Samsung Semiconductor, Inc. Product Selection Guide System LSI August 2007 SYSTEM LSI PAGE ASIC / FOUNDRY 3 ASIC ORDERING INFORMATION 4 CMOS IMAGE SENSORS 5 LCD DRIVER ICs 5-6 LCD DRIVER IC ORDERING INFORMATION 7 MOBILE APPLICATION PROCESSORS 8 HDTV/STB PRODUCTS 9 MICROCONTROLLERS 10-14 MICROCONTROLLER ORDERING INFORMATION 15 SERIAL EEPROMS 16 ASIC/Foundry Solutions SYSTEM LSI ASIC LIBRARY For more information on Samsung's dedicated 300mm logic foundry, go to www.samsung.com/global/business/semiconductor/products/strategicfoundry Specialty SSTL2, SSTL18 LVDS USB 1.1 MDDR I/O Peripherals ARM PrimeCell Peripheral Samsung Peripheral ASIC PROCESS TECHNOLOGY Design Rule 45nm 65nm 90nm Process Technology L(D/R)4LP (=11LP) L6G (=10FS) L(D/R)6LP (=10LP) Description 45nm Low Power Process (with eDRAM/RFCMOS option) 65nm Generic Process 65nm Low Power Process 90nm Generic Process (with eDRAM/RFCMOS option) (with eDRAM option) Vth Option LVT/RVT/HVT LVT/RVT/HVT LVT/RVT/HVT RVT/AVT/LVT/eMPU sHVT/HVT/RVT/LVT Core Voltage 1.1V 1.0V 1.2V 1.0~1.2V 1.2V I/O Voltage 1.8~2.5V 1.8~3.3V 1.8~3.3V 1.8~3.3V 1.8~3.3V SRAM Bit-cell 0.29~0.359m2 0.625m2 0.54~0.676m2 0.79~1.25m2 0.79~1.25m2 eDRAM Bit-Cell 0.11m2 0.189m2 0.275m2 Standard Cell Library SS45LP (HVT/RVT/LVT) SS65G (HVT/RVT/LVT) SS65LP (HVT/RVT/LVT) SS90G (RVT/LVT) SS90LP (HVT/RVT/LVT) Raw Gate Density 1800kgate/mm2 (9 track) RA1D-0.299 RA1S-0.374 RA2 (Dual-port SRAM) RF1 (1P REGFILE) RF2 (2P REGFILE) VROM 750kgate/mm2 (9 track) RA1-0.62 RA2 (Dual-port SRAM) RF1 (1P REGFILE) RF2 (2P REGFILE) VROM SPSRAM (High-speed) 860kgate/mm2 (8 track) RA1-0.54 RA1-0.676 RA2 RF1 (1P REGFILE) RF2 (2P REGFILE) VROM SPSRAM (High-speed) UHD SPSRAM 417kgate/mm2 (9 track) VROM_HD 1.8/2.5/3.3V 40m In-line CUP 25/50 Staggered CUP 1.8/2.5/3.3V (5V tol) 50m In-line CUP 30/60 Staggered CUP 1.8/2.5/3.3V (5V tol) 50m In-line CUP 30/60 Staggered CUP 1.8/2.5/3.3V (5V tol) 50m In-line CUP 30/60 Staggered CUP 445kgate/mm2 (8 track) SPSRAM_HD DPSRAM_HD 1P-REGFILE_HD 2P-REGFILE_HD VROM_HD SPSRAM_LP DPSRAM_LP 1P-REGFILE_LP 2P-REGFILE_LP 1.8/2.5/3.3V (5V tol) 50m In-line CUP 30/60 Staggered CUP Compiled Memory GP I/O L(D)9G (=9SF) L(R)9LP (=9LP) 90nm Low Power Process (with RFCMOS option) ASIC IP Mixed Signal IP ADC DAC PLL Audio CODEC DTV AFE PMU Voltage Regulator 10bit ~ 12bit, 0.5Msps ~ 140Msps 10 ~ 12bit, 1M ~ 100Msps ~600MHz FSPLL, ~2GHz FSPLL, SSCG PLL, Pixel PLL, DLL 8~96kHz Sigma-Delta audio CODEC 12bit 150MHz ADC + A-Mux + Clamp + A-Buffer + Sync Slicer + PCG DSP IP Teak-Lite Teak Processor IP ARM7TDMI-S ARM9 Series ARM11 Series ARM11 MPCore Cortex High Speed Interface IP PCI Express USB 2.0 OTG HDMI TX MIPI SMIA SATA PHY DDR/2/3 PHY Embedded Memory IP Embedded DRAM Psudo SRAM LVDS TX/RX ASIC PROCESS DESCRIPTIONS Process L13HS L(D/F)13G L13LP L(F)18 L25 L35(H) Geometry 0.13m 0.13m 0.13m 0.18m 0.25m 0.35m ASIC ORDERING INFORMATION http://www.samsung.com/Products/Semiconductor/Support/Label_CodeInfo/ASIC.pdf AUGUST 2007 Description 1.2V High Speed Process 1.2~1.5V Generic Process (with eDRAM/Flash option) 1.5V Low Power Process 1.8V Process (with Flash option) 2.5V Process 2.5V Process (with 5V dual gate oxide option) BR-07-ALL-002 SAMSUNG SEMICONDUCTOR, INC. 3 SYSTEM LSI ASIC Ordering Information ASIC ORDERING INFORMATION S 1 6 2 X 3 X 4 X 5 1. System LSI (S) X 6 X 7 X 8 X 9 X 10 11 X 12 12~14. Package Type 2. Large Classification: ASIC (6) A : STN (Character) B : STN (Graphic) C : TFT (Large) D : TFT (Mobile) F : TFT (Midsmall) E : OELD P : PDI (DUAL) T : TCON (12)(13) Film Type A : SDIP B : BUMP BIZ 00~49 TAB C : CHIP BIZ E : LQFP 50~99 COF J : ELP K : TR N : COB Q : QFP S : SOP T : TQFP W : WAFER X : ETQFP (13) Reserved A~Z *1st Version X 9~10. Mask Option (14) Revision 1st Version X 15. Custom 0 : No Grinding 4~7. 8. Version X 15 - In Case of TAB / COF - In Case of PKG V : Process Vehicle Serial No X 14 (14) Packing (12) Package Type 3. Small Classification X 13 - PKG Option 5 : 20010um 0 : none 8 : 30010um (CHIP BIZ) 1 : 250ae10um 9 : 280ae10um 1 : Special Handling 1 2 : Special Handling 2 A : 30010um 3 : Special Handling 3 A : Test Condition 1 C : 30010um (Wafer) B : Customer Option 1 C : Customer Option 2 G : 37510um (CHIP BIZ) J : 42510um D : Customer Option 3 E : Customer Option 4 K : 40010um L : 45010um G : Customer Option 6 H : Customer Option 7 M : 47010um (Wafer) N : 47010um K : Customer Option 9 R : 35010um (Wafer) U : 61010um - STN (Character) J : Customer Option 8 00~99 : Font L : Customer Option 10 M : Customer Option 11 V : 50010um (CHIP BIZ) - STN (Graphic) N : Customer Option 12 P : Customer Option 13 W : 42510um (Wafer) X : 42510um (CHIP BIZ) Mask Option - TFT Device - WAFER Mask Option 0 : BUMP Y : 47010um (CHIP BIZ) 1 : NO BUMP Z : No Grinding (CHIP / Wafer) 11. " - " 4 SAMSUNG SEMICONDUCTOR, INC. BR-07-ALL-002 AUGUST 2007 Image Sensors / LCD Driver ICs SYSTEM LSI CMOS IMAGE SENSORS Part Number S5KA3D S5K5AA S5K4AA S5K4BAF S5K4B1F S5K4CA S5K4C1 NOTE: Type SOC SOC SOC SOC CIS SOC CIS Resol. VGA SXGA SXGA UXGA UXGA QXGA QXGA Pixels Horizontal 640 1280 1280 1600 1600 2048 2048 O/F 1/10" 1/5" 1/4" 1/4" 1/4" 1/4" 1/4" Pixels Vertical 480 1024 1024 1200 1200 1536 1536 Package wafer or die wafer or die wafer or die wafer or die wafer or die wafer or die wafer or die Production Status MP MP MP MP MP Sampling Sampling * O/F: Optical Format BW STN CHARACTER DISPLAY DRIVER IC FOR MOBILE DISPLAYS Part Number Segment S6A0031 80 S6A0032 80 S6A0065 S6A0069 40 S6A0070 80 S6A0071 60 S6A0072 40 S6A0073 60 S6A0074 80 S6A0075 100 S6A0078 120 S6A0079 120 S6A0090 64 S6A0093 80 S6A0094* 80 S6A0067 80 S6A2068 60 CGROM Common (Ch.) 8 10160 (254) 16 10160 (254) 40 16 10080 (236) 16 8320 (224) 32 8400 (240) 16 9600 (240) 34 9600 (240) 34 9600 (240) 34 9600 (240) 34 9600 (240) 34 9600 (240) 26 10240 (256) 26 10240 (256) 34 21760 (544) 16 8320 (224) CGRAM (Ch.) 80 (2) 80 (2) Interface (Bits) 4/8 4/8 512 (8) 512 (8) 512 (8) 160 (4) 512 (8) 512 (8) 512 (8) 512 (8) 512 (8) 160 (4) 320 (8) 80 (6) 4/8 4/8 4/8 1/4/8 1/4/8 1/4/8 1/4/8 1/4/8 1/4/8 1/4/8 1/4/8 1/4/8 512 (8) 4/8 NOTES: Devices marked with an asterisk (*) are under development. TCP (Tape Carrier Package) AUGUST 2007 VDD (V) 2.4~5.5 2.4~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.4~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.7~5.5 2.4~5.5 2.4~5.5 2.2~3.6 2.7~5.5 2.7~5.5 Vlcd (Max V.) 6 6 13 13 10 13 11 13 13 13 13 13 11 6 7 10 10 DC/DC Convert (Times) 2~3 2 2~3 2~3 2~3 2~3 2~3 2~3 4 4 Package Au bump chip Au bump chip Bare die/64QFP Bare die/80QFP Bare die/Au bump chip Au bump chip/TCP Au bump chip Bare die Bare die Bare die Bare die/TCP Bare die Au bump chip/TCP Au bump chip/TCP Au bump chip Bare die/100QFP Bare die Bare die is equivalent term with bare chip, pellet or die. COF (Chip On Film) is available in case of TCP. BR-07-ALL-002 SAMSUNG SEMICONDUCTOR, INC. 5 SYSTEM LSI LCD Driver ICs BW STN GRAPHIC DISPLAY DRIVER IC FOR MOBILE DISPLAYS Part Number S6B0107 S6B0086 S6B0715 S6B0717 S6B0718 S6B0719 S6B0723 S6B0724 S6B0725 S6B0728 S6B0741 S6B0755 S6B0756 S6B0759 S6B2400 S6B0794 S6B0796 S6B1713 Segment 100 100 104 160 132 132 104 132 128 128 96 128 96 160 240 132 Common 64 80 33 55 81 105 65 65 65 128 129 65 65 81 65 160 240 65 Interface (Bits) 1/1 1/4 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 1/8 4/8 4/8 1/8 DDRAM (Bits) 8580 6500 9256 16800 8580 8580 6860 16896 33024 8320 6240 10368 12480 8580 Vlcd (Max V.) 17 28 15 15 15 15 15 15 15 15 15 15 12 15 12 32 32 15 VDD (V) 4.5~5.5 2.7~5.5 2.4~5.5 2.4~5.5 2.4~3.6 2.4~3.6 2.4~5.5 2.4~5.5 2.4~3.6 2.4~3.6 1.8~3.3 1.8~3.3 1.8~3.3 1.8~3.3 1.8~3.3 2.4~5.5 2.4~5.5 2.4~5.5 NOTES: Bare die is equivalent term with bare chip, pellet or die. TCP (Tape Carrier Package) DC/DC Convert (Times) 2~4 2~5 3~6 3~6 2~5 2~5 2~5 3~7 3~6 3~5 2~4 3~6 3~5 Package Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP TCP Au bump chip Au bump chip Au bump chip/TCP TCP Au bump chip/TCP Au bump chip Au bump chip/TCP Au bump chip Au bump chip/TCP Au bump chip/TCP Au bump chip/TCP 2~5 COF (Chip On Film) is available in case of TCP. COLOR STN GRAPHIC DISPLAY DRIVER IC FOR MOBILE DISPLAYS Device Name Segment S6B33A1 132 S6B33A2 128 S6B33B0 144 S6B3300* 104 Common 160 129 177 80 Color Depth 256/4k 256/4k 256/4k/65k 256/4k NOTES: Devices marked with an asterisk (*) are under development. COF (Chip On Film) is available in case of TCP. DDRAM (Bits) 266,112 196,608 405,504 99,840 Vlcd (Max V.) 20 20 20 15 VDD (V) 1.8~3.6 1.8~3.3 1.8~3.3 1.8~3.3 TCP (Tape Carrier Package) DC/DC Convert (Times) 2, 3; -1; 2 1, 1.5; -3; 2 1, 1.5; -3; 2 1, 1.5; -3; 2 Package Au bump chip Au bump chip Au bump chip Au bump chip Bare die is equivalent term with bare chip, pellet or die. COLOR STN GRAPHIC DISPLAY DRIVER IC FOR MOBILE DISPLAYS Part Number S6D0110 S6D0114 S6D0117 S6D0118 S6D0123 S6D0129 RGB 132 132 132 176 132 240 Gate 176 176 132 240 176 320 NOTES: TCP (Tape Carrier Package) 6 SAMSUNG SEMICONDUCTOR, INC. Color Depth 260K 260K 260K 260K 260K 260K Bit Map Area (RAM) 132*18*176 132*18*176 132*132*18 176*18*240 132*18*176 240*18*320 VCI (V) 2.5~3.3 2.5~3.3 2.5~3.3 2.5~3.3 2.5~3.3 2.5~3.3 Vlcd (Max V.) 25V Max 25V Max 25V Max 25V Max 25V Max 30V Max Package Au bumped chip Au bumped chip Au bumped chip Au bumped chip Au bumped chip Au bumped chip COF (Chip On Film) is available