1
2
3
4
5
6
7
89
10
11
12
13
14
15
16
RXD
TXD
GND1
Vcc2
CANH
CANL
GND2
DW PACKAGE
Vcc1
GND1 GND2
GND2
GND1
nc
nc
nc
nc
RXD
TXD
CANH
CANL
FUNCTION DIAGRAM
1
2
3
45
6
7
8
TXD
RXD
Vcc2
CANH
GND2
DUB PACKAGE
Vcc1
GND1
CANL
GALVANIC ISOLATION
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
ISOLATED CAN TRANSCEIVER
Check for Samples: ISO1050,ISO1050L
1FEATURES
2•5000-VRMS Isolation (ISO1050DW) •3.3-V Inputs are 5-V Tolerant
•2500-VRMS Isolation (ISO1050DUB and •Typical 25-Year Life at Rated Working Voltage
ISO1050LDW) (see Application Report SLLA197 and
Figure 15)
•Failsafe Outputs
•Low Loop Delay: 150 ns Typical APPLICATIONS
•50 kV/μs Typical Transient Immunity •CAN Data Buses
•Meets or Exceeds ISO 11898 requirements •Industrial Automation
•Bus-Fault Protection of –27 V to 40 V –DeviceNet Data Buses
•Dominant Time-Out Function –CANopen Data Buses
•IEC 60747-5-2 (VDE 0884, Rev. 2) &IEC –CANKingdom Data Buses
61010-1 Approved •Medical Scanning and Imaging
•UL 1577 Double Protection Approved; See •Security Systems
Regulatory Information section for details
•Telecom Base Station Status and Control
•IEC 60601-1 (Medical) and CSA Approved
•HVAC
•5 KVRMS Reinforced Insulation per TUV
Approved for EN/UL/CSA 60950-1 •Building Automation
(ISO1050DW)
DESCRIPTION
The ISO1050 is a galvanically isolated CAN transceiver that meets or exceeds the specifications of the ISO
11898 standard. The device has the logic input and output buffers separated by a silicon oxide (SiO2) insulation
barrier that provides galvanic isolation of up to 5000 VRMS for ISO1050DW and 2500 VRMS for ISO1050DUB and
ISO1050LDW. Used in conjunction with isolated power supplies, the device prevents noise currents on a data
bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry.
As a CAN transceiver, the device provides differential transmit capability to the bus and differential receive
capability to a CAN controller at signaling rates up to 1 megabit per second (Mbps). Designed for operation in
especially harsh environments, the device features cross-wire, overvoltage and loss of ground protection
from –27 V to 40 V and over-temperature shut-down, as well as –12 V to 12 V common-mode range.
The ISO1050 is characterized for operation over the ambient temperature range of –55°C to 105°C.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2DeviceNet is a trademark of others.
PRODUCTION DATA information is current as of publication date. Copyright ©2009–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
PRODUCT RATED ISOLATION PACKAGE MARKED AS ORDERING NUMBER
ISO1050DUB 2500 VRMS DUB-8 ISO1050 ISO1050DUB (rail)
ISO1050DUBR (reel)
ISO1050LDW(1) 2500 VRMS(2) DW-16 ISO1050L ISO1050LDW (rail)
ISO1050LDWR (reel)
ISO1050DW 5000 VRMS DW-16 ISO1050 ISO1050DW (rail)
ISO1050DWR (reel)
(1) Product Preview
(2) Certifiactions Pending
ABSOLUTE MAXIMUM RATINGS(1) (2)
VALUE / UNIT
VCC1, VCC2 Supply voltage (3) –0.5 V to 6 V
VIVoltage input (TXD) –0.5 V to 6 V
VCANH or VCANH Voltage range at any bus terminal (CANH, CANL) –27 V to 40 V
IOReceiver output current ±15 mA
Bus pins and GND2(4) ±4 kV
Human Body Model JEDEC Standard 22, Method A114-C.01 All pins ±4 kV
ESD Charged Device Model JEDEC Standard 22, Test Method C101 All pins ±1.5 kV
Machine Model ANSI/ESDS5.2-1996 All pins ±200 V
Tstg Storage temperature –65°C to 150°C
TJJunction temperature –55°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) This isolator is suitable for basic isolation within the safety limiting data. Maintenance of the safety data must be ensured by means of
protective circuitry.
