MC100EPT21 3.3V Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator The MC100EPT21 is a Differential LVPECL/LVDS/CML to LVTTL/LVCMOS translator. Because LVPECL (Positive ECL), LVDS, and positive CML input levels and LVTTL/LVCMOS output levels are used, only +3.3 V and ground are required. The small outline 8-lead SOIC package makes the EPT21 ideal for applications which require the translation of a clock or data signal. The VBB output allows this EPT21 to be cap coupled in either single-ended or differential input mode. When single-ended cap coupled, VBB output is tied to the D input and D is driven for a non-inverting buffer, or VBB output is tied to the D input and D is driven for an inverting buffer. When cap coupled differentially, VBB output is connected through a resistor to each input pin. If used, the VBB pin should be bypassed to VCC via a 0.01 mF capacitor. For additional information see AND8020/D. For a single-ended direct connection use an external voltage reference source such as a resistor divider. Do not use VBB for a single-ended direct connection or port to another device. http://onsemi.com MARKING DIAGRAMS* 8 SO-8 D SUFFIX CASE 751 8 1 1 KPT21 ALYW G 8 TSSOP-8 DT SUFFIX CASE 948R 8 1 1 KA21 ALYWG G Features * * * * * * * * 1.4 ns Typical Propagation Delay Maximum Frequency > 275 MHz Typical DFN8 MN SUFFIX CASE 506AA LVPECL/LVDS/CML Inputs, LVTTL/LVCMOS Outputs 1 3RMG G 24 mA TTL outputs A L Y W M G Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V The 100 Series Contains Temperature Compensation VBB Output Pb-Free Packages are Available = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2010 March, 2010 - Rev. 21 1 Publication Order Number: MC100EPT21/D MC100EPT21 Table 1. PIN DESCRIPTION NC D D VBB 1 8 LVTTL 2 3 7 6 LVPECL 4 5 VCC PIN Q NC FUNCTION Q LVTTL/LVCMOS Output D*, D* Differential LVPECL/LVDS/CML Input VCC Positive Supply VBB Output Reference Voltage GND Ground NC No Connect EP (DFN8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. GND * Pin will default to 1/2 of VCC when left open. Figure 1. Logic Diagram and 8-Lead Pinout (Top View) Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor D 50 kW Internal Input Pulldown Resistor D 50 kW D, D 50 kW Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Charged Device Model > 1.5 kV > 100 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Level 1 Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Transistor Count 81 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit 3.8 V 0 to 3.8 V 0.5 mA VCC PECL Power Supply GND = 0 V VIN PECL Input Voltage GND = 0 V IBB VBB Sink/Source TA Operating Temperature Range -40 to +85 C Tstg Storage Temperature Range -65 to +150 C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SO-8 SO-8 190 130 C/W C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SO-8 41 to 44 C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP-8 TSSOP-8 185 140 C/W C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP-8 41 to 44 C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 C/W C/W Tsol Wave Solder < 2 to 3 sec @ 248C <2 to 3 sec @ 260C 265 265 C qJC Thermal Resistance (Junction-to-Case) 35 to 40 C/W Pb Pb-Free (Note 2) VI VCC DFN8 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. JEDEC standard multilayer board - 2S2P (2 signal, 2 power) http://onsemi.com 2 MC100EPT21 Table 4. PECL INPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0.0 V (Note 3) -40C Max Min Max Min Max Unit Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single-Ended) 1355 1675 1355 1675 1355 1675 mV VBB Output Voltage Reference 1775 1975 1775 1975 1775 1975 mV VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) 3.3 1.2 3.3 1.2 3.3 V IIH Input HIGH Current 150 mA IIL Input LOW Current Characteristic Typ 1875 1.2 Typ 85C VIH Symbol Min 25C 1875 150 -150 Typ 1875 150 -150 -150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Input parameters vary 1:1 with VCC. 4. VIHCMR min varies 1:1 with GND, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 5. LVTTL/LVCMOS OUTPUT DC CHARACTERISTICS VCC = 3.3 V, GND = 0.0 V, TA = -40C to 85C Symbol Characteristic Condition Min VOH Output HIGH Voltage IOH = -3.0 mA VOL Output LOW Voltage IOL = 24 mA ICCH Power Supply Current Outputs set to HIGH 5 ICCL Power Supply Current Outputs set to LOW 8 IOS Output Short Circuit Current Typ Max Unit 2.4 V 0.5 V 17 25 mA 21 30 mA -80 mA -130 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 6. AC CHARACTERISTICS VCC = 3.0 V to 3.6 V, GND = 0.0 V (Note 5) -40C Symbol Min Characteristic 25C Typ fmax Maximum Frequency (Figure 2) 275 350 tPLH, tPHL Propagation Delay to Output Differential 800 1200 1400 1400 tSKEW Duty Cycle Skew (Note 6) 45 50 tSKPP Part-to-Part Skew (Note 6) tJITTER Random Clock Jitter (RMS) VPP Input Voltage Swing (Differential Configuration) tr tf Output Rise/Fall Times (0.8V - 2.0V) Max Min Typ 275 350 2050 1800 800 1200 1400 1400 55 45 50 500 Q, Q 3.5 5 150 800 1200 250 600 900 85C Max Min Typ 275 350 2250 1800 900 1100 1600 1300 55 45 50 Max Unit MHz 2950 1900 ps 55 % 500 ps 3.5 5 ps mV 500 3.5 5 150 800 1200 150 800 1200 250 600 900 250 600 900 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 5. Measured with a 750 mV 50% duty-cycle clock source. RL = 500 W to GND and CL = 20 pF to GND. Refer to FIgure 3. 6. Skews are measured between outputs under identical transitions. Duty cycle skew is measured between differential outputs using the deviations of the sum Tpw- and Tpw+. http://onsemi.com 3 MC100EPT21 3000 VOH VOUTpp (mV) 2500 2000 VOL 0.5 V 1500 1000 500 0 0 50 100 150 200 250 300 350 400 450 500 FREQUENCY (MHz) Figure 2. Fmax APPLICATION TTL RECEIVER CHARACTERISTIC TEST *CL includes fixture capacitance CL * RL AC TEST LOAD GND Figure 3. TTL Output Loading Used For Device Evaluation http://onsemi.com 4 550 600 MC100EPT21 ORDERING INFORMATION Package Shipping SOIC-8 98 Units / Rail MC100EPT21DG SOIC-8 (Pb-Free) 98 Units / Rail MC100EPT21DR2 SOIC-8 2500 / Tape & Reel MC100EPT21DR2G SOIC-8 (Pb-Free) 2500 / Tape & Reel MC100EPT21DT TSSOP-8 100 Units / Rail MC100EPT21DTG TSSOP-8 (Pb-Free) 100 Units / Rail MC100EPT21DTR2 TSSOP-8 2500 / Tape & Reel MC100EPT21DTR2G TSSOP-8 (Pb-Free) 2500 / Tape & Reel MC100EPT21MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb-Free) 1000 / Tape & Reel Device MC100EPT21D MC100EPT21MNR4G For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D - ECL Clock Distribution Techniques AN1406/D - Designing with PECL (ECL at +5.0 V) AN1503/D - ECLinPSt I/O SPiCE Modeling Kit AN1504/D - Metastability and the ECLinPS Family AN1568/D - Interfacing Between LVDS and ECL AN1672/D - The ECL Translator Guide AND8001/D - Odd Number Counters Design AND8002/D - Marking and Date Codes AND8020/D - Termination of ECL Logic Devices AND8066/D - Interfacing with ECLinPS AND8090/D - AC Characteristics of ECL Devices http://onsemi.com 5 MC100EPT21 PACKAGE DIMENSIONS SOIC-8 NB CASE 751-07 ISSUE AJ -X- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. A 8 5 S B 0.25 (0.010) Y M M 1 4 -Y- K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE -Z- 0.10 (0.004) H M D 0.25 (0.010) M Z Y S X J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC100EPT21 PACKAGE DIMENSIONS TSSOP-8 DT SUFFIX CASE 948R-02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U S V 0.25 (0.010) B -U- 4 M A -V- S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) -T- SEATING PLANE D -W- G DETAIL E http://onsemi.com 7 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC100EPT21 PACKAGE DIMENSIONS DFN8 2x2, 0.5P CASE 506AA-01 ISSUE E D PIN ONE REFERENCE 2X 0.10 C 2X A B L1 CCC CCC 0.10 C DETAIL A E OPTIONAL CONSTRUCTIONS DIM A A1 A3 b D D2 E E2 e K L L1 EEE EEE EXPOSED Cu TOP VIEW A DETAIL B 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION 0.08 C (A3) NOTE 4 SIDE VIEW DETAIL A A1 D2 1 4 C 8X SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* L 8 5 e/2 e 8X 1.30 PACKAGE OUTLINE E2 K MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.30 REF 0.25 0.35 --- 0.10 0.90 b 8X 0.50 2.30 1 0.10 C A B 0.05 C 8X 0.30 NOTE 3 BOTTOM VIEW 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). 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