ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com ISOLATED CAN TRANSCEIVER Check for Samples: ISO1050, ISO1050L FEATURES 1 * * 2 * * * * * * * * * * * * 5000-VRMS Isolation (ISO1050DW) 2500-VRMS Isolation (ISO1050DUB and ISO1050LDW) Failsafe Outputs Low Loop Delay: 150 ns Typical 50 kV/s Typical Transient Immunity Meets or Exceeds ISO 11898 requirements Bus-Fault Protection of -27 V to 40 V Dominant Time-Out Function IEC 60747-5-2 (VDE 0884, Rev. 2) & IEC 61010-1 Approved UL 1577 Double Protection Approved; See Regulatory Information section for details IEC 60601-1 (Medical) and CSA Approved 5 KVRMS Reinforced Insulation per TUV Approved for EN/UL/CSA 60950-1 (ISO1050DW) 3.3-V Inputs are 5-V Tolerant Typical 25-Year Life at Rated Working Voltage (see Application Report SLLA197 and Figure 15) APPLICATIONS * * * * * * * CAN Data Buses Industrial Automation - DeviceNet Data Buses - CANopen Data Buses - CANKingdom Data Buses Medical Scanning and Imaging Security Systems Telecom Base Station Status and Control HVAC Building Automation DESCRIPTION The ISO1050 is a galvanically isolated CAN transceiver that meets or exceeds the specifications of the ISO 11898 standard. The device has the logic input and output buffers separated by a silicon oxide (SiO2) insulation barrier that provides galvanic isolation of up to 5000 VRMS for ISO1050DW and 2500 VRMS for ISO1050DUB and ISO1050LDW. Used in conjunction with isolated power supplies, the device prevents noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. As a CAN transceiver, the device provides differential transmit capability to the bus and differential receive capability to a CAN controller at signaling rates up to 1 megabit per second (Mbps). Designed for operation in especially harsh environments, the device features cross-wire, overvoltage and loss of ground protection from -27 V to 40 V and over-temperature shut-down, as well as -12 V to 12 V common-mode range. The ISO1050 is characterized for operation over the ambient temperature range of -55C to 105C. DW PACKAGE GND1 GND1 1 2 16 15 Vcc2 GND2 3 4 5 6 7 8 14 13 12 nc CANH CANL nc 11 10 9 RXD TXD GALVANIC ISOLATION Vcc1 GND1 RXD nc nc TXD DUB PACKAGE FUNCTION DIAGRAM CANH Vcc1 RXD 1 2 TXD GND1 3 4 8 7 6 5 Vcc2 CANH CANL GND2 CANL GND2 GND2 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DeviceNet is a trademark of others. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2009-2011, Texas Instruments Incorporated ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS PRODUCT RATED ISOLATION PACKAGE MARKED AS ISO1050DUB 2500 VRMS DUB-8 ISO1050 ORDERING NUMBER ISO1050DUB (rail) ISO1050DUBR (reel) ISO1050LDW (1) 2500 VRMS (2) DW-16 ISO1050L ISO1050LDW (rail) ISO1050LDWR (reel) ISO1050DW 5000 VRMS DW-16 ISO1050 ISO1050DW (rail) ISO1050DWR (reel) (1) (2) Product Preview Certifiactions Pending ABSOLUTE MAXIMUM RATINGS (1) (2) VALUE / UNIT (3) -0.5 V to 6 V VCC1, VCC2 Supply voltage VI Voltage input (TXD) -0.5 V to 6 V VCANH or VCANH Voltage range at any bus terminal (CANH, CANL) -27 V to 40 V IO Receiver output current ESD 15 mA Human Body Model JEDEC Standard 22, Method A114-C.01 Charged Device Model Machine Model Bus pins and GND2 (4) 4 kV All pins 4 kV JEDEC Standard 22, Test Method C101 All pins 1.5 kV ANSI/ESDS5.2-1996 All pins 200 V Tstg Storage temperature -65C to 150C TJ Junction temperature -55C to 150C (1) (2) (3) (4) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. This isolator is suitable for basic isolation within the safety limiting data. Maintenance of the safety data must be ensured by means of protective circuitry. All input and output logic voltage values are measured with respect to the GND1 logic side ground. Differential bus-side voltages are measured to the respective bus-side GND2 ground terminal. Tested while connected between Vcc2 and GND2. RECOMMENDED OPERATING CONDITIONS MIN VCC1 Supply voltage, controller side VCC2 Supply voltage, bus side VI or VIC Voltage at bus pins (separately or common mode) VIH High-level