(3) All input and output logic voltage values are measured with respect to the GND1 logic side ground. Differential bus-side voltages are
measured to the respective bus-side GND2 ground terminal.
(4) Tested while connected between Vcc2 and GND2.
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
VCC1 Supply voltage, controller side 3 5.5 V
VCC2 Supply voltage, bus side 4.75 5 5.25 V
VIor VIC Voltage at bus pins (separately or common mode) –12(1) 12 V
VIH High-level input voltage TXD 2 5.25 V
VIL Low-level input voltage TXD 0 0.8 V
VID Differential input voltage –7 7 V
Driver –70
IOH High-level output current mA
Receiver –4
Driver 70
IOL Low-level output current mA
Receiver 4
TAAmbient Temperature –55 105 °C
TJJunction temperature (see THERMAL CHARACTERISTICS) –55 125 °C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
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ISO1050
ISO1050L
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SLLS983E –JUNE 2009–REVISED DECEMBER 2011
SUPPLY CURRENT
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VI= 0 V or VCC1 , VCC1 = 3.3V 1.8 2.8
ICC1 VCC1 Supply current mA
VI= 0 V or VCC1 , VCC1 = 5V 2.3 3.6
Dominant VI= 0 V, 60-ΩLoad 52 73
ICC2 VCC2 Supply current mA
Recessive VI= VCC1 8 12
(1) All typical values are at 25°C with VCC1 = VCC2 = 5V.
DEVICE SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Total loop delay, driver input to receiver output, Recessive to
tloop1 See Figure 9 112 150 210 ns
Dominant
Total loop delay, driver input to receiver output, Dominant to
tloop2 See Figure 9 112 150 210 ns
Recessive
DRIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CANH 2.9 3.5 4.5
VO(D) Bus output voltage (Dominant) See Figure 1 and Figure 2, VI= 0 V, RL= 60ΩV
CANL 0.8 1.2 1.5
VO(R) Bus output voltage (Recessive) See Figure 1 and Figure 2, VI= 2 V, RL= 60Ω2 2.3 3 V
See Figure 1,Figure 2 and Figure 3, VI= 0 V, 1.5 3
RL= 60Ω
VOD(D) Differential output voltage (Dominant) V
See Figure 1,Figure 2, and Figure 3 VI= 0 V, 1.4 3
RL= 45Ω, Vcc >4.8V
See Figure 1 and Figure 2, VI= 3 V, RL= 60Ω –0.12 0.012
VOD(R) Differential output voltage (Recessive) V
VI= 3 V, No Load –0.5 0.05
VOC(D) Common-mode output voltage (Dominant) 2 2.3 3
See Figure 8 V
VOC(pp) Peak-to-peak common-mode output voltage 0.3
IIH High-level input current, TXD input VIat 2 V 5 μA
IIL Low-level input current, TXD input VIat 0.8 V –5μA
IO(off) Power-off TXD leakage current VCC1, VCC2 at 0 V, TXD at 5 V 10 μA
See Figure 11, VCANH =–12 V, CANL Open –105 –72
See Figure 11, VCANH = 12 V, CANL Open 0.36 1
IOS(ss) Short-circuit steady-state output current mA
See Figure 11, VCANL =–12 V, CANH Open –1–0.5
See Figure 11, VCANL = 12 V, CANH Open 71 105
COOutput capacitance See receiver input capacitance
CMTI Common-mode transient immunity See Figure 13, VI= VCC or 0 V 25 50 kV/μs
DRIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, recessive-to-dominant output 31 74 110
tPHL Propagation delay time, dominant-to-recessive output 25 44 75
See Figure 4 ns
trDifferential output signal rise time 20 50