in case of TCP BR-07-ALL-002 AUGUST 2007 LCD Driver IC Ordering Information SYSTEM LSI LCD DRIVER IC ORDERING INFORMATION S 1 6 2 X 3 X 4 X 5 X 6 X 7 X 8 1. System LSI (S) 11. " - " 2. Large Classification: LDI (6) 12~14. Package Type X 9 X 10 11 X 12 X 13 X 14 X 15 (14) Packing - In Case of TAB / COF (12)(13) Film Type - In Case of PKG 3. Small Classification A : SDIP B : BUMP BIZ E : LQFP A : STN (Character) B : STN (Graphic) C : CHIP BIZ C : TFT (Large) D : TFT (Mobile) J : ELP K : TR F : TFT (Midsmall) E : OELD N : COB Q : QFP P : PDI (DUAL) T : TCON S : SOP T : TQFP W : WAFER X : ETQFP V : Process Vehicle 4~7. (13) Reserved Serial No. *1st Version 9~10. Mask Option - STN (Character) 00~99: Font - STN (Graphic) Mask Option - TFT Device Mask Option AUGUST 2007 X COF (14) Revision 1st Version X 15. Back Lap 1 : 25010um 5 : 20010um 0 : none A~Z TAB 50~99 0 : No Grinding - PKG Option 8. Version 00~49 8 : 30010um (CHIP BIZ) 9 : 28010um 1 : Special Handling 1 2 : Special Handling 2 A : 30010um 3 : Special Handling 3 A : Test Condition 1 C : 30010um (Wafer) B : Customer Option 1 C : Customer Option 2 G : 37510um (CHIP BIZ) J : 42510um D : Customer Option 3 E : Customer Option 4 K : 40010um L : 45010um G : Customer Option 6 H : Customer Option 7 M : 47010um (Wafer) N : 47010um J : Customer Option 8 K : Customer Option 9 R : 35010um (Wafer) U : 61010um L : Customer Option 10 M : Customer Option 11 V : 50010um (CHIP BIZ) N : Customer Option 12 P : Customer Option 13 W : 42510um (Wafer) X : 42510um (CHIP BIZ) - WAFER Y : 47010um (CHIP BIZ) 0 : BUMP 1 : NO BUMP BR-07-ALL-002 Z : No Grinding (CHIP / Wafer) SAMSUNG SEMICONDUCTOR, INC. 7 SYSTEM LSI Application Processors MOBILE APPLICATION PROCESSORS Part Number Core (Cache) Max Freq Memory Inteface Boot Option Multimedia Features S3C3410 40MHz ROM/SRAM SRDAM ROM/SRAM SDRAM ROM/SRAM SDRAM/mSDRAM NAND NOR/ROM NOR /ROM NAND LCD I/F 10-bit ADC x 8 Mono/Color/Gray STN LCD I/F, IIS, 10-bit ADC x 8 TFT/STN(65K) LCD I/F, Touch Screen(ADC), IIS NOR/ROM NAND OneNAND TFT/STN(65K) LCD I/F, Camera I/F 2MP, Touch Screen(ADC), IIS NOR/ROM NAND TFT/STN LCD I/F, Touch Screen(ADC), IIS NOR/ROM NAND TFT/STN LCD I/F, Touch Screen(ADC), IIS, AC97, Camera I/F 16MP TFT/STN LCD I/F, Touch Screen(ADC), IIS, AC97, Camera I/F 16MP TFT/STN LCD I/F, Touch Screen(ADC), IIS, AC97, Camera I/F 16MP Video CODEC(H.263/MPEG4) Modem I/F TFT(2-PIP)/STN LCD I/F, Camera I/F 8MP, IIS, AC97, Touch Screen(ADC) S3C44B0 S3C2412 8 ARM7TDMI (4KB) ARM7TDMI (8KB) ARM926EJ-S (8KB I/D) 66MHz 200MHz 266MHz ROM/SRAM SDRAM/mSDRAM DDR/mDDR x16 NAND/oneNAND ROM/SRAM SDRAM/mSDRAM NAND ROM/SRAM SDRAM/mSDRAM NAND NOR/ROM S3C2413 ARM926EJ-S (8KB I/D) 266MHz S3C2410 ARM920T (16KB-I,16KB-D) 200MHz 266MHz S3C2440 ARM920T (16KB-I,16KB-D) 300MHz 400MHz SC32442 ARM920T (16KB-I,16KB-D) 300MHz 400MHz Stacked with NOR/ROM 32/64MB mSDRAM, NAND 64/128MB NAND S3C24A0 ARM926EJ-S (16KB-I,16KB-D) 266MHz ROM/SRAM SDRAM/mSDRAM NAND NOR/ROM NAND S3C2443 ARM920T (16KB-I,16KB-D) 400MHz 533MHz ROM/SRAM SDRAM/mSDRAM DDR/mDDR x16 NAND/oneNAND NOR/ROM NAND OneNAND S3C6400 ARM1176JZF (16KB-I,16KB-D) (16KB I/D TCM) 400MHz 533MHz 667MHz ROM/SRAM DDR/mDDR x32 NAND/OneNAND NOR/ROM NAND OneNAND MoviNAND Others SAMSUNG SEMICONDUCTOR, INC. Connectivity Timer/PWM Counter DMA Package UART/IIC 8/16-bit TCx5 UARTx2 IIC/IIS UARTx3(IrDA) SPIx2 IIC 2-ch SIOx2 4-ch 128QFP 4-ch 160LQFP 160FBGA 272FBGA WDT, RTC 16-bit TC x4 UARTx3(IrDA) SPIx2 IIC 4-ch 289FBGA WDT, RTC 16-bit TC x4 UARTx3(IrDA) SPIx2 IIC UARTx3(IrDA) SPIx2 IIC 4-ch 272FBGA 4-ch 289FBGA WDT, RTC USB host 1.1 USB device 1.1 SD(SDIO)/MMC CF/ATA USB host 1.1 USB device 1.1 SD(SDIO)/MMC, CF/ATA USB host 1.1 USB device 1.1 SD(SDIO)/MMC USB host 1.1 USB device 1.1 SD(SDIO)/MMC Serial Interface WDT, RTC 16-bit TCx5 WDT, RTC 16-bit TC x4 WDT, RTC 16-bit TC x4 USB host 1.1 USB device 1.1 SD(SDIO)/MMC WDT, RTC 16-bit TC x4 UARTx3(IrDA) SPIx2 IIC 4-ch 332FBGA USB host 1.1 USB device 1.1 SD(SDIO)/MMC Memory Stick WDT, RTC 16-bit TC x4 UARTx2(IrDA) SPIx2 IIC IrDA(v1.1) 4-ch 337FBGA UARTx4(IrDA) 16-bit TC x4 IIC IrDA(v1.1) 6-ch SPIx2 400FBGA UARTx4(IrDA) 32-bit TC x5 IIC IrDA(v1.1) 32-ch SPIx2 424FBGA USB host 1.1 WDT, RTC USB device 1.1 SD(SDIO)/MMC x2 HS-MMC(CE-ATA) CF/ATA TFT(5-PIP) LCD I/F, USB host 1.1, WDT, RTC Camera I/F 16MP, USB OTG 2.0 Touch Screen(ADC), SD(SDIO)/MMC x3 2D Graphic, IIS, AC97, PCM HS-MMC(CE-ATA) Video CODEC(H264,MPEG4,VC1) CF/ATA JPEG, TV-OUT Keypad, MIPI Modem Interface BR-07-ALL-002 AUGUST 2007 HDTV/STB Products HDTV/STB PRODUCTS SYSTEM LSI Part Number Product Description Typical Applications Package CPU Core Max Frequency Data Bus (bits) Serial Interface 20.1" UXGA 