input voltage TXD VIL Low-level input voltage TXD VID Differential input voltage NOM 3 4.75 5 MAX V 5.25 V -12 (1) 12 V 2 5.25 V 0 0.8 V -7 7 V -70 Driver UNIT 5.5 IOH High-level output current IOL Low-level output current TA Ambient Temperature -55 105 C TJ Junction temperature (see THERMAL CHARACTERISTICS) -55 125 C (1) 2 mA -4 Receiver Driver 70 Receiver 4 mA The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com SUPPLY CURRENT over recommended operating conditions (unless otherwise noted) PARAMETER ICC1 VCC1 Supply current ICC2 VCC2 Supply current (1) MIN TYP (1) MAX TEST CONDITIONS VI = 0 V or VCC1 , VCC1 = 3.3V 1.8 2.8 VI = 0 V or VCC1 , VCC1 = 5V 2.3 3.6 Dominant VI = 0 V, 60- Load 52 73 Recessive VI = VCC1 8 12 UNIT mA mA All typical values are at 25C with VCC1 = VCC2 = 5V. DEVICE SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tloop1 Total loop delay, driver input to receiver output, Recessive to Dominant See Figure 9 112 150 210 ns tloop2 Total loop delay, driver input to receiver output, Dominant to Recessive See Figure 9 112 150 210 ns DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER VO(D) Bus output voltage (Dominant) VO(R) Bus output voltage (Recessive) VOD(D) TEST CONDITIONS CANH CANL Differential output voltage (Dominant) MIN TYP MAX 2.9 3.5 4.5 0.8 1.2 1.5 See Figure 1 and Figure 2, VI = 2 V, RL= 60 2 2.3 3 See Figure 1, Figure 2 and Figure 3, VI = 0 V, RL = 60 1.5 3 See Figure 1, Figure 2, and Figure 3 VI = 0 V, RL = 45, Vcc > 4.8V 1.4 3 See Figure 1 and Figure 2, VI = 3 V, RL = 60 -0.12 0.012 -0.5 0.05 See Figure 1 and Figure 2, VI = 0 V, RL = 60 VOD(R) Differential output voltage (Recessive) VOC(D) Common-mode output voltage (Dominant) VOC(pp) Peak-to-peak common-mode output voltage IIH High-level input current, TXD input VI at 2 V IIL Low-level input current, TXD input VI at 0.8 V IO(off) Power-off TXD leakage current VCC1, VCC2 at 0 V, TXD at 5 V VI = 3 V, No Load 2.3 3 0.3 5 -5 -105 See Figure 11, VCANH = 12 V, CANL Open IOS(ss) Short-circuit steady-state output current CO Output capacitance See receiver input capacitance CMTI Common-mode transient immunity See Figure 13, VI = VCC or 0 V See Figure 11, VCANL =-12 V, CANH Open V See Figure 11, VCANL = 12 V, CANH Open 1 -0.5 71 25 V A A -72 0.36 -1 V A 10 See Figure 11, VCANH = -12 V, CANL Open V V 2 See Figure 8 UNIT mA 105 50 kV/s DRIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, recessive-to-dominant output tPHL Propagation delay time, dominant-to-recessive output tr Differential output signal rise time tf Differential output signal fall time tdom Dominant time-out See Figure 4 CL=100 pF, See Figure 10 Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L MIN TYP MAX 31 74 110 25 44 75 20 50 300 20 50 450 700 Submit Documentation Feedback UNIT ns s 3 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Positive-going bus input threshold voltage VIT- Negative-going bus input threshold voltage Vhys Hysteresis voltage (VIT+ - VIT-) VOH High-level output voltage with Vcc = 5V VOH High-level output voltage with Vcc1 = 3.3V VOL Low-level output voltage CI See Table 1 MIN 500 TYP (1) MAX UNIT 750 900 mV 650 mV 150 mV IOH = -4 mA, See Figure 6 VCC - 0.8 4.6 IOH = -20 A, See Figure 6 VCC - 0.1 5 IOL = 4 mA, See Figure 6 VCC - 0.8 3.1 IOL = 20 A, See Figure 6 VCC - 0.1 3.3 V V IOL = 4 mA, See Figure 6 0.2 0.4 IOL = 20 A, See Figure 6 0 0.1 Input capacitance to ground, (CANH or CANL) TXD at 3 V, VI = 0.4 sin (4E6t) + 2.5V 6 CID Differential input capacitance TXD at 3 V, VI = 0.4 sin (4E6t) RID Differential input resistance TXD at 3 V 30 RIN Input resistance (CANH or CANL) TXD at 3 V 15 RI(m) Input resistance matching (1 - [RIN (CANH) / RIN (CANL)]) x 100% VCANH = VCANL CMTI Common-mode transient immunity VI = VCC or 0 V, See Figure 13 (1) V pF 3 pF 80 k 30 40 k -3% 0% 3% 25 50 kV/s All typical values are at 25C with VCC1 = VCC2 = 5V. RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tr Output signal rise time tf Output signal fall time tfs Failsafe output