tfDifferential output signal fall time 20 50
tdom Dominant time-out ↓CL=100 pF, See Figure 10 300 450 700 μs
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ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
RECEIVER ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIT+ Positive-going bus input threshold voltage 750 900 mV
See Table 1
VIT–Negative-going bus input threshold voltage 500 650 mV
Vhys Hysteresis voltage (VIT+ –VIT–) 150 mV
IOH =–4 mA, See Figure 6 VCC –0.8 4.6
VOH High-level output voltage with Vcc = 5V V
IOH =–20 μA, See Figure 6 VCC –0.1 5
IOL = 4 mA, See Figure 6 VCC –0.8 3.1
VOH High-level output voltage with Vcc1 = 3.3V V
IOL = 20 μA, See Figure 6 VCC –0.1 3.3
IOL = 4 mA, See Figure 6 0.2 0.4
VOL Low-level output voltage V
IOL = 20 μA, See Figure 6 0 0.1
CIInput capacitance to ground, (CANH or CANL) TXD at 3 V, VI= 0.4 sin (4E6πt) + 2.5V 6 pF
CID Differential input capacitance TXD at 3 V, VI= 0.4 sin (4E6πt) 3 pF
RID Differential input resistance TXD at 3 V 30 80 kΩ
RIN Input resistance (CANH or CANL) TXD at 3 V 15 30 40 kΩ
Input resistance matching
RI(m) VCANH = VCANL –3% 0% 3%
(1 –[RIN (CANH) / RIN (CANL)]) ×100%
CMTI Common-mode transient immunity VI= VCC or 0 V, See Figure 13 25 50 kV/μs
(1) All typical values are at 25°C with VCC1 = VCC2 = 5V.
RECEIVER SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low-to-high-level output 66 90 130
tPHL Propagation delay time, high-to-low-level output 51 80 105
TXD at 3 V, See Figure 6 ns
trOutput signal rise time 3 6
tfOutput signal fall time 3 6
tfs Failsafe output delay time from bus-side power loss VCC1 at 5 V, See Figure 12 6μs
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»2.5V
»3.5V
»1.5V
Recessive
Dominant
O(CANH)
V
O(CANL)
V
0 or
Vcc1
VI
TXD
CANH
CANL
VO(CANL) VO(CANH)
VOD
IO(CANH)
IO(CANL)
GND2GND1
GND1 GND2
II
VOC
VO(CANH) +VO(CANL)
2
RL
0 V V
OD
-2V < Vtest< 7 V
330
60
330
TXD
CANL
CANH
±1%
±1%
±1%
+
_
W
W
W
GND2
VI
(SEENOTE A)
VO
60
TXD
CANL
CANH
±1%
WCL = 100 pF
20%
(SEENOTEB)
±
Vcc/2 Vcc/2
Vcc
tf
tr
tPLH tPHL
10%
90%
0.9V
0 V
V
O(D)
VO(R)
0.5V
VI
VO
RXD
CANH
CANL
GND2 GND1
VI(CANH)
VI(CANL)
IO
VIC
VI(CANH)
=
VI(CANL)
+
2VID
VO
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
PARAMETER MEASUREMENT INFORMATION
Figure 1. Driver Voltage, Current and Test Figure 2. Bus Logic State Voltage Definitions
Definitions
Figure 3. Driver VOD with Common-mode Loading Test Circuit
A. The input pulse is supplied by a generator having the following characteristics: PRR ≤125 kHz, 50% duty cycle,
tr≤6 ns, tf≤6 ns, ZO= 50Ω.
B. CLincludes instrumentation and fixture capacitance within ±20%.
Figure 4. Driver Test Circuit and Voltage Waveforms
Figure 5. Receiver Voltage and Current Definitions
Copyright ©2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): ISO1050 ISO1050L
RXD
CANH
CANL
GND 2 GND 1
VI
(SEENOTE A) 1 .5 V
IO
VO
CL = 15 pF
20 %
(SEENOTEB)
±
VI
VO
2 V 2.4 V
3.5 V
VOH
tf
tr
tpHL
1.5 V
VOL
90 %
10 %
0.3 Vcc 1
0.7 Vcc 1
tpLH
CANH
CANL
RXD
Thewaveformsoftheappliedtransientsareinaccordance
withISO 7637 part 1, testpulses 1, 2, 3a, and 3b.
