2
LM3940
SNVS114G –MAY 1999–REVISED FEBRUARY 2015
www.ti.com
Product Folder Links: LM3940
Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 8
7.1 Overview................................................................... 8
7.2 Functional Block Diagram......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 8
8 Application and Implementation .......................... 9
8.1 Application Information.............................................. 9
8.2 Typical Application.................................................... 9
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
10.3 Heatsinking ........................................................... 11
11 Device and Documentation Support................. 15
11.1 Documentation Support ........................................ 15
11.2 Receiving Notification of Documentation Updates 15
11.3 Community Resources.......................................... 15
11.4 Trademarks........................................................... 15
11.5 Electrostatic Discharge Caution............................ 15
11.6 Glossary................................................................ 15
12 Mechanical, Packaging, and Orderable
Information........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (November 2014) to Revision G Page
• Changed pin names to TI nomenclature................................................................................................................................ 1
• Deleted soldering information from Ab Max; this info is in POA ........................................................................................... 4
• Changed Handling Ratings table to ESD Ratings table; move storage temp to Ab Max ...................................................... 4
• Changed values in Input supply voltage row, ROC table ...................................................................................................... 4
• Changed ILto IOUT .................................................................................................................................................................. 5
Changes from Revision E (March 2013) to Revision F Page
• Added Device Information and Handling Rating tables, Feature Description,Device Functional Modes,Application
and Implementation,Power Supply Recommendations,Layout,Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section;
update thermal values............................................................................................................................................................ 1
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 14