delay time from bus-side power loss 4 Submit Documentation Feedback TXD at 3 V, See Figure 6 VCC1 at 5 V, See Figure 12 MIN TYP MAX 66 90 130 51 80 105 3 6 3 6 6 UNIT ns s Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION Dominant 3.5 V IO(CANH) VO (CANH) CANH II 0 or Vcc1 Recessive TXD GND1 VOD CANL RL IO(CANL) GND2 2.5 V VO(CANH) + VO(CANL) 2 1.5 V VOC VO (CANL) VI VO(CANH) VO(CANL ) GND1 GND2 Figure 1. Driver Voltage, Current and Test Definitions Figure 2. Bus Logic State Voltage Definitions 330 W 1% CANH 0V TXD VOD 60 W 1% + _ CANL -2 V < V test < 7 V GND2 330 W 1% Figure 3. Driver VOD with Common-mode Loading Test Circuit Vcc VI CANH TXD 60 W 1% VO VI t PLH t PHL VO(D) 90% 0.9V VO (SEE NOTE A) Vcc/2 0V CL = 100 pF 20% (SEE NOTE B) CANL Vcc/2 0.5V 10% tr tf A. The input pulse is supplied by a generator having the following characteristics: PRR 125 kHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50. B. CL includes instrumentation and fixture capacitance within 20%. VO(R) Figure 4. Driver Test Circuit and Voltage Waveforms CANH VIC = VI(CANH) + VI(CANL) 2 IO RXD VID CANL VI(CANH) VO VI(CANL) GND2 GND1 Figure 5. Receiver Voltage and Current Definitions Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 5 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) CANH IO 3.5 V RXD V I 2.4 V 2 V CANL 1.5 V t pHL t pLH VI CL = 15 pF 20 % (SEE NOTE B) VO (SEE NOTE A) 1 .5 V V OH 90 % 0.7 Vcc 1 0.3 Vcc 1 V O 10 % tf tr V OL GND 1 GND 2 A. The input pulse is supplied by a generator having the following characteristics: PRR 125 kHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50. B. CL includes instrumentation and fixture capacitance within 20%. Figure 6. Receiver Test Circuit and Voltage Waveforms Table 1. Differential Input Voltage Threshold Test INPUT OUTPUT VCANH VCANL |VID| -11.1 V -12 V 900 mV L R 12 V 11.1 V 900 mV L -6 V -12 V 6V L 12 V 6V 6V L -11.5 V -12 V 500 mV H 12 V 11.5 V 500 mV H -12 V -6 V -6 V H 6V 12 V -6 V H Open Open X H 1 nF VOL VOH CANH RXD CANL 15 pF 1 nF TXD + VI _ GND1 GND2 The waveforms of the applied transients are in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, and 3b. Figure 7. Transient Over-Voltage Test Circuit 6 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com 27 W 1 % CANH TXD CANL 47 nF VI 27 W 1 % V OC 20% GND 1 = V (CANH) + V (CANL) O O 2 GND 2 V OC(pp) V OC Figure 8. Peak-to-Peak Output Voltage Test Circuit and Waveform CANH VI TXD 60 W 1% Vcc TXD Input CANL 50% 0V tloop 2 RXD RXD Output + VO _ t loop1 VOH 50% 50% VOL 15 pF 20% GND1 Figure 9. tLOOP Test Circuit and Voltage Waveforms Vcc VI CANH TXD RL= 60 W 1 % CL 0V VOD V OD (D) (see Note B ) (see Note A ) CANH VOD VI 900 mV 500 mV t dom GND 1 A. The input pulse is supplied by a generator having the following characteristics: PRR 125 kHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50. B. CL includes instrumentation and fixture capacitance within 20%. 0V Figure 10. Dominant Timeout Test Circuit and Voltage Waveforms Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 7 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com IOS (SS) I OS (P) I OS 15 s CANH TXD 0V 0 V or VCC 1 12 V CANL VI -12 V or 12 V VI 0V GND2 or 10 ms 0V VI -12 V Figure 11. Driver Short-Circuit Current Test Circuit and Waveforms VI VCC 2 CANH 0V TXD VCC2 CL 60 W 1% VI 0V t fs CANL VOH 50% VO RXD + VO 2.7 V VOL 15pF 20% GND 1 NOTE: CL = 100pF includes instrumentation and fixture capacitance within 20%. Figure 12. Failsafe Delay Time Test Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com C = 0.1 mF 1% 2.0 V VCC 1 VCC2 CANH C = 0.1 mF 1% GND2 GND1 TXD 60 W S1 VOH or VOL CANL 0.8 V RXD VOH or VOL 1 kW GND 1 GND 2 CL = 15 pF (includes probe and jig capacitance) V TEST Figure 13. Common-Mode Transient Immunity Test Circuit CANH ISO1050 47nF 30 W Spectrum Analyzer 6.2 kW 10 nF 30 W TXD 500kbps CANL 6.2 kW Figure 14. Electromagnetic Emissions Measurement Setup DEVICE INFORMATION FUNCTION TABLE (1) DRIVER INPUTS (1) (2) OUTPUTS RECEIVER BUS STATE DIFFERENTIAL INPUTS VID = CANH-CANL OUTPUT RXD BUS STATE L DOMINANT VID 0.9 V L DOMINANT TXD CANH CANL L (2) H H Z Z RECESSIVE 0.5 V < VID < 0.9 V ? ? Open Z Z RECESSIVE VID 0.5 V H RECESSIVE X Z Z RECESSIVE Open H RECESSIVE H = high level; L = low level; X = irrelevant; ? = indeterminate; Z = high impedance Logic low pulses to prevent dominant time-out. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 9 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 ISOLATOR CHARACTERISTICS www.ti.com (1) (2) over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air L(I02) Minimum external tracking (Creepage) Shortest terminal to terminal distance across the package surface L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air L(I02) RIO Minimum external tracking (Creepage) Shortest terminal to terminal distance across the package surface Minimum Internal Gap (Internal Clearance) Distance through the insulation Isolation resistance DUB-8 DW-16 TYP MAX UNIT 6.1 mm 6.8 mm 8.34 mm 8.10 mm 0.014 mm Input to output, VIO = 500 V, all pins on each side of the barrier tied together creating a two-terminal device, Tamb < 100C >1012 Input to output VIO = 500 V, 100C Tamb Tamb max >1011 CIO Barrier capacitance VI = 0.4 sin (4E6t) 1.9 pF CI Input capacitance to ground VI = 0.4 sin (4E6t) 1.3 pF (1) (2) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. INSULATION CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS ISO1050DUB and ISO1050LDW VIORM Maximum working insulation voltage per IEC VPR Input to output test voltage per IEC VIOTM Transient overvoltage per IEC 1200 ISO1050DW VPR = 1.875 x VIORM, t = 1 sec (100% production) Partial discharge < 5 pC t = 60 sec (qualification) t = 1 sec (100% production) ISO1050DUB and ISO1050LDW Isolation voltage per UL ISO1050DW RS 560 ISO1050DW ISO1050DUB and ISO1050LDW VISO Isolation voltage per UL UNIT Vpeak (1) 1050 Vpeak 2250 4000 t = 60 sec (qualification) 2500 t = 1 sec (100% production) 3000 t = 60 sec (qualification) 4243 t = 1 sec (100% production) 5092 VIO = 500 V at TS > 109 Pollution Degree (1) SPECIFICATION Vpeak Vrms Vrms 2 For applications that require DC working voltages between GND1 and GND2, please contact Texas Instruments for further details. IEC 60664-1 RATINGS PARAMETER Basic isolation group Installation classification 10 TEST CONDITIONS SPECIFICATION Material group II Rated mains voltage 150 Vrms I-IV Rated mains voltage 300 Vrms I-III Rated mains voltage 400 Vrms I-II Rated mains voltage 600 Vrms (ISO1050DW only) I-II Rated mains voltage 848 Vrms (ISO1050DW only) I Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com IEC SAFETY LIMITING VALUES safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS DUB-8 IS Safety input, output, or supply current DW-16 TS MIN TYP MAX UNIT JA = 73.3 C/W, VI = 5.5 V, TJ = 150C, TA = 25C 310 JA = 73.3 C/W, VI = 3.6 V, TJ = 150C, TA = 25C 474 JA = 76 C/W, VI = 5.5 V, TJ = 150C, TA = 25C 299 JA = 76 C/W, VI = 3.6 V, TJ = 150C, TA = 25C 457 Maximum case temperature mA mA C 150 The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assured junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. REGULATORY INFORMATION VDE TUV CSA UL Certified according to DIN EN 60747-5-2 Certified according to EN/UL/CSA 60950-1 Approved under CSA Component Acceptance Notice #5A Recognized under 1577 (1) Component Recognition Program Basic Insulation Transient Overvoltage, 4000 VPK Surge Voltage, 4000 VPK Maximum Working Voltage, 1200 VPK (ISO1050DW) and 560 VPK (ISO1050DUB) ISO1050LDW certification is pending ISO1050DW: 5000 VRMS Reinforced Insulation, 400 VRMS maximum working voltage 5000 VRMS Basic Insulation, 600 VRMS maximum working voltage ISO1050DUB and ISO1050LDW: 2500 VRMS Reinforced Insulation, 400 VRMS maximum working voltage 2500 VRMS Basic Insulation, 600 VRMS maximum working voltage 5000 VRMS Reinforced Insulation 2 Means of Patient Protection at 125 VRMS per IEC 60601-1 (3rd Ed.) Double Protection ISO1050DUB: 2500 VRMS ISO1050DW: 3500 VRMS, 4243 VRMS Single Protection