TXD
1 nF
1 nF
15 pF
GND2 GND1
VI
+
_
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
A. The input pulse is supplied by a generator having the following characteristics: PRR ≤125 kHz, 50% duty cycle,
tr≤6 ns, tf≤6 ns, ZO= 50Ω.
B. CLincludes instrumentation and fixture capacitance within ±20%.
Figure 6. Receiver Test Circuit and Voltage Waveforms
Table 1. Differential Input Voltage Threshold Test
INPUT OUTPUT
VCANH VCANL |VID| R
–11.1 V –12 V 900 mV L
12 V 11.1 V 900 mV L VOL
–6 V –12 V 6 V L
12 V 6 V 6 V L
–11.5 V –12 V 500 mV H
12 V 11.5 V 500 mV H
–12 V –6 V –6 V H VOH
6 V 12 V –6 V H
Open Open X H
Figure 7. Transient Over-Voltage Test Circuit
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TXD
RXD
60 W
VI
15 pF
CANH
CANL
+
VO
_
±20%
±1%
GND1
TXDInput
0 V
Vcc
OutputRXD
50%
50%
VOH
VOL
tloop1
50%
tloop
2
RL= 60
(seeNoteB )
CANH
CANH
TXD
±1 %
W
(seeNote A )
CL
VI
VOD
GND 1
Vcc
VI
VOD 500 mV
900 mV
0 V
VOD(D)
0 V
tdom
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
Figure 8. Peak-to-Peak Output Voltage Test Circuit and Waveform
Figure 9. tLOOP Test Circuit and Voltage Waveforms
A. The input pulse is supplied by a generator having the following characteristics: PRR ≤125 kHz, 50% duty cycle, tr≤6
ns, tf≤6 ns, ZO= 50Ω.
B. CLincludes instrumentation and fixture capacitance within ±20%.
Figure 10. Dominant Timeout Test Circuit and Voltage Waveforms
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Product Folder Link(s): ISO1050 ISO1050L
IOS
TXD
-12 Vor 12 V
0 VorVCC 1
CANH
CANL VI
GND2
IOS (P)
IOS (SS)
15 s
VI
10 ms
0 V
0 V
12 V
-12 V
or
0 V
VI
TXD
RXD
15pF
+
VO±20%
W60
CANH
CANL
±1%
CL
NOTE: CL= 100 pF
includesinstrumentation
andfixturecapacitance
within± 20%.
VCC 2
VI
0 V
GND 1
VOH
VCC2
0 V
tfs
VO
VI
2.7 V
VOL
50%
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
Figure 11. Driver Short-Circuit Current Test Circuit and Waveforms
Figure 12. Failsafe Delay Time Test Circuit and Voltage Waveforms
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VOL
VOH or
TXD
RXD
VCC 1
1 k W
60 W
VCC2
GND 1
VTEST
GND 2
CL= 15 pF
(includesprobeand
jigcapacitance)
C = 0.1 F 1%
m±CANH
CANL
GND1
C = 0.1 F
m
±1%
S 1
2.0 V
0.8 V
VOL
VOH or
GND2
ISO1050
30 W
CANH
CANL
47nF 10 nF
Spectrum Analyzer
TXD
500kbps
30 W
6.2kW
6.2kW
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
Figure 13. Common-Mode Transient Immunity Test Circuit
Figure 14. Electromagnetic Emissions Measurement Setup
DEVICE INFORMATION
FUNCTION TABLE(1)
DRIVER RECEIVER
INPUTS OUTPUTS DIFFERENTIAL INPUTS OUTPUT
BUS STATE BUS STATE
VID = CANH–CANL RXD
TXD CANH CANL
L(2) H L DOMINANT VID ≥0.9 V L DOMINANT
H Z Z RECESSIVE 0.5 V <VID <0.9 V ? ?
