DSC1001AE1-066.6660T - MICROCHIP TECHNOLOGY

 2017 Microchip Technology Inc. DS20005529B-page 1

DSC1001/3/4

Features

• Frequency Range: 1 MHz to 150 MHz

• Exceptional Stability over Temperature

- ±10 ppm, ±20 ppm, ±25 ppm, ±50 ppm

• Operating Voltage

- 1.7 to 3.6V

• Operating Temperature Range

- Ext. Industrial –40°C to 105°C

- Industrial –40°C to 85°C

- Commercial –20°C to 70°C

• Low Operating and Standby Current

-6 mA Operating (1 MHz)

-15 µA Standby (Max.)

• Ultra Miniature Footprint

-2.5 mm x 2.0 mm x 0.85 mm

-3.2 mm x 2.5 mm x 0.85 mm

-5.0 mm x 3.2 mm x 0.85 mm

-7.0 mm x 5.0 mm x 0.85 mm

• MIL-STD 883 Shock and Vibration Resistant

• Pb Free, RoHS, Reach SVHC Compliant

• AEC-Q100 Reliability Qualified

Applications

• Mobile Applications

• Consumer Electronics

• Portable Electronics

• DVR, CCTV, Surveillance Cameras

• Low Profile Applications

• Industrial Applications

Benefits

• Pin for Pin “Drop-In” Replacement for Industry

Standard Oscillators

• Semiconductor Level Reliability, Significantly

Higher than Quartz

• Short Mass Production Lead Times

• Longer Battery Life/Reduced Power Consumption

• Compact Plastic Package

• Cost Effective

General Description

The DSC1001/3/4 is a silicon MEMS based CMOS

family of oscillators that offers excellent jitter and

stability performance over a wide range of supply

voltages and temperatures. The device operates from

1 MHz to 150 MHz with supply voltages between 1.8 to

3.3 volts and temperature ranges up to –40°C to

105°C.

The DSC1001/3/4 incorporate an all silicon resonator

that is extremely robust and nearly immune to stress

related fractures, common to crystal based oscillators.

Without sacrificing the performance and stability

required of today’s systems, a crystal-less design

allows for a higher level of reliability, making the

DSC1001/3/4 ideal for rugged, industrial, and portable

applications where stress, shock, and vibration can

damage quartz crystal based systems.

Available in industry standard packages, the

DSC1001/3/4 can be “dropped-in” to the same PCB

footprint as standard crystal oscillators.

The DSC1003 and DSC1004 have the same

functionality and performance as the DSC1001, but

feature higher output drives of 25 pF and 40 pF,

respectively.

Package Types

DSC1001/3/4

CDFN/DFN

(Top View)

STANDBY# 1

GND

VDD

OUT

1.8V-3.3V Low-Power Precision CMOS Oscillators

DSC1001/3/4

DS20005529B-page 2  2017 Microchip Technology Inc.

Block Diagram

PFD VCO

FRAC-N

PLL

OUTPUTVDD

GND

(PIN1)

STANDBY#

PFD VCO

FRAC-N

PFD VCO

PLL

RESONATOR

VDD

GND

(PIN1)

 2017 Microchip Technology Inc. DS20005529B-page 3

DSC1001/3/4

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage (VIN) ............................................................................................................................–0.3V to VDD + 0.3V

ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM

Recommended Operating Conditions

Supply Voltage (VDD) ................................................................................................................................ +1.7V to +3.6V

Output Load (ZL) ............................................................................................................................. R > 10 kΩ, C ≤ 15 pF

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at those or any other conditions above those indicated

in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended

periods may affect device reliability.

TABLE 1-1: DC CHARACTERISTICS

Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.

