1 Kinetis L series
The Kinetis L series is the most scalable portfolio of ultra low-
power, mixed-signal ARM® Cortex®-M0+ MCUs in the
industry. The portfolio includes five MCU families that offer a
broad range of memory, peripheral and package options.
Kinetis L Series families share common peripherals and pin-
counts allowing developers to migrate easily within an MCU
family or between MCU families to take advantage of more
memory or feature integration. This scalability allows
developers to standardize on the Kinetis L Series for their end
product platforms, maximising hardware and software reuse
and reducing time-to-market.
Features common to all Kinetis L series families include:
48 MHz ARM Cortex-M0+ core
High-speed 12/16-bit analog-to-digital converters
12-bit digital-to-analog converters for all series except
for KLx4/KLx2 family
High-speed analog comparators
Low-power touch sensing with wake-up on touch from
reduced power states for all series except for KLx4/
KLx2 family
Powerful timers for a broad range of applications
including motor control
Low-power focused serial communication interfaces
such as low-power UART, SPI, I2C, and others.
Single power supply: 1.71–3.6 V with multiple low-
power modes support single operation temperature:
Freescale Semiconductor Document Number:KL0xPB
Product Brief Rev 3.3, 07/2013
KL02/KL04/KL05 Product Brief
Supports all KL02, KL04 and KL05 devices
© 2011–2012 Freescale Semiconductor, Inc.
Contents
1 Kinetis L series..........................................................1
2 KL02/KL04/KL05 sub-family
introduction................................................................3
3Block diagram...........................................................4
4Features.....................................................................7
5Power modes...........................................................20
6 Revision history......................................................22
–40 ~ 105 °C (exclude WLCSP package)
–40 ~ 85 °C (WLCSP package)
Kinetis L series MCU families combine the latest low-power innovations with precision mixed-signal capability and a broad
range of communication, connectivity, and human-machine interface peripherals. Each MCU family is supported by a
market-leading enablement bundle from Freescale and numerous ARM third party ecosystem partners. The KL0x family is
the entry-point to the Kinetis L series and is pin-compatible with the 8-bit S08PT family. The KL1x/2x/3x/4x families are
compatible with each other and their equivalent ARM Cortex-M4 Kinetis K series families—K10/20/30/40.
The following figure depicts key features, memory and package options for Kinetis L series family of MCUs.
KL2x Family
KL1x Family
KL0x Family
KL3x Family
Family Program
Flash Packages Key Features
Low power Mixed signal USB Segment LCD
KL4x Family
8-32KB
32-256KB
32-256KB
64-256KB
128-256KB
16-48pin
32-80pin
32-121pin
64-121pin
64-121pin
Figure 1. Kinetis L series families of MCU portfolio
All Kinetis L series families include a powerful array of analog, communication and timing and control peripherals with the
level of feature integration increasing with flash memory size and the pin count. Features within the Kinetis L series families
include:
Core and architecture:
ARM Cortex-M0+ Core running up to 48 MHz with zero wait state execution from memories
Single-cycle access to I/O: Up to 50 percent faster than standard I/O, improves reaction time to external
events allowing bit banging and software protocol emulation
Two-stage pipeline: Reduced number of cycles per instruction (CPI), enabling faster branch instruction and
ISR entry, and reducing power consumption
Excellent code density as compared to 8-bit and 16-bit MCUs: Reduces flash size, system, cost and power
consumption
Optimized access to program memory: Accesses on alternate cycles reduces power consumption.
100 percent compatible with ARM Cortex-M0 and a subset ARM Cortex-M3/M4: Reuse existing
compilers and debug tools.
Simplified architecture: 56 instructions and 17 registers enable easy programming and efficient packaging
of 8/16/32-bit data in memory.
Linear 4 GB address space removes the need for paging/banking, reducing software complexity.
ARM third-party ecosystem support: Software and tools to help minimize development time/cost
Micro Trace Buffer: Lightweight trace solution allows fast bug identification and correction.
Kinetis L series
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
2 Freescale Semiconductor, Inc.
Bit Manipulation Engine (BME): BME reduces code size and cycles for bit-oriented operations to peripheral
registers eliminating traditional methods where the core would need to perform read-modify-write operations.
Up to 4-channel DMA for peripheral and memory servicing with minimal CPU intervention (feature not available
on KL02 family)
Ultra low-power:
Extreme dynamic efficiency: 32-bit ARM Cortex-M0+ core combined with Freescale 90 nm thin-film storage
flash technology delivers 50% energy savings per Coremark in comparison to the closest 8/16-bit competitive
solution.
Multiple flexible low-power modes, including new operation clocking option which reduces dynamic power by
shutting off bus and system clocks for lowest power core processing. Peripherals with an alternate asynchronous
clock source can continue operation.
UART, SPI, I2C, ADC, DAC, TPM, LPTMR, and DMA support low-power mode operation without waking up
the core (DMA is not available on KL02).
Memory:
Scalable memory footprints from 8 KB flash / 1 KB SRAM to 256 KB flash / 32 KB SRAM
Embedded 64 B cache memory for optimizing bus bandwidth and flash execution performance (32 B cache on
KL02 family)
Mixed-signal analog:
Fast, high-precision 16-, or 12-bit ADC with optional differential pairs, 12-bit DAC, high-speed comparators.