21.3" UXGA S3C2800 Co-Processor for DTV MPEG Decoder Set top box, HDTV, General Purpose 208 LQFP ARM920T 200MHz 32 PCI (32 bits, 33MHz) I/O Pins I/O Ports Interupts (Ext) Timer Cache DMA/UART Other Features 44 General Purpose 34 3-Ch, 16-Bit Watchdog 16KB-I, 16KB-D 4-Ch / 2-Ch On-Chip PLL Clock Generator 21.3" QXGA 20.1" WSXGA+ S5H2000 DTV MPEG Decoder Low-Mid-Range HDTV/STB 352 TBGA Uses External S3C2800 CPU 135MHz 32 PCI (32 bits, 33MHz) 244 Display Processor (IPC, Scaler) Digital HD (24bits)/SD (8bits) Input CCIR 656-like input Digital/Analog HD output Analog SD output 2 Sets of Triple 10 bit DAC 2D Graphics, TS Demux AUGUST 2007 BR-07-ALL-002 S5H2010 DTV MPEG Decoder Low-Mid-Range HDTV/STB 492 BGA Uses External S3C2800 CPU 135MHz 32 PCI (32 bits, 33MHz, UART, Smart Card 276 Display Processor (IPC, Scaler) Digital HD (24bits)/SD (8bits) input CCIR 656-like input Digital/Analog HD output Analog SD output 2 Sets of Triple 10 bit DAC with enhanced CAS 2D Graphics, TS Demux Enhanced SAMSUNG SEMICONDUCTOR, INC. 9 SYSTEM LSI Microcontrollers 4-BIT MICROCONTROLLER FAMILY Part Name Package Type SS3C7xxx (KS57) Series S3C70F4XZ0-AV94 30SDIP S3C70F4XZ0-SO94 32SOP S3C7235DZ0-QW85 80QFP S3C72H8XZ0-QT88 64QFP S3C72K8XZ0-QW88 80QFP S3C72M9XZ0-QA89 128QFP S3C72N5XZ0-QW85 80QFP S3C72P9XZ0-QX89 100QFP S3C72Q5XZ0-QX85 100QFP S3C7335XZ0-QW85 80QFP S3C7414DZ0-AQ94 42SDIP S3C7414DZ0-QZ84 44QFP S3C7515DZ0-AT95 64SDIP S3C7515DZ0-QT85 64QFP S3C7528DZ0-AQ98 42SDIP S3C7528DZ0-QZ88 44QFP S3C7544XZ0-AM94 24SDIP S3C7544XZ0-SM94 24SOP S3C7559XZ0-AT99 64SDIP S3C7559XZ0-QT89 64QFP S3C7588AZ0-C0C8 44Pellet ROM Kbytes RAM Nibble I/O Pins Interrupt (Int/Ext) Timer/ Counters SIO 4 512 24 3/2 BT/WT/8TC Yes 16 8 8 32 16 32 16 16 4 512 512 1024 3840 512 1056 5264 512 256 40 21 27 51 40 39 39 56 35 3/3 3/3 3/4 5/4 3/3 4/4 3/3 4/4 5/3 BT/WT/WDT/8T BT/WT/WDT/8T/16T BT/WT/8TC BT/WT/WDT/8T/16T BT/WT/8TC BT/WT/8TC/16TC BT/WT/8TCx2 BT/WT/WDT/8T BT/WT/WDT/8Tx2 Yes 16 512 55 4/3 BT/WT/8Tx2 Yes 8 768 35 3/3 BT/WT/WDT/8Tx2 4 512 17 2/2 BT/WDT/8T 32 1024 55 4/3 BT/WT/WDT/8Tx2 8 768 25 4/4 BT/WT/WDT/8TCx2 NOTES: *Under development. Contact Samsung sales office for availability. (1) ( ) S/W supported PWM (2) SIO mode can be selected by S/W (3) Flash: Writing endurance is 10K times 10 SAMSUNG SEMICONDUCTOR, INC. (4) MTP: Writing endurance is 100 times Abbreviations: ADC=Analog to Digital Converter DTMF=Dual Tone Multi Frequency CAS=CPE Alerting Signal Yes Yes Yes Yes Yes Yes LCD (Seg/Com) ADC (Bit x Ch) PWM(1) (BitxCh) DTMF Max. OSC. Freq. Vdd (V) OTP Equivalent 6MHz 1.8~5.5 S3P70F4X 6MHz 6MHz 6MHz 6MHz 6MHz 6MHz 6MHz 6MHz 6MHz 1.8~5.5 1.8~5.5 2.0~5.5 1.8~5.5 1.8~5.5 1.8~5.5 1.8~5.5 1.8~5.5 1.8~5.5 S3P7235X S3P72H8X S3P72K8X S3P72M9X S3P72N5X S3P72P9X S3P72Q5X S3P7335X S3P7414D Yes 6MHz 2.0~5.5 S3P7515D Yes 6MHz 1.8~5.5 S3P7528D 6MHz 1.8~5.5 S3P7544X Yes 6MHz 1.8~5.5 S3P7559X Yes 3.58MHz 2.7~5.5 S3P7588X Comx4 32/4 26/4 40/8 80/16 32/4 56/16 60/12 28/4 Comx2 Comx2 Comx3 8x4 8x6 (8x1) Yes PWM=Pulse Width Modulation SIO=Serial Input/Output 8T/16T=8-bit /16-bit Timer BT/WT/WDT=Basic/Watch/Watchdog Timer DAC=Digital to Analog Converter BR-07-ALL-002 ZCD=Zero Cross Detection circuit Com=Comparator FSK=Frequency Shift Keying AUGUST 2007 Microcontrollers SYSTEM LSI 8-BIT MICROCONTROLLER FAMILY Part Name Package ROM Type Kbytes S3C9xxx (KS86) Series S3C9228AZ0-AQ98 42SDIP S3C9228AZ0-QZ88 44QFP S3C9228AZ0-LR88 48ELP S3C9234XZ0-QT84 64QFP S3C9404DZ0-AV94 30SDIP S3C9404DZ0-SO94 32SOP S3C9428XZ0-SN98 28SOP S3C9428XZ0-SO98 32SOP S3C9428XZ0-AV98 30SDIP S3C9434XZ0-DI94 18DIP S3C9434XZ0-DK94 20DIP S3C9434XZ0-SK94 20SOP S3C9444XZ0-SC94 8SOP S3C9444XZ0-DC94 8DIP S3C9454BZ0-DH94 16DIP S3C9454BZ0-SH94 16SOP S3C9454BZ0-RH94 16TSSOP S3C9454BZ0-DK94 20DIP S3C9454BZ0-SK94 20SOP S3C9454BZ0-VK94 20SSOP S3C9488XZ0-AO98 32SDIP S3C9488XZ0-SO98 32SOP S3C9488XZ0-AQ98 42SDIP S3C9488XZ0-QZ88 44QFP S3C9498XZ0-SN98 28SOP S3C9498XZ0-SO98 32SOP S3C9498XZ0-AO98 32SDIP S3C9498XZ0-AV98 30SDIP S3C94A5XZ0-QZ85 44QFP S3C94A5XZ0-AQ95 42SDIP S3C94A5XZ0-AO95 32SDIP S3C9688XZ0-AQ98 42SDIP S3C9688XZ0-QZ88 44QFP S3C8xxx (KS88) Series S3C80A5BZ0-SM95 24SOP S3C80A5BZ0-AM95 24SDIP S3C80B5XZ0-SM95 24SOP S3C80B5XZ0-AM95 24SDIP S3C80C5XZ0-SM95 24SOP S3C80C5XZ0-AM95 24SDIP S3C80F9BZ0-SO99 32SOP S3C80F9BZ0-AQ99 42SDIP S3C80F9BZ0-QZ89 44QFP S3C80F9BZ0-LR89 48ELP S3C80G9BZ0-SN99 28SOP S3C80G9BZ0-SO99 32SOP S3C80G9BZ0-AQ99 42SDIP S3C80G9BZ0-QZ89 44QFP S3C80J9XZ0-SO99 32SOP S3C80J9XZ0-SN99 28SOP S3C80JBBZ0-QZ8B 44QFP S3C80JBBZ0-SO9B 32SOP S3F80K5XZ0-SM95 44QFP S3F80K5XZ0-SN95 32SOP S3F80K9XZ0-QZ89 44QFP S3F80K9XZ0-SO99 32SOP S3F80K9XZ0-SN99 28SOP S3F80KBXZ0-QZ8B 44QFP S3F80KBXZ0-SO9B 32SOP