TL(BF,EGF)1100C(T11)
2010-01-26
1
TOSHIBA LED Lamps
TLBF1100C(T11), TLEGF1100C(T11)
Panel Circuit Indicators
• Surface-mount devices
• 3.2 (L) mm × 2.9 (W) mm × 1.9 (H) mm
• InGaN LEDs
• Low drive current, high-intensity light emission
• Luminous intensity
Blue: Iv = 300 mcd (typ.) @ 20 mA
Green: Iv = 700 mcd (typ.) @ 20 mA
• Topr / Tstg = -40 to 100°C
• Applications: automotive use, message signboards, backlighting,
etc.
• Standard embossed tape packing: T11 (2000 pcs/reel)
8-mm tape reel
Color and Material
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Forward Current (Note 1) IF 30 mA
Power Dissipation PD 114 mW
Operating Temperature Topr −40 to 100 °C
Storage Temperature Tstg −40 to 100 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 4-3V1
Weight: 0.035 g (typ.)
Part Number Color Material
TLBF1100C Blue
TLEGF1100C Green
InGaN
Ambient temperature Ta (°C)
IF – Ta
Allowable forward current IF (mA)
0
0 20 40 60 80 100 120
5
10
15
20
25
30
35
TL(BF,EGF)1100C(T11)
2010-01-26
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Electrical Characteristics (Ta = 25°C)
Optical Characteristics–1 (Ta = 25°C)
Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Iv rank
Rank symbol Min Max
SA2 200 320
TA1 250 400
TA2 320 500
UA1 400 630
UA2 500 800
VA1 630 1000
VA2 800 1250
WA1 1000 1600
Unit mcd Mcd
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Wavelength λp Δλ Dominant Wavelength λd
Part Number
Min Typ. Max Typ. Min Typ. Max
IF
TLBF1100C ⎯ 468 ⎯ 25 463 470 477
TLEGF1100C ⎯ 518 ⎯ 35 518 528 538
20
Unit nm nm nm mA
Characteristics Symbol Test condition Min Typ. Max Unit
Forward Voltage VF I
F = 20 mA 2.6 3.2 3.8 V
Reverse Current IR V
R = 5 V ⎯ ⎯ 10 μA
Luminous Intensity IV
Part Number
Min Typ. Max IF
Available Iv rank
Please see Note 2
TLBF1100C 200 300 500 SA2 / TA1 / TA2
TLEGF1100C 400 700 1250
20
UA1 / UA2 / VA1/VA2
Unit mcd mA
TL(BF,EGF)1100C(T11)
2010-01-26
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The cautions
ESD withstand voltage according to MIL STD 883D, Method 3015.7 : ≥1000V
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application
(ex. Light source for sensor, optical communication and etc) except general display light source.
TL(BF,EGF)1100C(T11)
2010-01-26
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TLBF1100C
1
3
10
30
100
2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0
Ta = 25°C
IF – VF (typ.)
Ta = 25°C
90°
80°
-40 -20 0 20 40 80 100
60
10
1
0.1
0.01
1 300 30 100 3 10
0.03
0.1
0.3
1
3
5 50 500
Ta = 25°C
IV/IV(20 mA) – IF (typ.)
30°
0°
60°
90°
30°
60°
1.00.80.6 0.4 0.2 0
80°
70°
50°
40°
20°
10°
70°
50°
40°
20° 10°
0.2
400 500 600 700 800
0.4
0.6
0.8
1.0
0
300
Forward Voltage VF (V)
Forward Current IF (mA)
IV/IV(20 mA)
Forward Current IF (mA)
Relative IV – Tc (typ.)
Relative luminous Intensity IV
Case Temperature Tc (°C)
Wavelength characteristic (typ.)
Relative luminous Intensity
Wavelength λ (nm)
Radiation pattern (typ.)