Powerful signal conditioning, conversion, and analysis capability with reduced system cost (12-bit DAC not
available on KL02 family)
Human Machine Interface (HMI):
Optional capacitive Touch Sensing Interface with full low-power support and minimal current adder when
enabled
Segment LCD controller
Connectivity and communications:
Up to three UARTs:
All UARTs support DMA transfers, and can trigger when data on bus is detected;
UART0 supports 4x to 32x over sampling ratio;
Asynchronous transmit and receive operation for operating in STOP/VLPS modes.
Up to two SPIs
Up to two I2Cs
Full-speed USB OTG controller with on-chip transceiver
3.3–5 V USB on-chip regulator
Up to one I2S
Reliability, safety, and security:
Internal watchdog with independent clock source
Timing and control:
Powerful timer modules which support general-purpose, PWM, and motor control functions
Periodic Interrupt Timer for RTOS task scheduler time base or trigger source for ADC conversion and timer
modules
System:
GPIO with pin interrupt functionality
Wide operating voltage range from 1.71 V to 3.6 V with flash programmable down to 1.71 V with fully
functional flash and analog peripherals
Ambient operating temperature ranges from –40 °C to 85 °C for WLCSP package and 105 °C for all the other
packages
2 KL02/KL04/KL05 sub-family introduction
The device is highly-integrated, market leading ultra low-power 32-bit microcontroller based on the enhanced Cortex-M0+
(CM0+) core platform. The features of the KL0x family derivatives are as follows.
Core platform clock up to 48 MHz, bus clock up to 24 MHz
KL02/KL04/KL05 sub-family introduction
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 3
Memory option is up to 32 KB Flash and 4 KB RAM
Wide operating voltage ranges from 1.71–3.6 V with fully functional flash program/erase/read operations
Multiple package options from 24-pin to 48-pin for KL04 and KL05
Ambient operating temperature ranges from –40 °C to 85 °C for WLCSP package and –40 °C to 105 °C for all the
others.
The family acts as an ultra low-power, cost-effective microcontroller to provide developers an appropriate entry-level 32-bit
solution. The family is the next-generation MCU solution for low-cost, low-power, high-performance devices applications.
It’s valuable for cost-sensitive, portable applications requiring long battery life-time.
3 Block diagram
The following figure shows a superset block diagram of the device. Other devices within the family have a subset of the
features.
Memories and
Memory Interfaces
Program
flash
RAM
Analog Timers Communication
Interfaces
SPI
x1
Clocks
Frequency-
Core
Debug
interfaces
Interrupt
controller
Human-Machine
Interface (HMI)
System
Internal
watchdog locked loop
reference
Internal
clocks
oscillator
Low
frequency
Low power
UART
x1
Cortex-M0+ARM
with
GPIOs
interrupt
Low Power
Timer
MTB
BME
6-bit DAC
comparator
x1
Analog
watchdog
Security
and Integrity
Internal
Kinetis KL02 Family
x2
IC
2
Timers
2x2ch
12-bit ADC
x1
Figure 2. KL02 family block diagram
Block diagram
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
4 Freescale Semiconductor, Inc.
Memories and
Memory Interfaces
Program
flash
RAM
6-bit DAC
watchdog
Analog Timers Communication
Interfaces
Security
and Integrity
SPI
x1
Low
power timer
Clocks
Frequency-
Core
Debug
interfaces
Interrupt
controller
comparator
x1
Analog
Human-Machine
Interface (HMI)
System
DMA
Internal
watchdog locked loop
reference
Internal
clocks
timers
interrupt
Periodic
oscillator
Low/high
frequency
Low power
UART
x1
Cortex-M0+ARM
with
GPIOs
interrupt
BME
MTB
RTC
Internal
Kinetis KL04 Family
LEGEND
x1
IC
2
x1
Timers
1x6ch+1x2ch
12-bit ADC
x1
Figure 3. KL04 family block diagram
Block diagram
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 5
Memories and
Memory Interfaces
Program
flash
RAM
6-bit DAC
Analog Timers Communication
Interfaces
Security
and Integrity
SPI
x1
Low
power timer
Clocks
Frequency-
Core
Debug
interfaces
Interrupt
controller
comparator
x1
Analog
Human-Machine
Interface (HMI)
System
DMA
Internal
watchdog locked loop
reference
Internal
clocks
timers
interrupt
Periodic
oscillator
Low/high
frequency
Low power
UART
x1
Cortex-M0+
ARM
with
GPIOs
interrupt
Kinetis KL05 Family
LEGEND
x1
IC
2
x1
Timers
1x6ch+1x2ch
12-bit ADC
x1
TSI
12-bit DAC
BME
MTB
RTC
watchdog
Internal
Figure 4. KL05 family block diagram
Block diagram
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
6 Freescale Semiconductor, Inc.
Features
4.1 Feature summary
All devices within the KL02, KL04 and KL05 family have the following features at a minimum.