Open Z Z RECESSIVE VID ≤0.5 V H RECESSIVE
X Z Z RECESSIVE Open H RECESSIVE
(1) H = high level; L = low level; X = irrelevant; ? = indeterminate; Z = high impedance
(2) Logic low pulses to prevent dominant time-out.
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ISO1050L
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ISOLATOR CHARACTERISTICS (1) (2)
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air 6.1 mm
DUB-8
Minimum external tracking Shortest terminal to terminal distance across the
L(I02) 6.8 mm
(Creepage) package surface
L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air 8.34 mm
DW-16
Minimum external tracking Shortest terminal to terminal distance across the
L(I02) 8.10 mm
(Creepage) package surface
Minimum Internal Gap (Internal Distance through the insulation 0.014 mm
Clearance) Input to output, VIO = 500 V, all pins on each side of the
barrier tied together creating a two-terminal device, >1012 Ω
RIO Isolation resistance Tamb <100°C
Input to output VIO = 500 V, 100°C≤Tamb ≤Tamb max >1011 Ω
CIO Barrier capacitance VI= 0.4 sin (4E6πt) 1.9 pF
CIInput capacitance to ground VI= 0.4 sin (4E6πt) 1.3 pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on
the printed circuit board do not reduce this distance.
(2) Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation
Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
INSULATION CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS SPECIFICATION UNIT
ISO1050DUB and ISO1050LDW 560
Maximum working insulation
VIORM Vpeak
voltage per IEC ISO1050DW 1200 (1)
ISO1050DUB and ISO1050LDW VPR = 1.875 x VIORM, t = 1 1050
VPR Input to output test voltage per IEC sec (100% production) Vpeak
ISO1050DW 2250
Partial discharge <5 pC
t = 60 sec (qualification)
VIOTM Transient overvoltage per IEC 4000 Vpeak
t = 1 sec (100% production)
t = 60 sec (qualification) 2500
ISO1050DUB and ISO1050LDW Vrms
t = 1 sec (100% production) 3000
VISO Isolation voltage per UL t = 60 sec (qualification) 4243
ISO1050DW Vrms
t = 1 sec (100% production) 5092
RSIsolation voltage per UL VIO = 500 V at TS>109Ω
Pollution Degree 2
(1) For applications that require DC working voltages between GND1 and GND2, please contact Texas Instruments for further details.
IEC 60664-1 RATINGS
PARAMETER TEST CONDITIONS SPECIFICATION
Basic isolation group Material group II
Rated mains voltage ≤150 Vrms I–IV
Rated mains voltage ≤300 Vrms I–III
Installation classification Rated mains voltage ≤400 Vrms I–II
Rated mains voltage ≤600 Vrms (ISO1050DW only) I-II
Rated mains voltage ≤848 Vrms (ISO1050DW only) I
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ISO1050L
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SLLS983E –JUNE 2009–REVISED DECEMBER 2011
IEC SAFETY LIMITING VALUES
safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of
the IO can allow low resistance to ground or the supply and, without current limiting dissipate sufficient power to overheat the
die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θJA = 73.3 °C/W, VI= 5.5 V, TJ= 150°C, TA= 25°C 310
DUB-8 mA
θJA = 73.3 °C/W, VI= 3.6 V, TJ= 150°C, TA= 25°C 474
ISSafety input, output, or supply current θJA = 76 °C/W, VI= 5.5 V, TJ= 150°C, TA= 25°C 299
DW-16 mA
θJA = 76 °C/W, VI= 3.6 V, TJ= 150°C, TA= 25°C 457
TSMaximum case temperature 150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assured junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
REGULATORY INFORMATION
VDE TUV CSA UL
Certified according to DIN EN 60747-5-2 Certified according to EN/UL/CSA Approved under CSA Component Recognized under 1577
60950-1 Acceptance Notice #5A (1)Component Recognition
Program
Basic Insulation ISO1050DW: 5000 VRMS Reinforced Insulation Double Protection
Transient Overvoltage, 4000 VPK 2 Means of Patient Protection at 125 ISO1050DUB: 2500 VRMS
5000 VRMS Reinforced Insulation,
Surge Voltage, 4000 VPK VRMS per IEC 60601-1 (3rd Ed.) ISO1050DW: 3500 VRMS,
400 VRMS maximum working voltage
Maximum Working Voltage, 1200 VPK 4243 VRMS Single Protection
5000 VRMS Basic Insulation,
(ISO1050DW) and Certification pending
600 VRMS maximum working voltage ISO1050LDW Certification
560 VPK (ISO1050DUB) ISO1050DUB and ISO1050LDW: pending
ISO1050LDW certification is pending 2500 VRMS Reinforced Insulation,
400 VRMS maximum working voltage
2500 VRMS Basic Insulation,
600 VRMS maximum working voltage
File Number: 40016131 Certificate Number: U8V 11 09 77311 File Number: 220991 File Number: E181974
008
(1) Production tested ≥3000 VRMS (ISO1050DUB and ISO1050LDW) and 5092 VRMS (ISO1050DW) for 1 second in accordance with UL
1577.