Parameters Sym. Min. Typ. Max. Units Conditions

Frequency F01 — 150 MHz Single Frequency

Frequency Tolerance ∆f

— — ±10

ppm

Includes frequency variations

due to initial tolerance,

temperature and power supply

voltage

— — ±20

— — ±25

— — ±50

Aging ∆f— — ±5 ppm 1 year @ +25°C

Supply Current, Standby IDD — — 15 µA T = +25°C

Output Startup Time

(Note 1) tSU —1.0 1.3 ms T = +25°C

Output Disable Time tDA —20 100 ns —

Output Duty Cycle SYM 45 —55 % —

Input Logic Level High VIH 0.75 x VDD — — V —

Input Logic Level Low VIL — — 0.25 x VDD V —

VDD = 1.8V

Supply Current, No Load IDD

—6.0 6.3

1 MHz

CL = 0 pF,

RL = ∞,

T = +25°C

—6.5 7.1 27 MHz

—7.2 8.5 70 MHz

—8.3 11.9 150 MHz

Output Logic Level High VOH

0.8 x VDD — —

–6 mA, DSC1004, CL = 40 pF

0.8 x VDD — — –6 mA, DSC1003, CL = 25 pF

0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF

Output Logic Level Low VOL

— — 0.2 x VDD

6 mA, DSC1004, CL = 40 pF

— — 0.2 x VDD 6 mA, DSC1003, CL = 25 pF

— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF

Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical

values.

2: Measured over 50k clock cycles.

DSC1001/3/4

DS20005529B-page 4  2017 Microchip Technology Inc.

Output Transition Rise

Time tR

—1.4 3.0

DSC1001, CL =

15 pF

T = +25°C,

20% to 80%

—1.5 3.0 DSC1003, CL =

25 pF

—1.8 3.0 DSC1004, C2 =

40 pF

Output Transition Fall

Time tF

—1.0 3.0

DSC1001, CL =

15 pF

T = +25°C,

20% to 80%

—1.1 3.0 DSC1003, CL =

25 pF

—1.2 3.0 DSC1004, C2 =

40 pF

Jitter, Max.

Cycle-to-Cycle JCC —60 —ps f = 100 MHz (Note 2)

Period Jitter JP—10 15 psRMS f = 100 MHz (Note 2)

VDD = 2.5V

Supply Current, No Load IDD

—6.0 6.4

1 MHz

CL = 0 pF,

RL = ∞,

T = +25°C

—6.7 7.5 27 MHz

—7.7 9.4 70 MHz

—9.6 13.9 150 MHz

Output Logic Level High VOH

0.9 x VDD — —

–6 mA, DSC1004, CL = 40 pF

0.8 x VDD — — –6 mA, DSC1003, CL = 25 pF

0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF

Output Logic Level Low VOL

— — 0.1 x VDD

6 mA, DSC1004, CL = 40 pF

— — 0.2 x VDD 6 mA, DSC1003, CL = 25 pF

— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF

Output Transition Rise

Time tR

—1.0 2.0

DSC1001, CL =

15 pF

T = +25°C,

20% to 80%

—1.1 2.0 DSC1003, CL =

25 pF

—1.2 2.0 DSC1004, C2 =

40 pF

Output Transition Fall

Time tF

—0.9 2.0

DSC1001, CL =

15 pF

T = +25°C,

20% to 80%

—1.0 2.0 DSC1003, CL =

25 pF

—1.1 2.0 DSC1004, C2 =

40 pF

TABLE 1-1: DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.

Parameters Sym. Min. Typ. Max. Units Conditions

Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical

values.

2: Measured over 50k clock cycles.

 2017 Microchip Technology Inc. DS20005529B-page 5

DSC1001/3/4

Jitter, Max.

Cycle-to-Cycle JCC —50 —ps f = 100 MHz (Note 2)

Period Jitter JP— 5 10 psRMS f = 100 MHz (Note 2)

VDD = 3.3V

Supply Current, No Load IDD

—6.0 6.5

1 MHz

CL = 0 pF,

RL = ∞,

T = +25°C

—6.8 8.0 27 MHz

—8.2 10.5 70 MHz

—10.8 16.6 150 MHz

Output Logic Level High VOH

0.9 x VDD — —

–8 mA, DSC1004, CL = 40 pF

0.9 x VDD — — –6 mA, DSC1003, CL = 25 pF

0.8 x VDD — — –4 mA, DSC1001, CL = 15 pF

Output Logic Level Low VOL

— — 0.1 x VDD

8 mA, DSC1004, CL = 40 pF

— — 0.1 x VDD 6 mA, DSC1003, CL = 25 pF

— — 0.2 x VDD 4 mA, DSC1001, CL = 15 pF

Output Transition Rise

Time tR

—1.0 2.0

DSC1001, CL =

15 pF

T = +25°C,

20% to 80%

—1.1 2.0 DSC1003, CL =

25 pF

—1.2 2.0 DSC1004, C2 =

40 pF

Output Transition Fall

Time tF

—0.9 2.0

DSC1001, CL =

15 pF

T = +25°C,

20% to 80%

—1.0 2.0 DSC1003, CL =

25 pF

—1.1 2.0 DSC1004, C2 =

40 pF

Jitter, Max.