Table 1. Common features among all KL02, KL04 and KL05 devices
Operating characteristics 1.71 V to 3.6 V
Temperature range (TA) -40 °C to 85 °C for WLCSP
package and -40 °C to 105 °C for all the others
Flexible modes of operation
Core features Next generation 32-bit ARM Cortex M0+ core
Support up to 32 interrupt request sources
Nested vectored interrupt controller (NVIC)
Debug and trace capability
2-pin serial wire debug (SWD)
Micro trace buffer (MTB)
System and power management Software watchdog
Integrated bit manipulation engine (BME)
DMA controller for KL04 and KL05
Low-leakage wake-up unit (LLWU) for KL04 and KL05
Power management controller with 10 different power
modes
Nonmaskable interrupt (NMI)
80-bit unique identification (ID) number per chip
Clocks External crystal oscillator or resonator
DC-48 MHz external square wave input clock
Internal clock references
31.25 to 39.063 kHz oscillator
4 MHz oscillator
1 kHz oscillator
Frequency-locked loop with the range of
20-25 MHz
40-48 MHz
Memory and memory interfaces Up to 32 KB flash with 64 byte cache for KL04/KL05
and 32 byte cache for KL02
Up to 4 KB random-access memory
Security and integrity COP watchdog
Analog 12-bit analog-to-digital converter ( ADC)
High-speed comparator (HSCMP)with internal 6-bit
digital-to-analog converter (DAC)
12-bit digital-to-analog converter (DAC) for KL05
Timers One 6-channel and one 2-channel 16-bit TPM modules
for KL04 and KL05, and two 2-channel 16-bit TPM
modules for KL02
32-bit Programmable interrupt timer (PIT) for KL04 and
KL05
Real-time clock (RTC) for KL04 and KL05
Low-power timer (LPTMR)
System tick timer (SYSTIK)
Table continues on the next page...
4
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 7
Table 1. Common features among all KL02, KL04 and KL05 devices (continued)
Communications SPI with DMA support1
I2C with DMA support2
Low-power UART with DMA support2
Human-machine interface GPIO with pin interrupt support, DMA request
capability, and other pin control options2
Capacitive touch sensing inputs for KL05
1. KL02 does not support DMA.
2. KL02 does not support DMA feature.
4.2 Memory and package options
The following table summarizes the memory and package options for the KL0x family. All devices which share a common
package are pin-for-pin compatible.
Table 2. KL0x family summary
Sub-Family
Performance (MHz)
Memory Package
Flash (KB)
SRAM
(KB)
16 QFN (3x3)
20 CSP (2x2)
24 QFN (4x4)
32 LQFP (7x7)
32 QFN (5x5)
48 LQFP (7x7)
KL02 48 8 1 +
48 16 2 + + +
48 32 4 + + + +
KL04 48 8 1 + + +
48 16 2 + + + +
48 32 4 + + + +
KL05 48 8 1 + + +
48 16 2 + + + +
48 32 4 + + + +
4.3 Part numbers and packaging
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
8 Freescale Semiconductor, Inc.
Q KL## A FFF T PP CC (N)
Qualification status
Family
Flash size
Temperature range (°C)
Speed (MHz)
Package identifier
Tape and Reel (T&R)
Key attribute
Figure 5. Part numbers diagrams
Table 3. Part number fields descriptions
Field Description Values
Q Qualification status M = Fully qualified, general market flow, 3000
pieces reels
P = Prequalification
K = Fully qualified, general market flow, 100
pieces reels
KL## Kinetis family KL02
KL04
KL05
A Key attribute Z = Cortex-M0+
FFF Program flash memory size 8 = 8 KB
16 = 16 KB
32 = 32 KB
R Silicon revision (Blank) = Main
A = Revision after main
T Temperature range (°C) C = –40 to 85
PP Package identifier FG = 16 QFN (3 mm x 3 mm)
AF = 20 WLCSP (1.99 mm x 1.94 mm)
FK = 24 QFN (4 mm x 4 mm)
LC = 32 LQFP (7 mm x 7 mm)
FM = 32 QFN (5 mm x 5 mm)
LF = 48 LQFP (7 mm x 7 mm)
CC Maximum CPU frequency (MHz) 4 = 48 MHz
N Packaging type R = Tape and reel
(Blank) = Trays
4.4 KL02/KL04/KL05 family features
The following sections list the differences among the various devices available within the KL02/KL04/KL05 family.
The features listed for each part number in the following subsection specify the maximum configuration available on that
device. The signal multiplexing configuration determines which modules can be used simultaneously.
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 9
4.4.1 KL02 family features (48 MHz performance)
Table 4. KL02 48 MHz performance table
MC part number
MKL02Z8VFG4(R)
MKL02Z16VFG4(R)
MKL02Z32VFG4(R)
MKL02Z32CAF4R
KKL02Z32CAF4R
MKL02Z16VFK4(R)
MKL02Z32VFK4(R)
MKL02Z16VFM4(R)
MKL02Z32VFM4(R)
General
CPU frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
Pin count 16 16 16 20 20 24 24 32 32
Package QFN QFN QFN WLCSP WLCSP QFN QFN QFN QFN
Memories and memory interfaces
Flash 8 KB 16 KB 32 KB 32 KB 32 KB 16 KB 32 KB 16 KB 32 KB
SRAM 1 KB 2 KB 4 KB 4 KB 4 KB 2 KB 4 KB 2 KB 4 KB
Cache 32 B 32 B 32 B 32 B 32 B 32 B 32 B 32 B 32 B
Core modules
Debug SWD SWD SWD SWD SWD SWD SWD SWD SWD
Trace MTB MTB MTB MTB MTB MTB MTB MTB MTB
NMI YES YES YES YES YES YES YES YES YES
System modules
Watchdog YES YES YES YES YES YES YES YES YES
PMC YES YES YES YES YES YES YES YES YES
DMA - - - - - - - - -
BME (Bit Manipulation Engine) YES YES YES YES YES YES YES YES YES
Clock modules
MCG FLL FLL FLL FLL FLL FLL FLL FLL FLL
OSC (32-40kHz/3-32MHz) 32–40
kHz
32–40
kHz
32–40
kHz
32–40
kHz
32–40
kHz
32–40
kHz
32–40
kHz
32–40
kHz
32–40
kHz
RTC - - - - - - - - -
Analog
Total SE channels SAR ADC (w
temp sense)
12-bit,
1x6ch
12-bit,
1x6ch
12-bit,
1x6ch
12-bit,
1x10ch
12-bit,
1x10ch
12-bit,
1x12ch
12-bit,
1x12ch
12-bit,
1x14ch
12-bit,
1x14ch
DP channels - - - - - - - - -
SE channels 6ch 6ch 6ch 10ch 10ch 12ch 12ch 14ch 14ch
12-bit DAC - - - - - - - - -
Analog Comparator 1 1 1 1 1 1 1 1 1
Analog Comparator inputs 2 2 2 2 2 4 4 4 4
Timers
General-purpose/PWM 1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
1x2ch
+1x2ch
Low-Power Timer 1 1 1 1 1 1 1 1 1
Table continues on the next page...