THERMAL INFORMATION (DUB-8 PACKAGE)
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K Thermal Resistance(1) 120 °C/W
θJA Junction-to-air High-K Thermal Resistance 73.3 °C/W
Junction-to-board thermal
θJB Low-K Thermal Resistance 10.2 °C/W
resistance
θJC Junction-to-case thermal resistance Low-K Thermal Resistance 14.5 °C/W
VCC1= 5.5V, VCC2= 5.25V, TA=105°C, RL= 60Ω,
PDDevice power dissipation TXD input is a 500kHz 50% duty-cycle square 200 mW
wave
Tj shutdown Thermal shutdown temperature(2) 190 °C
(1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.
(2) Extended operation in thermal shutdown may affect device reliability.
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Product Folder Link(s): ISO1050 ISO1050L
10
100
0 250 500 750 1000
V – WorkingVoltage – V
IORM
LifeExpectancy – Years
880120
V at560V
IORM
28 Years
G001
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
THERMAL INFORMATION (DW-16 PACKAGE) ISO1050
THERMAL METRIC(1) DW UNITS
16
θJA Junction-to-ambient thermal resistance 76.0
θJCtop Junction-to-case (top) thermal resistance 41
θJB Junction-to-board thermal resistance 47.7 °C/W
ψJT Junction-to-top characterization parameter 14.4
ψJB Junction-to-board characterization parameter 38.2
θJCbot Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
LIFE EXPECTANCY vs WORKING VOLTAGE (ISO1050DW and ISO1050LDW)
Figure 15. Life Expectancy vs Working Voltage
12 Submit Documentation Feedback Copyright ©2009–2011, Texas Instruments Incorporated
Product Folder Link(s): ISO1050 ISO1050L
RXDOutput
Vcc2
CANL
CANHandCANL Outputs
CANHInput
Vcc2
Input
TXDInput
CANL Input
Vcc2
Input
CANH
10kW
20kW
10kW
10kW
10kW
20kW
40V
40V
40V
40V
OUT
8W
13 W
IN
1MW
500 W
VCC1 VCC1 VCC1
VCC1
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
EQUIVALENT I/O SCHEMATICS
Copyright ©2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): ISO1050 ISO1050L
145
147
149
151
153
155
157
159
161
163
-60 -40 -20 0 20 40 60 80 100 120
T -Free-AirTemperature-°C
A
LoopTime-ns
V 1=3V,
V 2=4.75V
CC
CC
V 1=5.5V,
V 2=5.25V
CC
CC
V 1=5V,
V 2=5V
CC
CC
140
150
160
170
180
190
200
-60 -40 -20 0 20 40 60 80 100 120
T -Free-AirTemperature-°C
A
LoopTime-ns
V 1=3V,
V 2=4.75V
CC
CC
V 1=5V,
V 2=5V
CC
CC
V 1=5.5V,
V 2=5.25V
CC
CC
1
1.5
2
2.5
3
3.5
V =CANH
O
-60 -40 -20 0 20 40 60 80 100 120
T -Free-AirTemperature-°C
A
V -OutputVoltage-V
O
V =CANL
O
1
10
100
250 350 450 550 650 750 850 950
SignalingRate-kbps
I 1=3.3V
CC
I 1=5V
CC
I 2=5V
CC
I -SupplyCurrent-mA
CC
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS
RECESSIVE-TO-DOMINANT LOOP TIME DOMINANT-TO-RECESSIVE LOOP TIME
vs vs
FREE-AIR TEMPERATURE (across Vcc) FREE-AIR TEMPERATURE (across Vcc)
Figure 16. Figure 17.