S3F80L4XZ0-AO94 32SDIP S3F80L4XZ0-SO94 32SOP S3F80L4XZ0-SN94 28SOP S3C80M4XZ0-DK94 20DIP S3C80M4XZ0-SK94 20SOP S3C80M4XZ0-DH94 16DIP S3C80M4XZ0-SH94 16SOP AUGUST 2007 RAM Bytes I/O Pins Interrupt Timer/ (Int/Ext) Counter Serial Interface LCD (Seg/Com) ADC PWM(1) (Bit x Ch) (BitxCh) Max. OSC. Freq. Vdd (V) OTP or Flash Equivalent 8 256 36 4/10 BT/WT/8TCx2 SIO 16x8 10x4 8MHz 2.0~5.5 S3P9228A 4 4 208 208 52 22 5/7 3/3 BT/WT/8TCx2 BT/WDT/8Tx2 SIO 32/4 8 208 24 5/4 BT/WDT/8Tx2 4 112 11/13 3/2 BT/WDT/8T 4 208 6 1/2 BT/8TC 10x3 4 208 14/18 2/2 BT/8TC 10x9 8 208 26/36/38 6/4 BT/8T UART 8 208 22/24/26 11/5 BT/8TCx4/16TC SIO, UART 16 368 34 8/15 BT/WT/8TC/16TCx2 SIO 8 208 32 15/14 BT/WDT/8T 16 272 19 5/8 BT/WDT/8Tx2/16T 16 272 19 5/8 16 272 19 32 272 32 8x8 (10x1) 8MHz 10MHz 2.0~5.5 2.7~5.5 S3P9234X S3P9404D IIC, SIO 10x12 12x2, (8x1) 16MHz 1.8~5.5 S3P9428X SIO 10x5 12x1 16MHz 3.0~5.5 S3P9434X 10MHz 2.0~5.5 S3F9444X(4) 10MHz 2.0~5.5 S3F9454B(4) 10MHz 2.2~5.5 S3F9488X(4) 19/8 8x1 10x9 10x8 12x1, (8x1) 8MHz 2.0~5.5 S3F9498X(4) 10x16 8x1, 16x2 12MHz 2.0 ~5.5 S3F94A5X(4) 6MHz 4.0~5.25 S3P9688X 8x1 8MHz 2.0~3.6 S3P80A5A BT/WDT/8Tx2/16T 8x1 4MHz 1.7~3.6 S3P80B5X 5/8 BT/WDT/8Tx2/16T 8x1 4MHz 1.7~3.6 S3P80C5X 38 5/16 BT/8TC/16TC 8x1 8MHz 2.0~5.0 S3P80F9X 272 38 5/16 BT/8TC/16TC 8x1 4MHz 1.7~3.6 S3P80G9X 32 272 26 12/10 BT/8T/16T 8x1 8MHz 1.95~3.6 S3F80J9X(3) 64 272 38 14/10 BT/8T/16Tx2 8x1 8MHz 1.95~3.6 S3F80JBB(3) 16 272 22 16/8 BT/8T/16Tx2 8x1 8MHz 1.65~3.6 S3F80K5X(3) 32 272 38 16/8 BT/8T/16Tx2 8x1 8MHz 1.65~3.6 S3F80K9X(3) 64 272 38 16/8 BT/8T/16Tx2 8x1 8MHz 1.65~3.6 S3F80KBX(3) 4 144 26 2/8 BT/8TC 8x1 8MHz 2.0~5.5 S3F80L4X(4) 4 128 15/11 2/4 BT/8TC 8x1 10MHz 2.0~5.5 S3F80M4X(4) BR-07-ALL-002 USB COMx4 SAMSUNG SEMICONDUCTOR, INC. 11 SYSTEM LSI Microcontrollers 8-BIT MICROCONTROLLER FAMILY Part Name Package ROM RAM Type Kbytes Bytes S3C8xxx (KS88) Series 12 S3C8235BZ0-QT85 S3C8235BZ0-ET85 S3C8245AZ0-TW85 S3C8245AZ0-QW85 S3C8249XZ0-TW89 S3C8249XZ0-QW89 S3C825ACZ0-TW8A S3C825ACZ0-QW8A S3C826AXZ0-QC8A S3C8274XZ0-QT84 S3C8274XZ0-ET84 S3C8275XZ0-QT85 S3C8275XZ0-ET85 S3C8278XZ0-QT88 S3C8278XZ0-ET88 S3C8285XZ0-QW85 S3C8285XZ0-TW85 S3C8289XZ0-QW89 S3C8289XZ0-TW89 S3C828BXZ0-QW8B S3C828BXZ0-TW8B S3F82E5XZ0-QZ85 S3F82E5XZ0-TB85 S3F82F5XZ0-QX85 S3F82F5XZ0-TX85 S3F82HBXZZ-QX8B S3F82HBXZZ-TX8B S3F82I9XZZ-QW89 S3F82I9XZZ-TW89 S3C830AXZ0-QX8A S3F833BXZ0-QX8B 64QFP 64LQFP 80TQFP 80QFP 80TQFP 80QFP 80TQFP 80QFP 144QFP 64QFP 64LQFP 64QFP 64LQFP 64QFP 64LQFP 80QFP 80TQFP 80QFP 80TQFP 80QFP 80TQFP 44QFP 48TQFP 100QFP 100TQFP 100QFP 100TQFP 80QFP 80TQFP 100QFP 100QFP Interrupt Timer/ I/O Pins (Int/Ext) Counter Serial Interface LCD (Seg/Com) ADC (Bit x Ch) PWM(1) (BitxCh) Max. OSC. Freq. Vdd (V) OTP or Flash Equivalent 24/8 10x8 8x2 8MHz 2.0~5.5 S3F8235X(4) 16 552 32 8/8 BT/8TCx2/16TC 16 544 45 8/8 BT/WDT/8Tx2/16Tx2 SIO 32/4 10x8 (8x2, 16x1) 10MHz 1.8~5.5 S3P8245X 32 1056 45 8/8 BT/WDT/8Tx2/16Tx2 SIO 32/4 10x8 (8x2, 16x1) 10MHz 1.8~5.5 S3P8249X 48 2096 67 11/12 BT/WT/8TC/16TC SIO, UART 28/8 10x4 (8x1, 16x1) 8MHz 2.0~5.5 S3P825AX 48 4 2k 256 128 52 9/12 4/8 BT/8TCx3/16TC WT/BT/8TCx2 SIO SIO 80/16 32/4 8x4 8x2 2.0~5.5 2.0~3.6 S3P826AX S3F8274X(4) 16 512 S3F8275X(3) 8 256 S3F8278X(4) 16 512 32 1024 S3F8289X(4) 64 2560 S3F828BX(3) 16 208 38 5/4 BT/WT/8TC SIO 23/4 16 2.5K 44 6/12 BT/WT/8TCx2/16TC SIO 60/16 64 2.5K 83 17/12 BT/WT/8TCx2/16TCx2 UARTx2, SIO 52/8 32 1024 63 10/8 BT/WT/8TCx2/16TCx2 UART, SIO 48 64 2084 2.5K 72 86 10/8 13/8 BT/WDT/8Tx2/16T BT/WDT/WT/8Tx2/16T S3F834BXZ0-TX8B 100TQFP 64 2.5K 86 13/8 S3C8454XZ0-TW84 S3C8454XZ0-QW84 S3C8469XZ0-AT99 S3C8469XZ0-QT89 S3C8469XZ0-LT89 S3C8475XZ0-AQ95 S3C8475XZ0-QZ85 S3C848AXZZ-AT9A S3C848AXZZ-QT8A S3C84BBXZ0-TW8B S3C84BBXZ0-QW8B S3C84DBXZ0-TW8B S3C84DBXZ0-QW8B S3C84E9XZ0-AQ99 S3C84E9XZ0-QZ89 S3C84H5XZ0-AO95 S3C84H5XZ0-SO95 S3C84H5XZ0-LO85 S3C84H5XZ0-AV95 S3C84H5XZ0-SN95 S3C84I8XZ0-AQ98 S3C84I8XZ0-QZ88 S3C84I9XZ0-AQ99 S3C84I9XZ0-QZ89 S3F84K4XZ0-DH94 80TQFP 80QFP 64SDIP 64QFP 64ELP 42SDIP 44QFP 64SDIP 64QFP 80TQFP 80QFP 100TQFP 100QFP 42SDIP 44QFP 32SDIP 32SOP 32ELP 30SDIP 28SOP 42SDIP 44QFP 42SDIP 44QFP 16DIP 4 1040 42 32 528 16 S3F84K4XZ0-SH94 S3F84K4XZ0-RH94 S3F84K4XZ0-DK94 S3F84K4XZ0-SK94 S3F84K4XZ0-VK94 16SOP 16TSSOP 20DIP 20SOP 20SSOP 65 10/8 BT/WT/8TCx2/16TCx2 UART, SIO 32/8 10x8 8x1,16x1 8MHz 8MHz 11.1MHz 2.0~3.6 S3F8285X(4) 8MHz 2.0~3.6 S3F82E5X(4) 8x1 8MHz 2.0~5.0 S3F82F5X(4) 10x8 8x1, 16x2 12MHz 2.0~3.6 S3F82HBX(3) 32/8 10X8 8x1, 16x2 12MHz 2.0~3.6 S3F82I9X (3) SIOx2 SIOx2, UARTx2 40/4 40/8 8x4 10x12 8x1 8x1 4.5MHz 12MHz 3.0~5.5 2.0~3.6 BT/WDT/WT/8Tx2/16T SIOx2, UARTx2 40/8 10x12 8x1 12MHz 2.0~3.6 8/8 BT/WDT/8Tx2/16Tx2 SIO 8x4 8x2, (16x2) 25MHz 4.5~5.5 S3P830AX