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
10 Freescale Semiconductor, Inc.
Table 4. KL02 48 MHz performance table (continued)
MC part number
MKL02Z8VFG4(R)
MKL02Z16VFG4(R)
MKL02Z32VFG4(R)
MKL02Z32CAF4R
KKL02Z32CAF4R
MKL02Z16VFK4(R)
MKL02Z32VFK4(R)
MKL02Z16VFM4(R)
MKL02Z32VFM4(R)
PIT (32bit) - - - - - - - - -
Communication interfaces
Low-power UART 1 1 1 1 1 1 1 1 1
UART - - - - - - - - -
SPI chip selects per module 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0
I2C 2 2 2 2 2 2 2 2 2
I2S - - - - - - - - -
USB OTG LS/FS w/ on-chip xcvr - - - - - - - - -
USB 120mAReg - - - - - - - - -
Human-machine interface
Segment LCD - - - - - - - - -
TSI (capacitive touch) - - - - - - - - -
Total GPIOs 14 14 14 18 18 22 22 28 28
GPIOs w/ interrupt 9 9 9 10 10 12 12 14 14
High-current GPIOs (18 mA) 2 2 2 2 2 2 2 4 4
Operating characteristics
Voltage range 1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
Flash write V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V
Temp range –40 to
105 °C
–40 to
105 °C
–40 to
105 °C
–40 to
85 °C
–40 to
85 °C
–40 to
105 °C
–40 to
105 °C
–40 to
105 °C
–40 to
105 °C
4.4.2 KL04 family features (48 MHz performance)
Table 5. KL04 48 MHz performance table
MC Partnumber
MKL04Z8VFK4(R)
MKL04Z16VFK4(R)
MKL04Z32VFK4(R)
MKL04Z8VLC4(R)
MKL04Z16VLC4(R)
MKL04Z32VLC4(R)
MKL04Z8VFM4(R)
MKL04Z16VFM4(R)
MKL04Z32VFM4(R)
MKL04Z16VLF4(R)
MKL04Z32VLF4(R)
General
Table continues on the next page...
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 11
Table 5. KL04 48 MHz performance table (continued)
MC Partnumber
MKL04Z8VFK4(R)
MKL04Z16VFK4(R)
MKL04Z32VFK4(R)
MKL04Z8VLC4(R)
MKL04Z16VLC4(R)
MKL04Z32VLC4(R)
MKL04Z8VFM4(R)
MKL04Z16VFM4(R)
MKL04Z32VFM4(R)
MKL04Z16VLF4(R)
MKL04Z32VLF4(R)
CPU frequency 48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
Pin count 24 24 24 32 32 32 32 32 32 48 48
Package QFN QFN QFN LQFP LQFP LQFP QFN QFN QFN LQFP LQFP
Memories and Memory Interfaces
Flash 8 KB 16 KB 3 KB 8 KB 16 KB 32 KB 8 KB 16 KB 32 KB 16 KB 32 KB
SRAM 1 KB 2 KB 4 KB 1 KB 2 KB 4 KB 1 KB 2 KB 4 KB 2 KB 4 KB
Cache 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B
Core Modules
Debug SWD SWD SWD SWD SWD SWD SWD SWD SWD SWD SWD
Trace MTB MTB MTB MTB MTB MTB MTB MTB MTB MTB MTB
NMI YES YES YES YES YES YES YES YES YES YES YES
System Modules
Watchdog YES YES YES YES YES YES YES YES YES YES YES
PMC YES YES YES YES YES YES YES YES YES YES YES
DMA 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch
BME (Bit Manipulation
Engine)
YES YES YES YES YES YES YES YES YES YES YES
Clock Modules
MCG FLL FLL FLL FLL FLL FLL FLL FLL FLL FLL FLL
OSC (32-40kHz/3-32MHz) YES YES YES YES YES YES YES YES YES YES YES
RTC YES YES YES YES YES YES YES YES YES YES YES
Analog
Total SE channels SAR
ADC (w temp sense)
12-bit,
1x12ch
12-bit,
1x12ch
12-bit,
1x12ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
DP channels - - - - - - - - - - -
SE channels 12ch 12ch 12ch 14ch 14ch 14ch 14ch 14ch 14ch 14ch 14ch
12-bit DAC - - - - - - - - - - -
Analog Comparator 1 1 1 1 1 1 1 1 1 1 1
Analog Comparator inputs 4 4 4 4 4 4 4 4 4 4 4
Timers
General-purpose/PWM 1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
Low-Power Timer 1 1 1 1 1 1 1 1 1 1 1
PIT (32-bit) 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch
Table continues on the next page...