Cycle-to-Cycle JCC —50 —ps f = 100 MHz (Note 2)

Period Jitter JP— 5 10 psRMS f = 100 MHz (Note 2)

TABLE 1-1: DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.

Parameters Sym. Min. Typ. Max. Units Conditions

Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical

values.

2: Measured over 50k clock cycles.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters Sym. Min. Typ. Max. Units Conditions

Temperature Ranges

Operating Temperature Range (T) TA

–40 —+105 °C Ordering Option L

–40 —+85 °C Ordering Option I

–20 —+70 °C Ordering Option E

Junction Operating Temperature TJ— — +150 °C —

Storage Temperature Range TA–55 —+150 °C —

Soldering Temperature Range TS— — +260 °C 40 sec. max

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.

DSC1001/3/4

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 2017 Microchip Technology Inc. DS20005529B-page 7

DSC1001/3/4

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1 and Table 2-2.

TABLE 2-1: CDFN PACKA GE PIN FU NCTION TABLE

Pin Number Symbol Description

1STANDBY# Standby input (Section 4.1 “Standby Fu nction”)

2GND Power supply ground

3 OUT Oscillator output

4VDD Positive power supply

TABLE 2-2: DFN PACKAGE PIN FUNCTION TABLE

Pin Number Symbol Description

1STANDBY# Standby input (Section 4.1 “Standby Function ” )

2 GND Power supply ground

3OUT Oscillator output

4VDD Positive power supply

Center Pad NC Tie to GND or do not connect.

DSC1001/3/4

DS20005529B-page 8  2017 Microchip Technology Inc.

3.0 NOMINAL PERFORMANCE CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

FIGURE 3-1: Supply Current.

FIGURE 3-2: Rise Time.

FIGURE 3-3: Rise Time.

FIGURE 3-4: Supply Current.

FIGURE 3-5: Fall Time.

FIGURE 3-6: Fall Time.

 2017 Microchip Technology Inc. DS20005529B-page 9

DSC1001/3/4

4.0 OUTPUT WAVEFORM

VIL

1/fo

OUTPUT

STANDBY#

tEN

tDA

VIH

VOH

VOL

FIGURE 4-1: Output Waveform.

4.1 Standby Function

Standby# (Pin 1) Output (Pin 3)

High Level Output ON

Open (no connect) Output ON

Low Level High Impedance

DSC1001/3/4

DS20005529B-page 10  2017 Microchip Technology Inc.

5.0 TEST CIRCUIT

0.01μF

VDD 15pF

*VSD

*VSD = Standby# Logic Level Input

FIGURE 5-1: DSC1001/3/4 Test Circuit.

 2017 Microchip Technology Inc. DS20005529B-page 11

DSC1001/3/4

6.0 BOARD LAYOUT (RECOMMENDED)

VDD

GND

Standby

Output

Via to GND Layer

FIGURE 6-1: Recommended Board Layout for DSC1001/3/4.

DSC1001/3/4

DS20005529B-page 12  2017 Microchip Technology Inc.

7.0 SOLDER REFLOW PROFILE

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

ReŇow

Cool

Time

Temperature (°C)

3C/Sec Max.

6C/Sec Max.

200

217

150

260

3C/Sec Max.

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

ReŇow

Cool

Time

Temperature (°C)

3C/Sec Max.

6C/Sec Max.

200

217

150

260

60-150

Sec

20-40

Sec

60-180

Sec

8 min max

Pre heat

ReŇow

Cool

Time

Temperature (°C)

3C/Sec Max.

6C/Sec Max.

200

217

150

260

3C/Sec Max.

