NCP380HMUAJAATBG - ON Semiconductor

February, 2012 − Rev. 10

1Publication Order Number:

NCP380/D

NCP380, NCV380

Fixed / Adjustable Current-

Limiting Power-Distribution

Switches

The NCP380 is a high side power−distribution switch designed for

applications where heavy capacitive loads and short−circuits are likely

to be encountered. The device includes an integrated 55 mW (DFN

package), P−channel MOSFET. The device limits the output current to

a desired level by switching into a constant−current regulation mode

when the output load exceeds the current−limit threshold or a short is

present. The current−limit threshold is either user adjustable between

100 mA and 2.1 A via an external resistor or internally fixed. The

power−switch rise and fall times are controlled to minimize current

ringing during switching.

An internal reverse−voltage detection comparator disables the

power−switch if the output voltage is higher than the input voltage to

protect devices on the input side of the switch.

The FLAG logic output asserts low during over current,

reverse−voltage or over temperature conditions. The switch is

controlled by a logic enable input active high or low.

Features

•2.5 V – 5.5 V Operating Range

•70 mW High−Side MOSFET

•Current Limit:

♦User adjustable from 100 mA to 2.1 A

♦Fixed 500 mA, 1 A, 1.5 A, 2 A and 2.1 A

•Under Voltage Lock−out (UVLO)

•Built−in Soft−start

•Thermal Protection

•Soft Turn−off

•Reverse Voltage Protection

•Junction Temperature Range: −40°C to 125°C

•Enable Active High or Low (EN or EN)

•Compliance to IEC61000−4−2 (Level 4)

♦8.0 kV (Contact)

♦15 kV (Air)

•UL Listed − File No. E343275

•AEC−Q100 Qualified and PPAP Capable

•NCV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements

•These are Pb−Free Devices

Typical Applications

•Laptops

•USB Ports/Hubs

•TVs

UDFN6

MU SUFFIX

CASE 517AB

MARKING

DIAGRAMS

http://onsemi.com

XX M

TSOP−5

SN SUFFIX

CASE 483

XXXAYWG

(Note: Microdot may be in either location)

TSOP−6

SN SUFFIX

CASE 318G

XXX = Specific Device Code

A =Assembly Location

M = Date Code

Y = Year

W = Work Week

G= Pb−Free Package

XXXAYWG

See detailed ordering and shipping information in the package

dimensions section on page 21 of this data sheet.

ORDERING INFORMATION

NCP380, NCV380

http://onsemi.com

IN OUT

ILIM*

GND

NCP380

USB

Port

GND

D+

D−

VBUS

Rlim

USB INPUT

FLAG

USB

DATA

Rfault

Figure 1. Typical Application Circuit

100 kW1 mF120 mF

FLAG

*For adjustable version only.

(Top view)

Figure 2. Pin Connections

OUT

ILIM*

FLAG

GND

PAD1

UDFN6

OUT

GND

FLAG

TSOP−5

OUT

ILIM*

FLAG

GND

TSOP−6

*For adjustable version only, otherwise not connected.

PIN FUNCTION DESCRIPTION

Pin Name Type Description

EN INPUT Enable input, logic low/high (i.e. EN or EN) turns on power switch

GND POWER Ground connection;

IN POWER Power−switch input voltage; connect a 1 mF or greater ceramic capacitor from IN to GND as close as

possible to the IC.

FLAG OUTPUT Active−low open−drain output, asserted during overcurrent, overtemperature or reverse−voltage condi-

tions. Connect a 10 kW or greater resistor pull−up, otherwise leave unconnected.

OUT OUTPUT Power−switch output; connect a 1 mF ceramic capacitor from OUT to GND as close as possible to the IC

is recommended. A 1 mF or greater ceramic capacitor from OUT to GND must be connected if the USB

requirement (i.e.120 mF capacitor minimum) is not met.

ILIM* INPUT External resistor used to set current−limit threshold; recommended 5 kW < RILIM < 250 kW.

PAD1** THERMAL Exposed Thermal Pad: Must be soldered to PCB Ground plane

*(For adjustable version only, otherwise not connected.