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
12 Freescale Semiconductor, Inc.
Table 5. KL04 48 MHz performance table (continued)
MC Partnumber
MKL04Z8VFK4(R)
MKL04Z16VFK4(R)
MKL04Z32VFK4(R)
MKL04Z8VLC4(R)
MKL04Z16VLC4(R)
MKL04Z32VLC4(R)
MKL04Z8VFM4(R)
MKL04Z16VFM4(R)
MKL04Z32VFM4(R)
MKL04Z16VLF4(R)
MKL04Z32VLF4(R)
Communication Interfaces
Low Power UART 1 1 1 1 1 1 1 1 1 1 1
UART -----------
SPI chip selects per module 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0
I2C 11111111111
I2S -----------
USB OTG LS/FS w/ on-chip
xcvr
-----------
USB 120mAReg - - - - - - - - - - -
Human-Machine Interface
Segment LCD - - - - - - - - - - -
TSI (capacitive touch) - - - - - - - - - - -
Total GPIOs 22 22 22 28 28 28 28 28 28 41 41
GPIOs w/ interrupt 12 12 12 14 14 14 14 14 14 18 18
High-current GPIOs
(18 mA)
22244444444
Operating Characteristics
Voltage range 1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
Flash write V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V
Temp range –40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
4.4.3 KL05 family features (48 MHz performance)
Table 6. KL05 48 MHz performance table
MC part number
MKL05Z8VFK4(R)
MKL05Z16VFK4(R)
MKL05Z32VFK4(R)
MKL05Z8VLC4(R)
MKL05Z16VLC4(R)
MKL05Z32VLC4(R)
MKL05Z8VFM4(R)
MKL05Z16VFM4(R)
MKL05Z32VFM4(R)
MKL05Z16VLF4(R)
MKL05Z32VLF4(R)
General
Table continues on the next page...
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 13
Table 6. KL05 48 MHz performance table (continued)
MC part number
MKL05Z8VFK4(R)
MKL05Z16VFK4(R)
MKL05Z32VFK4(R)
MKL05Z8VLC4(R)
MKL05Z16VLC4(R)
MKL05Z32VLC4(R)
MKL05Z8VFM4(R)
MKL05Z16VFM4(R)
MKL05Z32VFM4(R)
MKL05Z16VLF4(R)
MKL05Z32VLF4(R)
CPU frequency 48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
48
MHz
Pin count 24 24 24 32 32 32 32 32 32 48 48
Package QFN QFN QFN LQFP LQFP LQFP QFN QFN QFN LQFP LQFP
Memories and memory interfaces
Flash 8 KB 16 KB 32 KB 8 KB 16 KB 32 KB 8 KB 16 KB 32 KB 16 KB 32 KB
SRAM 1 KB 2 KB 4 KB 1 KB 2 KB 4 KB 1 KB 2 KB 4 KB 2 KB 4 KB
Cache 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B 64 B
Core modules
Debug SWD SWD SWD SWD SWD SWD SWD SWD SWD SWD SWD
Trace MTB MTB MTB MTB MTB MTB MTB MTB MTB MTB MTB
NMI YES YES YES YES YES YES YES YES YES YES YES
System modules
Watchdog YES YES YES YES YES YES YES YES YES YES YES
PMC YES YES YES YES YES YES YES YES YES YES YES
DMA 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch 4ch
BME (Bit Manipulation
Engine)
YES YES YES YES YES YES YES YES YES YES YES
Clock Modules
MCG FLL FLL FLL FLL FLL FLL FLL FLL FLL FLL FLL
OSC (32–40 kHz/3–
32 MHz)
YES YES YES YES YES YES YES YES YES YES YES
RTC YES YES YES YES YES YES YES YES YES YES YES
Analog
Total SE channels SAR
ADC (w temp sense)
12-bit,
1x12ch
12-bit,
1x12ch
12-bit,
1x12ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
12-bit,
1x14ch
DP channels - - - - - - - - - - -
SE channels 12ch 12ch 12ch 14ch 14ch 14ch 14ch 14ch 14ch 14ch 14ch
12-bit DAC 1 1 1 1 1 1 1 1 1 1 1
Analog Comparator 1 1 1 1 1 1 1 1 1 1 1
Analog Comparator inputs 4 4 4 4 4 4 4 4 4 4 4
Timers
General-purpose/PWM 1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
1x6ch
+1x2ch
Low Power Timer 1 1 1 1 1 1 1 1 1 1 1
PIT (32bit) 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch 1x2ch
Table continues on the next page...