FIGURE 7-1: Solder Reflow Profile.

MSL 1 @ 260°C refer to JSTD-020C

Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max.

Preheat Time 150°C to 200°C 60 to 180 sec.

Time maintained above 217°C 60 to 150 sec.

Peak Temperature 255°C to 260°C

Time within 5°C of Actual Peak 20 to 40 sec.

Ramp-Down Rate 6°C/sec. max.

Time 25°C to Peak Temperature 8 minutes max.

 2017 Microchip Technology Inc. DS20005529B-page 13

DSC1001/3/4

8.0 PACKAGING INFORMATION

8.1 Package Marking Information

Example

4-Lead CDFN/DFN*

XXXXXX

0SSS

DCPYYWW

0400000

0603

DCP1121

Legend: XX...X Product code, customer-specific information, or frequency in MHz

without printed decimal point

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC® designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

●, ▲, ▼Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar (⎯) symbol may not be to scale.

DSC1001/3/4

DS20005529B-page 14  2017 Microchip Technology Inc.

4-Lead DFN 7.0 mm x 5.0 mm Package Outline & Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

 2017 Microchip Technology Inc. DS20005529B-page 15

DSC1001/3/4

4-Lead CDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern

DSC1001/3/4

DS20005529B-page 16  2017 Microchip Technology Inc.

4-Lead CDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern

 2017 Microchip Technology Inc. DS20005529B-page 17

DSC1001/3/4

4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern

DSC1001/3/4

DS20005529B-page 18  2017 Microchip Technology Inc.

NOTES:

 2017 Microchip Technology Inc. DS20005529B-page 19

DSC1001/3/4

APPENDIX A: REVISION HISTOR Y

Revision A (September 2017)

• Converted Micrel data sheet DSC1001 to Micro-

chip format data sheet DS20005529A.

• Minor text changes throughout.

• Added Ta b l e 2-2 for DFN package.

• Combined Micrel data sheet DSC1003 and

DSC1004 into this data sheet.

- Updated Section 1.0 “Electrical Character-

istics” to reflect this change.

- Updated General Description and Features

to reflect this change.

Revision B (November 2017)

• Updated VOH and VOL values in Ta b l e 1-1.

DSC1001/3/4

DS20005529B-page 20  2017 Microchip Technology Inc.

NOTES:

 2017 Microchip Technology Inc. DS20005529B-page 21

DSC1001/3/4

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

a) DSC1001AE1-010.0000T: 

1.8V - 3.3V Low-Power Pre-

cision CMOS Oscillator, 4-

Lead 7.0 mm x 5.0 mm

DFN, Ext. Commercial Tem-

perature Range, ±50 ppm,

10 MHz Output Fre-

quency, 1,000/Reel

b) DSC1003BL2-030.0000: 

1.8V - 3.3V Low-Power Pre-

cision CMOS Oscillator, 4-

Lead 5.0 mm x 3.2 mm

CDFN, Ext. Industrial Tem-

perature Range, ±25 ppm,

30 MHz Output Fre-

quency, 110/Tube

c) DSC1001DE5-150.0000: 

1.8V - 3.3V Low-Power Pre-

cision CMOS Oscillator, 4-

Lead 2.5 mm x 2.0 mm

CDFN, Ext. Commercial

Temperature Range,

±10 ppm, 150 MHz Output

Frequency, 110/Tube

d) DSC1004AI3-075.0000T: 

1.8V - 3.3V Low-Power

Precision CMOS Oscilla-

tor, 4-Lead 7.0 mm x

5.0 mm DFN, Industrial

Temperature Range,

±20 ppm, 75 MHz 

Output Frequency,

1,000/Reel

PART NO.

Package

Stability

Device

Device: DSC1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS

Oscillator

Package: A = 4-Lead 7.0 mm x 5.0 mm DFN

B = 4-Lead 5.0 mm x 3.2 mm CDFN

C = 4-Lead 3.2 mm x 2.5 mm CDFN

D = 4-Lead 2.5 mm x 2.0 mm CDFN

Temperature

Range: E = –20C to +70C (Extended Commercial)

I = –40C to +85C (Industrial)

L = –40C to +105C (Extended Industrial)

Stability: 1 = ±50ppm

2 = ±25ppm

3=±20 ppm

5=±10 ppm

Frequency: xxx.xxxx = 1 MHz to 150 MHz (user-defined)

Packing Option: <blank>= 110/Tube

T = 1,000/Reel

Package

Temperature

Range

-XXX.XXXX

Frequency

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This

identifier is used for ordering purposes and

is not printed on the device package. Check

with your Microchip Sales Office for package

availability with the Tape and Reel option.

