16

1.79

0.75

0.46

18.00

17.50

18.80

18.30

NOTES:

A. THIS PACKAGE DOES NOT CONFORM TO

ANY STANDARDS.

B. ALL DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS ARE EXCLUSIVE OF BURRS,

MOLD FLASH AND TIE BAR PROTRUSIONS.

E. DIMENSION AND TOLERANCE AS PER ASME

Y14.5-1994.

F. DRAWING FILE NAME: GBU04AREV1

GBU-4L

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DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE

RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE

SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,

WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE

EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain

life, and (c) whose failure to pe

rform when properly used in

accordance with instructions for use provided in the labeling, can be

reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or

system whose failure to

perform can be reasonably expected to

cause the failure of the life support device or system, or to affect its

safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,

under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their

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PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

Advance Information

Formative

In Design

Datasheet contains the design specifications for product development. Specifications may change

in any manner without notice.

Preliminary First Production

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild

Semiconductor reserves the right to make changes at any time without notice to improve design.

No Identification Needed

Full Production

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make

changes at any time without notice to improve the design.

Obsolete

Not In Production

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.

The datasheet is for reference information only.

Rev. I66