Features
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
14 Freescale Semiconductor, Inc.
Table 6. KL05 48 MHz performance table (continued)
MC part number
MKL05Z8VFK4(R)
MKL05Z16VFK4(R)
MKL05Z32VFK4(R)
MKL05Z8VLC4(R)
MKL05Z16VLC4(R)
MKL05Z32VLC4(R)
MKL05Z8VFM4(R)
MKL05Z16VFM4(R)
MKL05Z32VFM4(R)
MKL05Z16VLF4(R)
MKL05Z32VLF4(R)
Communication interfaces
Low-Power UART 1 1 1 1 1 1 1 1 1 1 1
UART -----------
SPI chip selects per module 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0 1/0
I2C 11111111111
I2S -----------
USB OTG LS/FS w/ on-chip
xcvr
-----------
USB 120 mAReg - - - - - - - - - - -
Human-machine interface
Segment LCD - - - - - - - - - - -
TSI (capacitive touch) 8ch 8ch 8ch 12ch 12ch 12ch 12ch 12ch 12ch 12ch 12ch
Total GPIOs 22 22 22 28 28 28 28 28 28 41 41
GPIOs w/ interrupt 12 12 12 14 14 14 14 14 14 18 18
High-current GPIOs
(18 mA)
22244444444
Operating characteristics
Voltage range 1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
1.71–
3.6 V
Flash write V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V 1.71 V
Temp range –40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
–40 to
105°C
4.5 Module-by-module feature list
The following sections describe the high-level module features for the family's superset device. See KL02/KL04/KL05
family features for differences among the subset devices.
Core modules
4.5.1.1 ARM Cortex M0+ core
Up to 48 MHz core frequency from 1.71 V to 3.6 V across temperature range of –40 °C to 105 °C
Support up to 32 interrupt request sources
2-stage pipeline microarchitecture for reduced power consumption and improved architectural performance (cycles per
instruction)
4.5.1
Core modules
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Freescale Semiconductor, Inc. 15
Binary compatible instruction set architecture with the CM0 core
Thumb instruction set combines high code density with 32-bit performance.
Serial wire debug (SWD) reduces the number of pins required for debugging.
Micro trace buffer (MTB) provides lightweight program trace capabilities using system RAM as the destination
memory.
Single cycle 32 bits by 32 bits multiply
4.5.1.2 Nested Vectored Interrupt Controller (NVIC)
Up to 32 interrupt sources
Includes a single nonmaskable interrupt
4.5.1.3 Wake-Up Interrupt Controller (WIC)
Supports interrupt handling when system clocking is disabled in low power modes
Takes over and emulates the NVIC behavior when correctly primed by the NVIC on entry to Very-Deep-Sleep mode
A rudimentary interrupt masking system with no prioritization logic signals for wake-up as soon as a nonmasked
interrupt is detected.
Contains no programmer’s model visible state and is therefore invisible to end users of the device other than through
the benefits of reduced power consumption while sleeping
4.5.1.4 Debug Controller
2-pin serial wire debug (SWD) provides external debugger interface
Micro trace buffer (MTB) provides simple execution trace capability and operates as a simple AHB-Lite SRAM
controller.
System modules
4.5.2.1 Power Management Control Unit (PMC)
Separate digital (regulated) and analog (referenced to digital) supply outputs
Programmable power saving modes
No output supply decoupling capacitors required
Available wake-up from power saving modes via RTC and external inputs
Integrated Power-on Reset (POR)
Integrated Low Voltage Detect (LVD) with reset (brownout) capability
Selectable LVD trip points
Programmable Low Voltage Warning (LVW) interrupt capability
Buffered bandgap reference voltage output
Factory programmed trim for bandgap and LVD
1 kHz Low-Power Oscillator (LPO)
4.5.2.2 DMA Channel Multiplexer (DMA MUX)
Four independently selectable DMA channel routers
Two periodic trigger sources available
Each channel router can be assigned to 1 of 63 possible peripheral DMA sources.
4.5.2
System modules
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16 Freescale Semiconductor, Inc.
4.5.2.3 DMA Controller
Four independently programmable DMA controller channels provide the means to directly transfer data between system
memory and I/O peripherals.
DMA controller is capable of functioning in Run, Wait, and Stop modes of operation.
Dual-address transfers via 32-bit master connection to the system bus
Data transfer in 8-, 16-, or 32-bit blocks
Continuous-mode or cycle-steal transfers from software or peripheral initiation
4.5.2.4 COP Watchdog module
Independent clock source input (independent from CPU/bus clock)
Choice between two clock sources
LPO oscillator
Bus clock
4.5.2.5 System clocks
System Oscillator (XOSC)—Loop-control pierce oscillator; crystal or ceramic resonator range of 32 kHz to 40 kHz
(low range mode) or 3-32 MHz (high range mode)
Multipurpose Clock Generator (MCG)
Frequency-locked loop (FLL) controlled by internal or external reference
20~40 MHz FLL output
40~48 MHz FLL output
Internal reference clocks—Can be used as a clock source for other on-chip peripherals
On-chip RC oscillator range of 31.25 kHz to 39.0625 kHz with 0.2% trim step and 1% accuracy across
temperature range of 0 °C to 70 °C and 2% accuracy across full temperature range
On-chip RC oscillator range of 31.25 kHz to 39.0625 kHz with 0.2% trim step and 1% accuracy across full
temperature range
Ultra low-power 4 MHz IRC
Memories and memory interfaces
4.5.3.1 On-chip memory
48 MHz performance devices
Up to 32 KB program flash memory
Up to 4 KB SRAM
Security circuitry to prevent unauthorized access to RAM and flash memory contents
Analog
4.5.4.1 Analog-to-Digital Converter (ADC)
Linear successive approximation algorithm with up to 16-bit resolution
Output modes:
Single-ended 12-bit, 10-bit, and 8-bit modes, in right-aligned unsigned format
Single or continuous conversion
Configurable sample time and conversion speed/power
Conversion complete and hardware average complete flag and interrupt
4.5.3
4.5.4
Memories and memory interfaces
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 17
Input clock selectable from up to four sources
Operation in low-power modes for lower noise operation
Asynchronous clock source for lower noise operation with option to output the clock
Selectable asynchronous hardware conversion trigger with hardware channel select
Automatic compare with interrupt for various programmable values
Temperature sensor
Hardware average function
Selectable voltage reference
Self-calibration mode
4.5.4.2 High-Speed Analog Comparator (CMP)
6-bit DAC programmable reference generator output
Up to five selectable comparator inputs; each input can be compared with any input by any polarity sequence
Selectable interrupt on rising-edge, falling-edge, or either rising or falling edges of the comparator output
Comparator output supports:
Sampled
Windowed (ideal for certain PWM zero-crossing-detection applications
Digitally filtered using external sample signal or scaled peripheral clock
Two performance modes:
Shorter propagation delay at the expense of higher power
Low power, with longer propagation delay
Operational in all MCU power modes except for VLLS0
4.5.4.3 12-bit Digital-to-Analog Converter (DAC)
12-bit resolution
Guaranteed 6-sigma monotonicity over input word
High- and low-speed conversions
1 μs conversion rate for high speed, 2 μs for low speed
Power-down mode
Automatic mode allows the DAC to generate its own output waveforms including square, triangle, and sawtooth.