**For DFN version only.

NCP380, NCV380

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

From IN to OUT Pins: Input/Output (Note 1) VIN , VOUT −7.0 to +7.0 V

IN, OUT, EN, ILIM, FLAG, Pins: Input/Output (Note 1) VEN, VILIM, VFLAG, VIN, VOUT −0.3 to +7.0 V

FLAG sink current ISINK 1 mA

ILIM source current ILIM 1 mA

ESD Withstand Voltage (IEC 61000−4−2) (output only, when

bypassed with 1.0 mF capacitor minimum)

ESD IEC 15 Air, 8 contact kV

Human Body Model (HBM) ESD Rating (Note 2) ESD HBM 2000 V

Machine Model (MM) ESD Rating (Notes 2 and 3) ESD MM 200 V

Latch−up protection (Note 4)

− Pins IN, OUT, EN, ILIM, FLAG

100

Maximum Junction Temperature Range (Note 6) TJ−40 to +TSD °C

Storage Temperature Range TSTG −40 to +150 °C

Moisture Sensitivity (Note 5) MSL Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. According to JEDEC standard JESD22−A108.

2. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM) $2.0 kV per JEDEC standard: JESD22−A114 for all pins.

Machine Model (MM) $200 V per JEDEC standard: JESD22−A115 for all pins.

3. Except EN pin, 150 V.

4. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.

5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.

6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.

NCP380, NCV380

http://onsemi.com

OPERATING CONDITIONS

Symbol Parameter Conditions Min Typ Max Unit

VIN Operational Power Supply 2.5 5.5 V

VEN Enable Voltage 0 5.5

TAAmbient Temperature Range −40 25 +85 °C

TJJunction Temperature Range −40 25 +125 °C

RILIM Resistor from ILIM to GND pin 5.0 250 kW

ISINK FLAG sink current 1.0 mA

CIN Decoupling input capacitor 1.0 mF

COUT Decoupling output capacitor USB port per Hub 120 mF

RqJA Thermal Resistance Junction−to−Air UDFN−6 package (Notes 7 and 8) 120 °C/W

TSOP−5 package (Notes 7 and 8) 305 °C/W

TSOP−6 package (Notes 7 and 8) 280 °C/W

IOUT Maximum DC current UDFN−6 package 2.1 A

TSOP−5, TSOP−6 package 1.0 A

PDPower Dissipation Rating (Note 9) TA v 25°CUDFN−6 package 830 mW

TSOP−5 package 325 mW

TSOP−6 package 350 mW

TA = 85°CUDFN−6 package 325 mW

TSOP−5 package 130 mW

TSOP−6 package 145 mW

7. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.

8. The RqJA is dependent of the PCB heat dissipation. Board used to drive this data was a 2” x 2” NCP380EVB board. It is a 2 layers board

with 2−once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN−6 version only.

9. The maximum power dissipation (PD) is given by the following formula:

PD+

TJMAX *TA

RqJA

NCP380, NCV380

http://onsemi.com

ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between −40°C to +85°C and TJ up to + 125°C for VIN between

2.5 V to 5.5V (Unless otherwise noted). Typical values are referenced to TA = + 25°C and VIN = 5 V.

Symbol Parameter Conditions Min Typ Max Unit

POWER SWITCH

RDS(on) Static drain−source on−state

resistance DFN Package

TSOP Package

VIN = 5 V –40°C < TJ < 125°C 55 75 mW

2.5 V < VIN < 5.5 V –40°C < TJ < 125°C110

VIN = 5 V –40°C < TJ < 125°C 70 95 mW

2.5 V < VIN < 5.5 V –40°C < TJ < 125°C 135

TROutput rise time VIN = 5 V CLOAD = 1 mF,

RLOAD = 100 W (Note 10)

0.3 1.0 1.5 ms

VIN = 2.5 V 0.2 0.65 1.0

TFOutput fall time VIN = 5 V 0.1 0.5

VIN = 2.5 V 0.1 0.5

ENABLE INPUT EN OR EN

VIH High−level input voltage 1.2 V

VIL Low−level input voltage 0.4 V

IEN Input current VEN = 0 V, VEN = 5 V −0.5 0.5 mA

TON Turn on time CLOAD = 1 mF, R LOAD = 100 W (Note 11) 2.0 3.0 4.0 ms

TOFF Turn off time 1.0 3.0 ms

CURRENT LIMIT

IOCP Current−limit threshold

(Maximum DC output current

IOUT delivered to load)

VIN = 5 V RILIM = 20 kW (Note 11) 1.02 1.20 1.38 A

RILIM = 40 kW

(Notes 11 and 13)