Certification pending ISO1050LDW Certification pending File Number: 40016131 Certificate Number: U8V 11 09 77311 008 File Number: 220991 File Number: E181974 (1) Production tested 3000 VRMS (ISO1050DUB and ISO1050LDW) and 5092 VRMS (ISO1050DW) for 1 second in accordance with UL 1577. THERMAL INFORMATION (DUB-8 PACKAGE) over recommended operating conditions (unless otherwise noted) PARAMETER MIN (1) TYP MAX UNIT 120 C/W High-K Thermal Resistance 73.3 C/W Low-K Thermal Resistance 10.2 C/W Junction-to-case thermal resistance Low-K Thermal Resistance 14.5 C/W JA Junction-to-air JB Junction-to-board thermal resistance JC PD Device power dissipation Tj shutdown Thermal shutdown temperature (2) (1) (2) TEST CONDITIONS Low-K Thermal Resistance VCC1= 5.5V, VCC2= 5.25V, TA=105C, RL= 60, TXD input is a 500kHz 50% duty-cycle square wave 200 190 mW C Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages. Extended operation in thermal shutdown may affect device reliability. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 11 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com THERMAL INFORMATION (DW-16 PACKAGE) ISO1050 THERMAL METRIC (1) DW UNITS 16 JA Junction-to-ambient thermal resistance JCtop Junction-to-case (top) thermal resistance JB Junction-to-board thermal resistance 47.7 JT Junction-to-top characterization parameter 14.4 JB Junction-to-board characterization parameter 38.2 JCbot Junction-to-case (bottom) thermal resistance n/a (1) 76.0 41 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. LIFE EXPECTANCY vs WORKING VOLTAGE (ISO1050DW and ISO1050LDW) Life Expectancy - Years 100 VIORM at 560 V 28 Years 10 0 120 250 500 750 880 1000 VIORM - Working Voltage - V G001 Figure 15. Life Expectancy vs Working Voltage 12 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com EQUIVALENT I/O SCHEMATICS TXD Input VCC1 RXD Output VCC1 VCC1 VCC1 1 MW 8W 500 W IN OUT 13 W CANL Input CANH Input Vcc2 Vcc2 10 kW 10 kW 20 kW 20 kW Input Input 10 kW 40 V 10 kW 40 V CANH and CANL Outputs Vcc2 CANH CANL 40 V 40 V Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 13 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS RECESSIVE-TO-DOMINANT LOOP TIME vs FREE-AIR TEMPERATURE (across Vcc) DOMINANT-TO-RECESSIVE LOOP TIME vs FREE-AIR TEMPERATURE (across Vcc) 163 200 161 VCC1 = 3 V, VCC2 = 4.75 V 190 159 VCC1 = 3 V, VCC2 = 4.75 V 157 Loop Time - ns Loop Time - ns 180 VCC1 = 5 V, VCC2 = 5 V 170 160 155 VCC1 = 5.5 V, VCC2 = 5.25 V 153 151 149 150 140 -60 VCC1 = 5.5 V, VCC2 = 5.25 V -40 147 VCC1 = 5 V, VCC2 = 5 V 145 -60 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C Figure 16. Figure 17. SUPPLY CURRENT (RMS) vs SIGNALING RATE (kbps) DRIVER OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE 100 3.5 VO = CANH 3 VO - Output Voltage - V ICC - Supply Current - mA ICC2 = 5 V 10 ICC1 = 5 V 1 250 450 550 650 750 850 2 1.5 ICC1 = 3.3 V 350 2.5 950 1 -60 VO = CANL -40 -20 0 20 40 60 80 100 120 TA - Free-Air Temperature - C Signaling Rate - kbps Figure 18. 14 Submit Documentation Feedback Figure 19. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) EMISSIONS SPECTRUM TO 10 MHz EMISSIONS SPECTRUM TO 50 MHz Figure 20. Figure 21. Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 15 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com APPLICATION INFORMATION DOMINANT TIME-OUT A dominant time-out circuit in the ISO1050 prevents the driver from blocking network communications if a local controller fault occurs. The time-out circuit is triggered by a falling edge on TXD. If no rising edge occurs on TXD before the time-out of the circuits expires, the driver is disabled to prevent the local node from continuously transmitting a Dominant bit. If a rising edge occurs on TXD, commanding a Recessive bit, the timer will be reset and the driver will be re-enabled. The time-out value is set so that normal CAN communication will not cause the Dominant time-out circuit to expire. FAILSAFE If the bus-side power supply Vcc2 is lower than about 2.7V, the power shutdown