Automatic mode allows programmable period, update rate, and range.
DMA support
Timers
4.5.5.1 Timer/PWM (TPM)
Selectable source clock
Programmable prescaler
16-bit counter supporting free-running or initial/final value, and counting is up or up-down
Input capture, output compare, and edge-aligned and center-aligned PWM modes
Input capture and output compare modes
Generation of hardware triggers
DMA support for TPM events
4.5.5.2 Periodic Interrupt Timers (PITs)
Two general-purpose interrupt timers
Two interrupt timers for triggering ADC conversions
32-bit counter resolution
4.5.5
Timers
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18 Freescale Semiconductor, Inc.
Clocked by bus clock frequency
DMA support
4.5.5.3 Real-Time Clock (RTC)
32-bit seconds counter with 32-bit alarm
16-bit prescaler with compensation
Register write protection
Hard Lock requires MCU POR to enable write access
Communication interfaces
4.5.6.1 Inter-Integrated Circuit (I2C)
Compatible with I2C bus standard and SMBus Specification Version 2 features
Up to 400 kbit/s with maximum bus loading
Multimaster operation
Software programmable for one of 64 different serial clock frequencies
Programmable slave address and glitch input filter
Interrupt or DMA driven byte-by-byte data transfer
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
Bus busy detection broadcast and 10-bit address extension
Address matching causes wake-up when the processor is in low-power mode.
4.5.6.2 UART0
Full-duplex operation
Standard mark/space non-return-to-zero (NRZ) format
13-bit baud rate selection with fractional divide of 32
Programmable 8-bit or 9-bit data format
Separately enabled transmitter and receiver
Programmable transmitter output polarity
Programmable receive input polarity
13-bit break character option
11-bit break character detection option
Two receiver wake-up methods:
Idle line wake-up
Address mark wake-up
Address match feature in receiver to reduce address mark wake-up ISR overhead
Interrupt or DMA driven operation
Receiver framing error detection
Hardware parity generation and checking
Configurable oversampling ratio to support from 1/4 to 1/32 bit-time noise detection
Operation in low-power modes
4.5.6.3 Serial Peripheral Interface (SPI)
Master and slave mode
Full-duplex, three-wire synchronous transfers
Programmable transmit bit rate
Double-buffered transmit and receive data registers
Serial clock phase and polarity options
4.5.6
Communication interfaces
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 19
Slave select output
Mode fault error flag with CPU interrupt capability
Control of SPI operation during wait mode
Selectable MSB-first or LSB-first shifting
Support for both transmit and receive by DMA
Human-machine interface
4.5.7.1 General-Purpose Input/Output (GPIO)
Hysteresis and configurable pullup device on all input pins
Configurable drive strength on some output pins
Independent pin value register to read logic level on digital pin
4.5.7.2 Touch Sensor Input (TSI)
Supports up to 16 external electrodes
Automatic detection of electrode capacitance across all operational power modes
Internal reference oscillator for high-accuracy measurement
Configurable software or hardware scan trigger
Fully supports Freescale touch sensing software (TSS) library
Capability to wake the MCU from low-power modes
Compensate for temperature and supply voltage variations
High sensitivity change with 16-bit resolution register
Configurable up to 4096 scan times.
Support DMA data transfer
5 Power modes
The Power Management Controller (PMC) provides multiple power options to allow the user to optimize power consumption
for the level of functionality needed.
Depending on the stop requirements of the user application, a variety of stop modes are available that provide state retention,
partial power-down or full power-down of certain logic and/or memory. I/O states are held in all modes of operation. The
following table compares the various power modes available.
For each run mode, there is a corresponding Wait and Stop mode. Wait modes are similar to ARM Sleep modes. Stop modes
(VLPS, STOP) are similar to ARM Sleep Deep mode. The Very Low Power Run (VLPR) operating mode can drastically
reduce runtime power when the maximum bus frequency is not required to handle the application needs.