SUPPLY CURRENT (RMS) DRIVER OUTPUT VOLTAGE
vs vs
SIGNALING RATE (kbps) FREE-AIR TEMPERATURE
Figure 18. Figure 19.
14 Submit Documentation Feedback Copyright ©2009–2011, Texas Instruments Incorporated
Product Folder Link(s): ISO1050 ISO1050L
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
TYPICAL CHARACTERISTICS (continued)
EMISSIONS SPECTRUM TO 10 MHz EMISSIONS SPECTRUM TO 50 MHz
Figure 20. Figure 21.
Copyright ©2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): ISO1050 ISO1050L
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
APPLICATION INFORMATION
DOMINANT TIME-OUT
A dominant time-out circuit in the ISO1050 prevents the driver from blocking network communications if a local
controller fault occurs. The time-out circuit is triggered by a falling edge on TXD. If no rising edge occurs on TXD
before the time-out of the circuits expires, the driver is disabled to prevent the local node from continuously
transmitting a Dominant bit. If a rising edge occurs on TXD, commanding a Recessive bit, the timer will be reset
and the driver will be re-enabled. The time-out value is set so that normal CAN communication will not cause the
Dominant time-out circuit to expire.
FAILSAFE
If the bus-side power supply Vcc2 is lower than about 2.7V, the power shutdown circuits in the ISO1050 will
disable the transceiver to prevent spurious transitions due to an unstable supply. If Vcc1 is still active when this
occurs, the receiver output will go to a failsafe HIGH value in about 6 microseconds.
THERMAL SHUTDOWN
The ISO1050 has an internal thermal shutdown circuit that turns off the driver outputs when the internal
temperature becomes too high for normal operation. This shutdown circuit prevents catastrophic failure due to
short-circuit faults on the bus lines. If the device cools sufficiently after thermal shutdown, it will automatically
re-enable, and may again rise in temperature if the bus fault is still present. Prolonged operation with thermal
shutdown conditions may affect device reliability.
BUS LOADING
In the CAN standard ISO 11898-2 the driver differential output is specified with a 60Ωload (must be greater than
1.5V) and with a fully-loaded bus (must be greater than 1.2V). The ISO1050 is specified to meet the 1.5V
requirement with a 60Ωload, and 1.4V with a 45Ωload. The differential input resistance of the ISO1050 is a
minimum of 30KΩ. If the 167 transceivers are in parallel on a bus, this is equivalent to a 180Ωdifferential load.
That transceiver load of 180Ωin parallel with the 60Ω(two 120Ωtermination resistors) gives a total 45Ω.
Therefore, the ISO1050 supports over 167 transceivers on a single bus segment, with margin to the 1.2V CAN
requirement.