0.595 0.700 0.805

Fixed 0.5 A (Note 12) 0.5 0.58 0.65 A

Fixed 1.0 A (Note 12) 1.0 1.15 1.3

Fixed 1.5 A (Note 12) 1.5 1.75 1.9

Fixed 2.0 A (Note 12) 2.0 2.25 2.5

Fixed 2.1 A (Note 12) 2.1 2.25 2.5

TDET Response time to short circuit VIN = 5 V 2.0 ms

TREG Regulation time 1.8 3.0 4.0 ms

TOCP Overcurrent protection time 14 20 26 ms

REVERSE−VOLTAGE PROTECTION

VREV Reverse−voltage comparator trip

point (VOUT – VIN)

100 mV

TREV Time from reverse−voltage

condition to MOSFET switch off

& FLAG low

VIN = 5 V 4.0 6.0 9.0 ms

TRREV Re−arming Time 7.0 10 15 ms

UNDERVOLTAGE LOCKOUT

VUVLO IN pin low−level input voltage VIN rising 2.0 2.3 2.4 V

VHYST IN pin hysteresis TJ = 25°C 25 60 mV

TRUVLO Re−arming Time 7.0 10 15 ms

SUPPLY CURRENT

IINOFF Low−level output supply current. VIN = 5 V, No load on OUT, Device OFF

VEN = 0 V or VEN = 5 V

1.0 2.1 mA

NCP380, NCV380

http://onsemi.com

ELECTRICAL CHARACTERISTICS Min & Max Limits apply for TA between −40°C to +85°C and TJ up to + 125°C for VIN between

2.5 V to 5.5V (Unless otherwise noted). Typical values are referenced to TA = + 25°C and VIN = 5 V.

Symbol UnitMaxTypMinConditionsParameter

SUPPLY CURRENT

IINON High−level output supply current. VIN = 5 V, device enable

2 A and 2.1 A versions

1 A and 1.5 A current versions

0.5 A current version

IREV Reverse leakage current VOUT = 5 V, VIN = 0 V TJ = 25°C 1.0 mA

FLAG PIN

VOL FLAG output low voltage IFLAG = 1 mA 400 mV

ILEAK Off−state leakage VFLAG = 5 V 1.0 mA

TFLG FLAG deglitch FLAG de−assertion time due to overcurrent or

reverse voltage condition

4.0 6.0 9.0 ms

TFOCP FLAG deglitch FLAG assertion due to overcurrent 6.0 8.0 12 ms

THERMAL SHUTDOWN

TSD Thermal shutdown threshold 140 °C

TSDOCP Thermal regulation threshold 125 °C

TRSD Thermal shutdown rearming

threshold

115 °C

10.Parameters are guaranteed for CLOAD and RLOAD connected to the OUT pin with respect to the ground, See Figure 3.

11. Adjustable current version, RILIM tolerance ±1%.

12.Fixed current version.

13.Not production test, guaranteed by characterization.

IN OUT

GND

NCP380 CLOAD RLOAD

VIN

1mF

Figure 3. Test Configuration

TON

TOFF

50%

90%

10%

VEN

VOUT

90%

10%

VOUT

10%

TRTF

Figure 4. Voltage Waveform

NCP380, NCV380

http://onsemi.com

BLOCK DIAGRAM

Gate Driver

UVLO

Vref

TSD

Control logic

and timer

EN block

Flag

Osc

IN OUT

/FLAG

GND

Blocking control

Current

Limiter

ILIM*

Figure 5. Block Diagram

*For adjustable version only, otherwise not connected.

NCP380, NCV380

http://onsemi.com

Ton + TR

Figure 6. Ton Delay and Trise Time

Toff + Tfall

Figure 7. Toff Delay and Tfall

NCP380, NCV380

http://onsemi.com

Figure 8. Turn On a Short

Treg

TOCP

TSD

Warning

Figure 9. 2 W Short on Output. Complete Regulation Sequence

NCP380, NCV380

http://onsemi.com

Figure 10. OCP Regulation and TSD Warning Event

TFOCP

TSD Warning

Treg

TOCP

Figure 11. Timer Regulation Sequence During 2 W Overload

VIN

VOUT

IIN

/FLAG

NCP380, NCV380

http://onsemi.com

Figure 12. Direct Short on OUT Pin

Figure 13. From Timer Regulation to Load Removal Sequence

NCP380, NCV380

http://onsemi.com

TFOCP

Figure 14. From No Load to Direct Short Circuit

VREV

TFREV

Figure 15. Reverse Voltage Detection

VOUT

IOUT

/FLAG

VOUT

VIN

/FLAG

NCP380, NCV380

http://onsemi.com

T RREV

Figure 16. Reverse Voltage Removal

Figure 17. Undervoltage Threshold (Falling) and Hysteresis

TEMPERATURE (°C)