The three primary modes of operation are Run, Wait, and Stop. The WFI instruction invokes both Wait and Stop modes for
the chip. The primary modes are augmented in a number of ways to provide lower power based on application needs.
NOTE
KL02 does not support LLWU, RTC or TSI.
Table 7. Chip power modes
Chip mode Description Core mode Normal
recovery
method
Normal Run Allows maximum performance of chip. Run
Table continues on the next page...
4.5.7
Human-machine interface
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
20 Freescale Semiconductor, Inc.
Table 7. Chip power modes (continued)
Chip mode Description Core mode Normal
recovery
method
Default mode out of reset
On-chip voltage regulator is on.
Normal Wait -
via WFI
Allows peripherals to function while the core is in Sleep mode,
reducing power.
NVIC remains sensitive to interrupts
Peripherals continue to be clocked.
Sleep Interrupt
Normal Stop -
via WFI
Places chip in static state. Lowest power mode that retains all registers
while maintaining LVD protection.
NVIC is disabled.
AWIC is used to wake up from interrupt.
Peripheral clocks are stopped.
Sleep Deep Interrupt
VLPR (Very
Low-Power Run)
On-chip voltage regulator is in a low-power mode that supplies only
enough power to run the chip at a reduced frequency. Only MCG
modes BLPI and BLPE can be used in VLPR.
Reduced frequency Flash access mode (1 MHz)
LVD off
In BLPI clock mode, only the fast internal reference oscillator is
available to provide a low power nominal 4 MHz source for the
core with the nominal bus and flash clock required to be <800
kHz
Alternatively, BLPE clock mode can be used with an external
clock or the crystal oscillator providing the clock source.
Run
VLPW (Very
Low-Power
Wait) -via WFI
Same as VLPR but with the core in Sleep mode to further reduce
power.
NVIC remains sensitive to interrupts (FCLK = ON).
On-chip voltage regulator is in a low-power mode that supplies
only enough power to run the chip at a reduced frequency.
Sleep Interrupt
VLPS (Very
Low-Power
Stop)-via WFI
Places chip in static state with LVD operation off. Lowest power mode
with ADC and pin interrupts functional.
Peripheral clocks are stopped, but OSC, LPTMR, RTC, CMP,
TSI can be used.
TPM and UART can optionally be enabled if their clock source is
enabled.
NVIC is disabled (FCLK = OFF); AWIC is used to wake up from
interrupt.
On-chip voltage regulator is in a low-power mode that supplies
only enough power to run the chip at a reduced frequency.
All SRAM is operating (content retained and I/O states held).
Sleep Deep Interrupt
LLS1 (Low-
Leakage Stop)
State retention power mode
Most peripherals are in state retention mode (with clocks
stopped), but OSC, LLWU,LPTMR, RTC, CMP, TSI can be used.
NVIC is disabled; LLWU is used to wake up.
NOTE: The LLWU interrupt must not be masked by
the interrupt controller to avoid a scenario
where the system does not fully exit stop
mode on an LLS recovery
All SRAM is operating (content retained and I/O states held).
Sleep Deep Wake-up
Interrupt2
VLLS3 (Very
Low-Leakage
Stop3)
Most peripherals are disabled (with clocks stopped), but OSC,
LLWU, LPTMR, RTC, CMP, TSI can be used.
Sleep Deep Wake-up Reset3
Table continues on the next page...
Power modes
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
Freescale Semiconductor, Inc. 21
Table 7. Chip power modes (continued)
Chip mode Description Core mode Normal
recovery
method
NVIC is disabled; LLWU is used to wake up.
SRAM_U and SRAM_L remain powered on (content retained
and I/O states held).
VLLS1 (Very
Low-Leakage
Stop1)
Most peripherals are disabled (with clocks stopped), but OSC,
LLWU, LPTMR, RTC, CMP, TSI can be used.
NVIC is disabled; LLWU is used to wake up.
All of SRAM_U and SRAM_L are powered off.
Sleep Deep Wake-up Reset3
VLLS0 (Very
Low-Leakage
Stop 0)
Most peripherals are disabled (with clocks stopped), but LLWU,
LPTMR, RTC, TSI can be used.
NVIC is disabled; LLWU is used to wake up.
All of SRAM_U and SRAM_L are powered off.
LPO disabled, optional POR brown-out detection
Sleep Deep Wake-up Reset3
1. KL02 does not support LLS mode.
2. Resumes Normal Run mode operation by executing the LLWU interrupt service routine.
3. Follows the reset flow with the LLWU interrupt flag set for the NVIC.
6 Revision history
The following table provides a revision history for this document.
Table 8. Revision history
Rev. No. Date Substantial changes
1 3/16/2012 Initial publish
2 6/4/2012 Updated Kinetis KL series of MCU portfolio diagram.
Updated KL04 family block diagram.
Updated ADC feature for KL04.
Updated KL0x family summary table.
3 10/8/2012 Added KL02 family.
3.1 10/22/2012 Updated the feature in the section of Inter-Integrated Circuit (I2C) to "Up to
400 kbit/s with maximum bus loading".
3.2 5/28/2013 Added WLCSP package for KL02.
3.3 7/1/2013 Added KKL02Z32CAF4R.
Clarified KL02 has no LLWU.
Revision history
KL02/KL04/KL05 Product Brief, Rev 3.3, 07/2013
22 Freescale Semiconductor, Inc.
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Document Number KL0xPB
Revision 3.3, 07/2013