circuits in the ISO1050 will disable the transceiver to prevent spurious transitions due to an unstable supply. If Vcc1 is still active when this occurs, the receiver output will go to a failsafe HIGH value in about 6 microseconds. THERMAL SHUTDOWN The ISO1050 has an internal thermal shutdown circuit that turns off the driver outputs when the internal temperature becomes too high for normal operation. This shutdown circuit prevents catastrophic failure due to short-circuit faults on the bus lines. If the device cools sufficiently after thermal shutdown, it will automatically re-enable, and may again rise in temperature if the bus fault is still present. Prolonged operation with thermal shutdown conditions may affect device reliability. BUS LOADING In the CAN standard ISO 11898-2 the driver differential output is specified with a 60 load (must be greater than 1.5V) and with a fully-loaded bus (must be greater than 1.2V). The ISO1050 is specified to meet the 1.5V requirement with a 60 load, and 1.4V with a 45 load. The differential input resistance of the ISO1050 is a minimum of 30K. If the 167 transceivers are in parallel on a bus, this is equivalent to a 180 differential load. That transceiver load of 180 in parallel with the 60 (two 120 termination resistors) gives a total 45. Therefore, the ISO1050 supports over 167 transceivers on a single bus segment, with margin to the 1.2V CAN requirement. 16 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com REVISION HISTORY Changes from Original (June 2009) to Revision A Page * Added Typical 25-Year Life at Rated Working Voltage to Features ..................................................................................... 1 * Added LIFE EXPECTANCY vs WORKING VOLTAGE section .......................................................................................... 12 Changes from Revision A (Sept 2009) to Revision B Page * Added information that IEC 60747-5-2 and IEC61010-1 have been approved .................................................................... 1 * Changed DW package from preview to production data ...................................................................................................... 1 * Added Insulation Characteristics and IEC 60664-1 Ratings tables .................................................................................... 10 * Added IEC file number ........................................................................................................................................................ 11 * Added DW-16 thermal information table ............................................................................................................................. 12 Changes from Revision B (June 2009) to Revision C Page * Changed the IEC 60747-5-2 Features bullet From: DW package Approval Pending To: VDE approved for both DUB and DW packages ................................................................................................................................................................ 1 * Changed the Minimum Interal Gap value from 0.008 to 0.014 in the Isolator Characteristics table .................................. 10 * Changed VIORM Specification From: 1300 To: 1200 per VDE certification ......................................................................... 10 * Changed VPR Specification From 2438 To: 2250 ............................................................................................................... 10 * Added the Bus Loading paragraph to the Application Information section ......................................................................... 16 Changes from Revision C (July 2010) to Revision D Page * Changed the SUPPLY CURRENT table for ICC1 1st row From: Typ = 1 To: 1.8 and MAX = 2 To: 2.8 ............................... 3 * Changed the SUPPLY CURRENT table for ICC1 2nd row From: Typ = 2 To: 2.8 and MAX = 3 To: 3.6 .............................. 