TL(BF,EGF)1100C(T11)
2010-01-26
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TLEGF1100C
1
3
10
30
100
2.2 2.6 3.0 3.4 3.8 4.2 4.6 5.0
Ta = 25°C
IF – VF (typ.)
Ta = 25°C
-40 -20 0 20 40 80 100
60
10
1
0.1
0.01
1 300 30 100 3 10
0.03
0.1
0.3
1
3
5 50 500
Ta = 25°C
IV/Iv(20 mA) – IF (typ.)
30°
0°
60°
90°
30°
60°
1.00.80.6 0.4 0.2 0
80°
70°
50°
40°
20°
10°
70°
50°
40°
20° 10°
400 500 600 700 800
0.4
0.6
0.8
1.0
0.2
0
300
IV/IV(20 mA)
Forward Current IF (mA)
Forward Current IF (mA)
Forward Voltage VF (V)
Wavelength characteristic (typ.)
Relative luminous Intensity
Wavelength λ (nm)
Case Temperature Tc (°C)
Relative IV – Tc (typ.)
Relative luminous Intensity IV
Radiation pattern (typ.)
TL(BF,EGF)1100C(T11)
2010-01-26
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Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 4weeks in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering (example)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than max (*) values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time : within 3 s
• If the product needs to be performed by other soldering method (ex. wave soldering), please contact Toshiba
sales representative.
Recommended soldering pattern
1.65 1.15
2.41
Unit: mm
1.65
60 to 120 s
10 s max
240°C max
4°C/s max
140 to 160°C
4°C/s max
Time (s)
Package surface
temperature (°C)
Temperature profile for Pb soldering (example)
Time (s)
Package surface
temperature (°C)
Temperature profile for Pb-free soldering (example)
150 to 180°C
4°C/s max
5 s max
260°C max
4°C/s max
230°C
60 to 120 s
(*)
(*)
(*)
(*)
(*)
(*)
(*)
(*)
max(*)
max(*)
max(*)
30 to 50s max(*)
max(*)
TL(BF,EGF)1100C(T11)
2010-01-26
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Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)
KAO CLEAN THROUGH 750H : (made by KAO)
PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T11 (4-mm pitch)
(2) Example
2. Tape dimensions
Unit: mm
Symbol Dimension Tolerance Symbol Dimension Tolerance
D 1.5 +0.1/−0 P2 2.0 ±0.05
E 1.75 ±0.1 W 8.0 ±0.3
P0 4.0 ±0.1 P 4.0 ±0.1
t 0.3 ±0.05 A0 2.9 ±0.1
F 3.5 ±0.05 B0 3.7 ±0.1
D1 1.5 ±0.1 K0 2.3 ±0.1
TLBF1100C (T11)
Tape type
Toshiba product No.
A0
P D1
F
E
Polarity
t
K0
B0
D
P2
P0
TL(BF,EGF)1100C(T11)
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3. Reel dimensions
Unit: mm
4. Leader and trailer sections of tape
Note1: Empty trailer section
Note2: Empty leader section
9 +1/−0
180 +0
−4
φ60
φ13
11.4 ± 1.0
2 ± 0.5
φ44
(Note 1)
Leading part: 190 mm (min)
40 mm or more
(Note 2)
40 mm or more
TL(BF,EGF)1100C(T11)
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5. Packing display
(1) Packing quantity
Reel 2,000 pcs
Carton 10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLBF1100C (T11)
P/N: TOSHIBA
TYPE TLBF1100C
ADDC (T11) Q’TY 2,000 pcs
Lot Number Key code for TSB 32C 2000
(RANK SYMBOL)
Use under 5-30degC/60%RH within 4weeks
SEALED
[[G]]/RoHS COMPATIBLE DIFFUSED IN *****
*Y380xxxxxxxxxxxxxxxxxx* ASSEMBLED IN *****
(2) Label location
Tape feel direction
Label position
Label position
• Reel
•
Carton
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
TL(BF,EGF)1100C(T11)
2010-01-26
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