16 Submit Documentation Feedback Copyright ©2009–2011, Texas Instruments Incorporated
Product Folder Link(s): ISO1050 ISO1050L
ISO1050
ISO1050L
www.ti.com
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
REVISION HISTORY
Changes from Original (June 2009) to Revision A Page
•Added Typical 25-Year Life at Rated Working Voltage to Features ..................................................................................... 1
•Added LIFE EXPECTANCY vs WORKING VOLTAGE section .......................................................................................... 12
Changes from Revision A (Sept 2009) to Revision B Page
•Added information that IEC 60747-5-2 and IEC61010-1 have been approved .................................................................... 1
•Changed DW package from preview to production data ...................................................................................................... 1
•Added Insulation Characteristics and IEC 60664-1 Ratings tables .................................................................................... 10
•Added IEC file number ........................................................................................................................................................ 11
•Added DW-16 thermal information table ............................................................................................................................. 12
Changes from Revision B (June 2009) to Revision C Page
•Changed the IEC 60747-5-2 Features bullet From: DW package Approval Pending To: VDE approved for both DUB
and DW packages ................................................................................................................................................................ 1
•Changed the Minimum Interal Gap value from 0.008 to 0.014 in the Isolator Characteristics table .................................. 10
•Changed VIORM Specification From: 1300 To: 1200 per VDE certification ......................................................................... 10
•Changed VPR Specification From 2438 To: 2250 ............................................................................................................... 10
•Added the Bus Loading paragraph to the Application Information section ......................................................................... 16
Changes from Revision C (July 2010) to Revision D Page
•Changed the SUPPLY CURRENT table for ICC1 1st row From: Typ = 1 To: 1.8 and MAX = 2 To: 2.8 ............................... 3
•Changed the SUPPLY CURRENT table for ICC1 2nd row From: Typ = 2 To: 2.8 and MAX = 3 To: 3.6 .............................. 3
•Changed the REGULATORY INFORMATION table .......................................................................................................... 11
Copyright ©2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): ISO1050 ISO1050L
ISO1050
ISO1050L
SLLS983E –JUNE 2009–REVISED DECEMBER 2011
www.ti.com
Changes from Revision D (June 2011) to Revision E Page
•Added device ISO1050L ....................................................................................................................................................... 1
•Changed (DW Package) in the Features list to (ISO1050DW) ............................................................................................ 1
•Changed (DUB Package) in the Features list to (ISO1050DUB and ISO1050LDW) ........................................................... 1
•Deleted IEC 60950-1 from the CSA Approvals Feature bullet ............................................................................................. 1
•From: IEC 60601-1 (Medical) and CSA Approvals Pending To: IEC 60601-1 (Medical) and CSA Approved ..................... 1
•Added Feature - 5 KVRMS Reinforced.. .............................................................................................................................. 1
•Changed DW Package to ISO105DW and DUB package to ISO1050DUB and ISO1050LDW in the first paragraph
of DESCRIPTION ................................................................................................................................................................. 1
•Added the AVAILABLE OPTIONS table submitted to TIS ................................................................................................... 2
•Added Note 1 to the INSULATION CHARACTERISTICS table ......................................................................................... 10
•Changed VIORM From: 8-DUB Package to ISO1050DUB and ISO1050LDW ..................................................................... 10
•Changed VIORM From: 16-DW to ISO1050DW .................................................................................................................... 10
•Changed the VISO Isolation voltage per UL section of the INSULATION CHARACTERISTICS table. .............................. 10
•Changed the IEC 60664-1 Ratings Table ........................................................................................................................... 10
•Changed the REGULATORY INFORMATION table .......................................................................................................... 11
•Changed From: File Number: 220991 (Approval Pending) To: File Number: 220991 ....................................................... 11
•Changed in note (1) 3000 to 2500 and 6000 to 5000 ........................................................................................................ 11
•Changed in LIFE EXPECTANCY vs WORKING VOLTAGE (8-DUB PACKAGE TO: LIFE.....(ISO1050DW and
ISO1050LDW) ..................................................................................................................................................................... 12
18 Submit Documentation Feedback Copyright ©2009–2011, Texas Instruments Incorporated
Product Folder Link(s): ISO1050 ISO1050L
PACKAGE OPTION ADDENDUM
www.ti.com 26-Jun-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
ISO1050DUB ACTIVE SOP DUB 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-4-260C-72 HR
ISO1050DUBR ACTIVE SOP DUB 8 350 Green (RoHS
& no Sb/Br) CU NIPDAU Level-4-260C-72 HR
ISO1050DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-4-260C-72 HR
ISO1050DWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-4-260C-72 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ISO1050DUBR SOP DUB 8 350 330.0 24.4 10.9 10.01 5.85 16.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ISO1050DUBR SOP DUB 8 350 358.0 335.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Aug-2012
Pack Materials-Page 2
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