DSC1001/3/4

DS20005529B-page 22  2017 Microchip Technology Inc.

NOTES:

 2017 Microchip Technology Inc. DS20005529B-page 23

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR,

AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,

CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,

KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,

maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,

OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip

Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST

Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

and other countries.

ClockWorks, The Embedded Control Solutions Company,

EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,

mTouch, Precision Edge, and Quiet-Wire are registered

trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any

Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,

CodeGuard, CryptoAuthentication, CryptoCompanion,

CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average

Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial

Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,

KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,

MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,

Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple

Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,

SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,

USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and

ZENA are trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in

the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip

Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip Technology

Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-5224-2389-8

Note the following deta ils of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certif ication for its worldwide

headquarters, design and wafer fabrication facilities in Chandler an d

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, micro perip hera ls, n onvolat ile memory and

analog products. In addition, Microchip’s quality system for the d esign

and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTS

YSTEM

CERTIFIEDBYDNV

== ISO/TS16949==

DS20005529B-page 24  2017 Microchip Technology Inc.

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Tel: 86-10-8569-7000

China - Chengdu

Tel: 86-28-8665-5511

China - Chongqing

Tel: 86-23-8980-9588

China - Dongguan

Tel: 86-769-8702-9880

China - Guangzhou

Tel: 86-20-8755-8029

China - Hangzhou

Tel: 86-571-8792-8115

China - Hong Kong SAR

Tel: 852-2943-5100

China - Nanjing

Tel: 86-25-8473-2460

China - Qingdao

Tel: 86-532-8502-7355

China - Shanghai

Tel: 86-21-3326-8000

China - Shenyang

Tel: 86-24-2334-2829

China - Shenzhen

Tel: 86-755-8864-2200

China - Suzhou

Tel: 86-186-6233-1526

China - Wuhan

Tel: 86-27-5980-5300

China - Xian

Tel: 86-29-8833-7252

China - Xiamen

Tel: 86-592-2388138

China - Zhuhai

Tel: 86-756-3210040

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444

India - New Delhi

Tel: 91-11-4160-8631

India - Pune

Tel: 91-20-4121-0141

Japan - Osaka

Tel: 81-6-6152-7160

Japan - Tokyo

Tel: 81-3-6880- 3770

Korea - Daegu

Tel: 82-53-744-4301

Korea - Seoul

Tel: 82-2-554-7200

Malaysia - Kuala Lumpur

Tel: 60-3-7651-7906

Malaysia - Penang

Tel: 60-4-227-8870

Philippines - Manila

Tel: 63-2-634-9065

Singapore

Tel: 65-6334-8870

Taiwan - Hsin Chu

Tel: 886-3-577-8366

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Taiwan - Taipei

Tel: 886-2-2508-8600

Thailand - Bangkok

Tel: 66-2-694-1351

Vietnam - Ho Chi Minh

Tel: 84-28-5448-2100

EUROPE

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

Finland - Espoo

Tel: 358-9-4520-820

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Garching

Tel: 49-8931-9700

Germany - Haan

Tel: 49-2129-3766400

Germany - Heilbronn

Tel: 49-7131-67-3636

Germany - Karlsruhe

Tel: 49-721-625370

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Germany - Rosenheim

Tel: 49-8031-354-560

Israel - Ra’anana

Tel: 972-9-744-7705

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Italy - Padova

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Norway - Trondheim

Tel: 47-7289-7561

Poland - Warsaw

Tel: 48-22-3325737

Romania - Bucharest

Tel: 40-21-407-87-50

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

Sweden - Gothenberg

Tel: 46-31-704-60-40

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800

Fax: 44-118-921-5820

Worldwide Sales and Service

10/25/17