3 * Changed the REGULATORY INFORMATION table .......................................................................................................... 11 Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L Submit Documentation Feedback 17 ISO1050 ISO1050L SLLS983E - JUNE 2009 - REVISED DECEMBER 2011 www.ti.com Changes from Revision D (June 2011) to Revision E Page * Added device ISO1050L ....................................................................................................................................................... 1 * Changed (DW Package) in the Features list to (ISO1050DW) ............................................................................................ 1 * Changed (DUB Package) in the Features list to (ISO1050DUB and ISO1050LDW) ........................................................... 1 * Deleted IEC 60950-1 from the CSA Approvals Feature bullet ............................................................................................. 1 * From: IEC 60601-1 (Medical) and CSA Approvals Pending To: IEC 60601-1 (Medical) and CSA Approved ..................... 1 * Added Feature - 5 KVRMS Reinforced.. .............................................................................................................................. 1 * Changed DW Package to ISO105DW and DUB package to ISO1050DUB and ISO1050LDW in the first paragraph of DESCRIPTION ................................................................................................................................................................. 1 * Added the AVAILABLE OPTIONS table submitted to TIS ................................................................................................... 2 * Added Note 1 to the INSULATION CHARACTERISTICS table ......................................................................................... 10 * Changed VIORM From: 8-DUB Package to ISO1050DUB and ISO1050LDW ..................................................................... 10 * Changed VIORM From: 16-DW to ISO1050DW .................................................................................................................... 10 * Changed the VISO Isolation voltage per UL section of the INSULATION CHARACTERISTICS table. .............................. 10 * Changed the IEC 60664-1 Ratings Table ........................................................................................................................... 10 * Changed the REGULATORY INFORMATION table .......................................................................................................... 11 * Changed From: File Number: 220991 (Approval Pending) To: File Number: 220991 ....................................................... 11 * Changed in note (1) 3000 to 2500 and 6000 to 5000 ........................................................................................................ 11 * Changed in LIFE EXPECTANCY vs WORKING VOLTAGE (8-DUB PACKAGE TO: LIFE.....(ISO1050DW and ISO1050LDW) ..................................................................................................................................................................... 12 18 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated Product Folder Link(s): ISO1050 ISO1050L PACKAGE OPTION ADDENDUM www.ti.com 26-Jun-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ISO1050DUB ACTIVE SOP DUB 8 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR ISO1050DUBR ACTIVE SOP DUB 8 350 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR ISO1050DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR ISO1050DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device ISO1050DUBR Package Package Pins Type Drawing SOP DUB 8 SPQ 350 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 24.4 Pack Materials-Page 1 10.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.01 5.85 16.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ISO1050DUBR SOP DUB 8 350 358.0 335.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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