Flash Only S3F833BX(4) Flash Only S3F834BX(4) S3P8454X 56 11/10 BT/WDT/8Tx2/16Tx2 UART, SIO 10x8 14x2, (8x2) 12MHz 2.7~5.5 S3P8469X 272 36 6/8 BT/WDT/8T/16T UARTx2 10x8 (8x1, 10x1) 12MHz 2.7~5.5 S3P8475X 48 2064 56 15/14 BT/8TCx4/16Tx2 UARTx2 SIO 10x8 14x2, (8x2) 12MHz 2.7~5.5 S3P848AX 64 2064 70 14/10 BT/8TCx2/16TCx2/8Tx2 UARTx2, SIO 10x8 8*1 (DAC) 10MHz 2.7~5.5 S3F84BBX(3) 64 2064 90 14/10 BT/8TCx4/16TCx2 UARTx2, SIO 10x8 8*1 (DAC) 10MHz 2.7~5.5 S3F84DBX(3) 16 272 34/36 9/12 BT/WT/8T/8TC/16TCx2 UART 10x8 (8x1) 12MHz 2.7~5.5 S3P84E9X 16 272 22/20/18 12/4 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 10x1 10MHz 2.4~5.5 S3F84H5X(4) 8 292 34/32 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 10x1 10MHz 2.4~5.5 S3F84I8X(4) 32 528 4 208 SAMSUNG SEMICONDUCTOR, INC. 12/4 48/8 16/8 S3F84I9X(3) 11/18 2/2 BT/16(8X2)T 10x9 BR-07-ALL-002 12x1 8MHz 2.0~5.5 Flash Only S3F84K4X(4) AUGUST 2007 Microntrollers SYSTEM LSI 8-BIT MICROCONTROLLER FAMILY Part Name Package ROM RAM Type Kbytes Bytes S3C8xxx (KS88) Series Interrupt Timer/ I/O Pins (Int/Ext) Counter Serial Interface LCD (Seg/Com) ADC (Bit x Ch) PWM(1) (BitxCh) Max. OSC. Freq. Vdd (V) OTP or Flash Equivalent 8x2 10MHz 2.4~5.5 Flash Only S3F84MBX(3) 10MHz 2.4~5.5 Flash Only S3F84MBX(3) S3F84MBXZ0-TW8B 80TQFP 64 2064 70 17/10 BT/8TCx2/16TCx2/8Tx2 UARTx3, SIOx2 10x5 S3F84MBXZ0-QW8B 80QFP S3F84NBXZ0-AT9B* 64SDIP 64 2064 56 15/14 BT/8Tx316TCx2 10x8 S3F84NBXZ0-QT8B* 64QFP S3F84P4XZ0-SC94 8SOP 4 208 6 2/2 BT/16(8X2)T 10x4 12x1 10MHz 2.0~5.5 Flash Only S3F84P4X(4) S3F84P4XZ0-DC94 8DIP S3F84Q5XZZ-SN95* 28SOP 16 528 26 14/9 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 14x1 10MHz 2.0~5.5 Flash Only S3F84Q5X (3)* S3F84Q5XZZ-AV95* S3F84Q5XZZ-AO95* S3F84Q5XZZ-SO95* S3F84S5XZZ-DH95* 30SDIP 32SDIP 32SOP 16DIP 16 272 17/13 6 BT/8T 12x9 12x1 10MHz 2.4~5.5 Flash Only S3F84S5X (3)* S3F84S5XZZ-DK95* S3F84S5XZZ-SH95* S3F84S5XZZ-SK95* S3F84T5XZZ-SN95* 20DIP 16SOP 20SOP 28SOP 16 272 18/20/22 16 BT/WT/8TCx2/16TCx2 UART, SIO 10x8 10x1 10MHz 2.4~5.5 Flash Only S3F84T5X (3)* S3F84T5XZZ-AO95* 32SDIP S3F84T5XZZ-SO95* 32SOP S3F84UAXZZ-QZ8A* 44QFP 48 528 32/30 12/12 BT/WDT/WT/ 8TCx3/16TCx2 UARTx2, SIO 10x8 8x3 12MHz 1.8~5.5 Flash Only S3F84UAX (3)* S3F84UAXZZ-AQ9A* 42SDIP S3F84VBXZZ-QT8B* 64QFP 64 2064 54 12/12 BT/WDT/WT/ 8TCx3/16TCx2 UARTx2, SIO 10x8 8x3 12MHz 1.8~5.5 Flash Only S3F84VBX (3)* S3F84VBXZZ-AT9B* 64SDIP S3F84V9XZZ-QT89* 64QFP 32 1040 54 12/12 BT/WDT/WT/ 8TCx3/16TCx2 UARTx2, SIO 10x8 8x3 12MHz 1.8~5.5 Flash Only S3F84V9X (3)* S3F84V9XZZ-AT99* 64SDIP S3F84YBXZZ-QW8B* 80TQFP 64 2064 70 13/12 BT/WDT/WT/ 8TCx4/16TCx2 UARTx2, SIO 10x8 8x4 12MHz 1.8~5.5 Flash Only S3F84YBX (3)* S3F84YBXZZ-TW8B* 80QFP S3F84ZBXZZ-TX8B* 100TQFP 64 2064 90 13/14 BT/WDT/WT/ 8TCx4/16TCx2 UARTx2, SIO 10x8 8x4 12MHz 1.8~5.5 Flash Only S3F84ZBX (3)* S3F84ZBXZZ-QX8B* 100QFP S3C851BXZ0-QD8B 160QFP S3C863AXZ0-AQ9A 42SDIP 64 48 1808 1040 42 27 1/7 7/3 BT/WDT/WT/8T/16T BT/8TC/8T/12C UART, SIO M/M IIC, Slave IIC 10x4 8x4 8x7 3.58MHz 12MHz 2.7~5.5 3.0~5.5 S3P851BX S3P863AX 24 64 384 1040 19 30 6/3 9/2 BT/8TC/8T/12C BT/WDT/8TCx3 IIC IIC 4x4 8x8 8x6 8x7 12MHz 24MHz 4.0~5.5 S3F8647X(4) 2.3~3.6V S3F866BX(4) 48 336 26 5/4 BT/8TCx2 8x4 8MHz 4.5~5.5 S3F880AX(4) 32 272 26 5/4 BT/WDT/8Tx2 4x4 14x2, 8x4(8x1) 14x2, 8x4(8x1) 8MHz 4.5~5.5 S3P8849X 256 1K 90 13/8 BT/WT/8TCx2/16TC SIO 64/16 10x1 8x1 8MHz 2.4~3.6 16 384 48 9/4 BT/WT/8TCx2/16TC SIO 32/4 10x8 8x2, 16x1 8MHz 2.4~3.6 Flash Only S3FK11FX (4) S3FK225X (4) 8 256 36 7/7 BT/WT/8TCx2/16TC SIO 16/8 10x4 16x1 8MHz 2.4~3.6 S3F318X (4) S3C863AXZ0-QZ8A S3C8647XZ0-AO97 S3C866BXZ0-AQ9B S3C866BXZ0-QZ8B S3C866BXZ0-PZ9B S3C880AXZ0-AQ9A 44QFP 32SDIP 42SDIP 44QFP 44PLCC 42SDIP S3C8849XZ0-AQ99 42SDIP S3CKxxx (Calm8) Series S3FK11XZZ-QA8F 128QFP S3CK225XZ0-QT85 S3CK225XZ0-ET85 S3CK318XZ0-QZ88 64QFP 64LQFP 44QFP NOTES: 1 *Under Development. Contact Samsung sales office for availability 2 (1) ( ) S/W supported PWM (2) SIO mode can be selected by S/W (3) Flash: Writing endurance is 10K times (4) MTP: Writing endurance is 100 times AUGUST 2007 3 Abbreviations: LVR = Low Voltage Reset ZCD=Zero Cross Detection circuit FSK=Frequency Shift Keying RDS=Radio Data System DAC=Digital to Analog Converter PWM=Pulse Width Modulation BR-07-ALL-002 UARTx2, SIO 20/8 56/34 SIO=Serial Input/Output LIN=Local Interface Network DTMF=Dual Tone Multi Frequency DDC=Display Data Channel SDT=Stuttered Dial Tone BT/WT/WDT=Basic/Watch/Watchdog timer 8T/16T=8-bit /16-bit Timer OSD=On Screen Display ADC=Analog to Digital Converter CAS=CPE Alerting Signal LVD = Low Voltage Detector PGM=Pattern Generation Module Com=Comparator SAMSUNG SEMICONDUCTOR, INC. 13 SYSTEM LSI Microntrollers 