© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/14
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
Description
Features
Applications
The SP3031 includes low capacitance rail to rail diodes
with an additional Zener diode to provide protection for
electronic equipment that may experience destructive
electrostatic discharges (ESD). These robust diodes can
safely absorb repetitive ESD strikes above the maximum
level specified in the IEC61000-4-2 international standard
without performance degradation. The low loading
capacitance makes it ideal for protecting high speed
datalines.
• ESD protection of ±10kV
contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Lightning protection,
IEC61000-4-5, 5A
(tp=8/20µs)
• Low capacitance of 0.8pF
@ VR=0V
• Low leakage current of
1μA at 5V
• 0402 small footprint
available
• USB 2.0, Ethernet
• MHL/MIPI/MDDI
• HDMI, Display Port,
eSATA
• Set Top Boxes, Game
Consoles
• Smart Phones
• External Storage
• Ultrabooks, Notebooks
• Tablets, eReaders
Pinout
Functional Block Diagram
1
2
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
USB2.0 Application Example
SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS
1
2
Signal GND
USB2.0 Port
SP3031 (x2)
VBUS
D+
D-
IC
USB Controller
*Package is shown as transparent
SP1003
RoHS
Pb
GREEN
Additional Information
Datasheet Samples
Resources
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/14
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
SP3031
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress only rating and operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
IPP Peak Current (tp=8/20μs) 5.0 A
TOP Operating Temperature –40 to 125 °C
TSTOR Storage Temperature –55 to 150 °C
Thermal Information
Parameter Rating Units
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
260 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 5.0 V
Reverse Breakdown Voltage VBR 1R=1mA 6.0 V
Reverse Leakage Current ILEAK VR=5V with 1pin at GND 1µA
Clamp Voltage1VC
IPP=1A, tp=8/20µs, Fwd 6.9 V
IPP=2A, tp=8/20µs, Fwd 7. 5 V
Dynamic Resistance RDYN (VC2-VC1)/(IPP2-IPP1) 0.6 Ω
ESD Withstand Voltage1VESD
IEC61000-4-2 (Contact) ±10 kV
IEC61000-4-2 (Air) ±15 kV
Diode Capacitance1CI/O-I/O Reverse Bias=0V 0.8 pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Reverse Voltage
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.01.0 2.03.0 4.05.0
Capacitance (pF)
DC Bias (V)
Insertion Loss (S21) I/O to GND
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
-5
Frequency (MHz)
-10
-15
-20
-25
0
-30
-35
10 100 1000
Attenuation (dB)
Transmission Line Pulsing(TLP) Plot
TLP Voltage (V)
TLP Current (A)
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/14
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3031-01ETG SOD882 •f 12000
Product Characteristics
Lead Plating Pre-Plated Frame or Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte nish VDI 11-13.
Part Numbering System Part Marking System
SP 3031 01 E T G
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA® Diodes)
E: SOD882
f
SOD882
Product ID
Pin 1 Indicator
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/14
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3031 Series
Embossed Carrier Tape & Reel Specification — SOD882
Package Dimensions — SOD882
Recommanded Soldering
Pad Layout
Pin 1 Location
Device OrientationinTape
Symbol Millimeters
A0 0.70±0.045
B0 1.10±0.045
K0 0.65±0.045
F3.50±0.05
P1 2.00±0.10
W8.00 + 0.30 -0.10
Symbol
Package SOD882
JEDEC MO-236
Millimeters Inches
Min Typ Max Min Typ Max
A0.90 1. 0 0 1. 10 0.035 0.039 0.043
B0.50 0.60 0.70 0.020 0.024 0.028
C0.40 0.50 0.60 0.016 0.020 0.024
D0.45 0.018
E0.20 0.25 0.35 0.008 0.010 0.012
F0.45 0.50 0.55 0.018 0.020 0.022
Notes :
1. All dimensions are in millimeters
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Littelfuse:
SP3031-01ETG