16-BIT MICROCONTROLLER FAMILY Part Name S3FC11BXZZ-QX8F S3FC11BXZZ-TX8F S3CC34DXZZ-QX8D S3CC34DXZZ-TX8D S3FC40DXZZ-QX8D S3FC40DXZZ-TX8D S3FC40DXZZ-QA8D Package ROM Type Kbytes RAM Bytes I/O Pins Interrupt Timer/ (Int/Ext) Counter Serial Interface LCD (Seg/Com) ADC PWM(1) (Bit x Ch) (BitxCh) Max. OSC. Freq. Vdd (V) Other Features 100QFP 64 100TQFP 100QFP 128 100TQFP 100QFP 128 100TQFP 128QFP 10k 77 8/9 BT/WT/8TCx3 SIO 36/8 10X4 8x1 40MHz 2.0~3.6 MAC1616 4 90 20/16 BT/WT/8TCx3/16TCx3 UART, SIOx4 10X16 8x3, 16x3 12MHz 2.4~5.5 6 90 30/16 BT/WT/8TCx2/16TCx8 UARTx3, SIOx2 10X24 8x2, 16x8 12MHz RDS=Radio Data System DAC=Digital to Analog Converter PWM=Pulse Width Modulation SIO=Serial Input/Output LIN=Local Interface Network DTMF=Dual Tone Multi Frequency DDC=Display Data Channel SDT=Stuttered Dial Tone BT/WT/WDT=Basic/Watch/ Watchdog timer 8T/16T=8-bit /16-bit Timer OSD=On Screen Display (3) Flash:Writing endurance is 10K times (4) MTP: Writing endurance is 100 times 3 Abbreviations: LVR = Low Voltage Reset ZCD=Zero Cross Detection circuit FSK=Frequency Shift Keying NOTES: 1 *Under Development. Contact Samsung sales office for availability. 2 (1) ( ) S/W supported PWM (2) SIO mode can be selected by S/W 2.4~5.5 ADC=Analog to Digital Converter CAS=CPE Alerting Signal LVD = Low Voltage Detector PGM=Pattern Generation Module Com=Comparator 32-BIT MICROCONTROLLER FAMILY Network Application Part Name S3C4510B-QE80 CPU Package System I/O Interrupt Ethernet HDLC USB Timer Serial DES PCI Type Pins (Int/Ext) (10/100M) Counter Interface 3DES Manager ARM7TDMI 208QFP SDRAM Memory 18 (NOR,SRAM) IF S3C4530A-QE80 ARM7TDMI 208QFP SDRAM Memory 26 (NOR,SRAM) IF SS3C2510A-GB80 ARM940T 416PBGA SDRAM Memory 64 (NOR,SRAM) IF SAR GDMA Max. Vopr OSC 17/4 1ch 2ch 32bit 2ch UARTx2, IIC 2ch 50MHz 3.3V 17/4 1ch 2ch 32bit 2ch UARTx2, IIC 2ch 50MHz 3.3V 30/6 2ch 32bit 2ch, WDT UARTx3, IIC Package ROM / Flash RAM I/O Pins Type (KByte) (KByte) 256 20 1 Device (F-speed) 1 Host (F-speed, support 2device) Yes Yes "UTOPIA I/F 6ch 166Mhz 1.8/3/3V Inverter Motor Application Part Name S3F401FXZZ-QX8F* CPU ARM7TDMI 100QFP S3F401FXZZ-TX8F* Interrupt IMC ENC (Int/Ext) 66 59/31 2ch 2ch Timer / Serial Counter Interface ADC OSC Max. BT/WDT/16BTx6 UARTx2, SSPx2 12x15 90MHz Vopr 3.0~3.6 100TQFP CAN/LIN Application Part Name Package ROM/Flash Data Flash RAM Type (KByte) (KByte) (KByte) Pins (Int/Ext) 1024 32 32 111 44/20 S3F4A0KJZZ-EC8K S3F4A1HRZZ-TX8H ARM7TDMI 100TQFP 512 32 16 74 S3F4A1HJZZ-TX8H S3F4A2FRZZ-TW8F* ARM7TDMI 80TQFP 256 8 59 S3F4A0KRZZ-EC8K CPU ARM7TDMI 144LQFP I/O Interrupt CAN / LIN Stepper Timer / Motor Counter Interface Serial LCD ADC PWM Max Vopr 4ch/3ch "6ch (Driver 4ch) WDT(16x1) SPI0(8X1) 40/4 ST0(16x2) SPI1(16x1) ST1(16x2) IIC(2ch) ST2(16x2) GPT(16x3) STT(32x1) 10x16 8x12 16x2 40MHz 3.0~5.5 52/12 2ch/3ch 4ch WDT(16x1) SPI0(8X1) 30/4 ST0(16x2) SPI1(16x1) ST1(16x2) IIC(2ch) GPT(16x3) STT(32x1) 10x16 8X8 16x2 40MHz 3.0~5.5 54/10 1ch/2ch WDT(16x1) SPI0(8X1) ST0(16x2) SPI1(16x1) ST1(16x2) IIC(2ch) GPT(16x3) STT(32x1) 10x16 16x8 OSC 20MHz 3.0~5.5 S3F4A2FJZZ-TW8F* 32-BIT MICROCONTROLLER FAMILY General Purpose Application Part Name CPU Package ROM RAM Type (KByte) (KByte) Interrupt Timer / Serial (Int/Ext) Counter Interface S3F441FXZZ-ETRF ARM7TDMI 64LQFP 256 8 16 16/3 BT/WDT/16TCx6 UART S3F443FXZZ-ET8F ARM7TDMI 64LQFP 256 8 16 18/3 BT/WDT/16TCx6 UART 100TQFP 512 16 73 22/8 BT/WDT/16TCx6 UARTx2 S3F445HXZZ-TX8H ARM7TDMI NOTES: 1 *Under Development. Contact Samsung sales office for availability. 14 I/O Pins SAMSUNG SEMICONDUCTOR, INC. 2 Abbreviations: ADC=Analog to Digital Converter BT/WT/WDT=Basic/Watch/ Watchdog timer SST=Stamp Timer GPT=General Purpose timer SSP=Synchronous Serial Port ADC PWM Max Vopr OSC 8x1 10x8 40MHz 3.0~3.6 40MHz 3.0~3.6 40MHz 3.0~3.6 IMC=Inverter Motor Controller ENC=Encoder Counter LIN=Local Interface Network Microcontroller Ordering Information SYSTEM LSI MICROCONTROLLER ORDERING INFORMATION S 1 3 2 X 3 X 4 X 5 X 6 X 7 X 8 1. System LSI (S) 11. (- - ) 2. Large Classification: Microcontroller(3) 12. Package Type 3. Small Classification C: MASK ROM F: FLASH 3: MCP E: EVA-CHIP P: OTP 4. Core 1: 51 4-bit 2: 32-bit ARM9 3: 17 16-bit 4: 32 32-bit 5: 32-bit ARM10 6: 56 4-bit 7: 57 4-bit 8: 88 8-bit 9: 86 8-bit A: 15 Other B: 8-bit CALM RISC MAC C: 16-bit CALM RISC MAC D: 32-bit CALM RISC MAC I: CUSTOM MCU J: SC-200 K: 8-bit CALM RISC L: 16-bit CALM RISC R: 128-bit CALM RISC S: SC-100 5~6. Application Category X 9 X 10 11 B: LGA D: DIP F: WQFP H: CSP K: UELP M: QFPH P: PLCC S: SOP V: TEBGA Y: FBGA 1n: Voice 3n: Audio 5n: Telecom 7n: VFD 9n: Special (IC Card) Cn: C Nn: Intel Application M: 24 T: 64 O: 32 V: 30 C: 83 J: 176 H: 16 N: 28 I: 18 P: 40 D: 160 J: 176 W: 80 E: 208 R: 48 X: 100 - LGA - DIP - WQFP T: 64 - BGA A: 272 B: 416 - CSP - BQFP B: 132 7. Rom Master -UELP 0: 0K byte 2: 2K byte 4: 4K byte 6: 6K byte 8: 8K byte A: 48K byte C: 96K byte F: 256K byte H: 512K byte K: 1M byte 8. Version A~Z *1st Version X 9~10. Mask Option 1: 1K byte 3: 12K byte 5: 16K byte 7: 24K byte 9: 32K byte B: 64K byte D: 128K byte G: 384K byte J: 1M byte T: 64 - ELP R: 48 T: 64 - QFPH D: 160 F: 240 - COB C: 8 D: 8CNCL - PLCC C: 52 Z: 44 - QFP A: 128 E: 208 T: 64 X: 100 X 18 H: 16 M: 24 I: 18 N: 28 A: 128 X: 100 T: 64 W: 80 B: 81 E: 208 H: 320 O: 272 T: 64 C: 144 F: 180 K: 105 P: 504 1: Cust1 2: Cust2 - TEBGA X: 492 - FBGA A: 337 D: 160 G: 285 L: 400 Q: 289 14. Packing B: Tube U: Bulk R: Tray T: Tape & Reel S: Tape & Reel Reverse C: Chip Biz D: Chip Biz (3 Inch tray) E: Chip Biz (4 Inch tray) F: Chip Biz (Reverse) W: WF Biz Draft Wafer X: WF Biz Full Cutting 7: Tape & Reel (Pb-Free PKG) 8: Tray (Pb-Free PKG) 9: Tube (Pb-Free PKG) 15. ROM Size J: 176 * "n": Serial No (1Z) X 17 - TQFP 0: None - SDIP C: 144 G: 256 T: 64 X 16 - WAFER - LQFP 0n: General Purpose 2n: LCD 4n: General A/D 6n: PC & Peripheral,OA 8n: Video An: General Purpose-1 Fn: Telecom-1 Zn: Assignment Code X 15 A: 432 Wafer/CHIP BIZ = 0(NONE) C: 8 K: 20 X 14 - SBGA 3. Package Pin A: 88 X 13 C: 8 K: 20 O: 32 A: SDIP C: CHIP BIZ E: LQFP G: BGA J: BQFP L: ELP N: COB Q: QFP T: TQFP W: WAFER Z: SBGA B: 56 Q: 42 X 12 C: 144 G: 256 U: 304 Z: 44 D: 160 R: 48 W: 80 0: 0K byte 1: 1K byte 2: 2K byte 3: 12K byte 4: 4K byte 5: 16K byte 6: 6K byte 7: 24K byte 8: 8K byte 9: 32K byte A: 48K byte B: 64K byte C: 96K byte D: 128K byte E: Extended F: 256K byte G: 384K byte H: 512K byte J: 1M byte K: 1M byte M: Military N: Industrial X: Special MK3 Y: Special MK2 Z: Special MK1 * Smart Card IC: EEPROM Size * X,Y,Z: Special Marking ( MASKROM) - SOP SAMSUNG SEMICONDUCTOR, INC. 15 SYSTEM LSI EEPROMs SERIAL EEPROMS Write Cycle Part Number Density (bit) Write Protection Vopr (V) Time (Max) S524A40X20-RC70 S524A40X21-DC90 S524A40X21-SC90 S524A40X21-SC70 / S524A40X41-DC90 S524A40X41-SC90 S524A40X41-SC70 S524A60X51-DC90 S524A60X51-SC90 S524A60X51-SC70 S524A60X81-DC90 S524A60X81-SC90 S524A60X81-SC70 S524A90X91-DC90 S524A90X91-SC90 S524A90X91-SC70 S524A90XB1-DC90 S524A90XB1-SC90 S524A90XB1-SC70 S524AD0XF1-RC70 S524AE0AH1-RC70 2K by Hardware & Software 1.8 ~ 5.5 5 ms 4K by Hardware 1.8 ~ 5.5 5 ms 16K by Hardware 1.8 ~ 5.5 5 ms NOTES: 16 8K by Hardware 1.8 ~ 5.5 5 ms 32K by Hardware 1.8 ~ 5.5 5 ms 64K by Hardware 1.8 ~ 5.5 5 ms 256K 512K by Hardware by Hardware 1.8 ~ 5.5 1.8 ~ 5.5 5 ms 5 ms Interface Package I2C BUS DC90 = 8DIP SC90 = 8SOP SC70 = 8SOP (T&R) RC70 = 8TSSOP (T&R) All listed products are in production Temperature: -25 ~ 70c All products offer 100-year data retention, a 16M page buffer and two-wired serial I2C-bus interfaces. All products operate at 100KHz, 400KHz clock frequency. Package: DCBO=8DIP SAMSUNG SEMICONDUCTOR, INC. BR-07-ALL-002 AUGUST 2007 Samsung's broad line of logic products features System-on-Chip and ASIC solutions manufactured using some of the world's most advanced processes. Samsung's mobile application processors, ASICs, microcontrollers, image sensors and other System LSI products are found in a wide range of digital devices such as some of today's most coveted handhelds. Samsung also offers custom logic chip design and production in a dedicated foundry that employs the latest technologies. For more information, visit our website: www.usa.samsungsemi.com Disclaimer: The information in this publication has been carefully checked and is believed to be accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or omissions, or for any consequences resulting from the use of the information contained herein. Samsung reserves the right to make changes in its products or product specifications with the intent to improve function or design at any time and without notice and is not required to update this documentation to reflect such changes. This publication does not convey to a purchaser of semiconductor devices described herein any license under the patent rights of Samsung or others. Samsung makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Samsung assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation any consequential or incidental damages. www.usa.samsungsemi.com Copyright 2007. Samsung and Samsung Semiconductor, Inc. are registered trademarks of Samsung Electronics, Co., Ltd. All other names and brands may be claimed as the property of others. The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. BR-07-ALL-002 Printed 8/07