UVLO (V)

NCP380, NCV380

http://onsemi.com

Low−Level Output Supply Current vs Vin

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.4 2.9 3.4 3.9 4.4 4.9 5.4

Vin(V)

IINOFF (mA)

−40°C 25°C 85°C 125°C

Figure 18. Standby Current vs Vin

High−Level Output Supply Current vs Vin

100

2.4 2.9 3.4 3.9 4.4 4.9 5.4

Vin(V)

IINON (mA)

−40°C 25°C 85°C 125°C

Figure 19. Quiescent Current vs Vin

NCP380, NCV380

http://onsemi.com

Figure 20. RDS(on) vs Temperature, TSOP Package

Figure 21. RDS(on) vs Temperature, mDFN Package

NCP380, NCV380

http://onsemi.com

FUNCTIONAL DESCRIPTION

Overview

The NCP380 is a high side P channel MOSFET power

distribution switch designed to protect the input supply

voltage in case of heavy capacitive loads, short circuit or

over current. In addition, the high side MOSFET is turned

off during under voltage, thermal shutdown or reverse

voltage condition. Adjustable version allows the user to

program the current limit threshold using an external

resistor. Thanks to the soft start circuitry, NCP380 is able to

limit large current and voltage surges.

Overcurrent Protection

NCP380 switches into a constant current regulation mode

when the output current is above the IOCP threshold.

Depending on the load, the output voltage is decreased

accordingly.

−In case of hot plug with heavy capacitive load, the

output voltage is brought down to the capacitor voltage.

The NCP380 will limit the current to the IOCP threshold

value until the charge of the capacitor is completed.

VOUT

IOCP

IOUT

Drop due to

capacitor charge

Figure 22. Heavy capacitive load

−In case of overload, the current is limited to the IOCP

value and the voltage value is reduced according to the

load by the following relation:

VOUT +RLOAD IOCP (eq. 1)

VOUT

IOCP

IOUT

IOCP x RLOAD

Figure 23. Overload

−In case of short circuit or huge load, the current is

limited to the IOCP value within TDET time until the

short condition is removed. If the output remains

shorted or tied to a very low voltage, the junction

temperature of the chip exceeds TSDOCP value and the

device enters in thermal shutdown (MOSFET is

turned−off).

VOUT

IOCP

IOUT

Thermal

Regulation

Threshold

Timer

Regulation

Mode

TREGTOCP

Figure 24. Short circuit

Then, the device enters in timer regulation mode, described

in 2 phases:

−Off−phase: Power MOSFET is off during TOCP to allow

the die temperature to drop.

−On−phase: regulation current mode during TREG. The

current is regulated to the IOCP level.

The timer regulation mode allows the device to handle

high thermal dissipation (in case of short circuit for

example) within temperature operating condition.

NCP380 stays in on−phase/off−phase loop until the over

current condition is removed or enable pin is toggled.

Remark: Other regulation modes can be available for

different applications. Please contact our On Semiconductor

representative for availability.

FLAG Indicator

The FLAG pin is an open−drain MOSFET asserted low

during over current, reverse−voltage or over temperature

conditions. When an over current or a reverse voltage fault

is detected on the power path, FLAG pin is asserted low at

the end of the associate deglitch time (see electrical

characteristics). Thanks to this feature, the FLAG pin is not

tied low during the charge of a heavy capacitive load or a

voltage transient on output. Deglitch time is TFOCP for over

current fault and TREV for reverse voltage. The FLAG pin

remains low until the fault is removed. Then, the FLAG pin

goes high at the end of TFGL.

Undervoltage Lock−out

Thanks to a built−in under voltage lockout (UVLO)

circuitry, the output remains disconnected from input until

VIN voltage is below VUVLO. When VIN voltage is above

VUVLO, the system try to reconnect the output after a

rearming time. TRUVLO. This circuit has a VHYST hysteresis

witch provides noise immunity to transient.

Thermal Sense

Thermal shutdown turns off the power MOSFET if the die

temperature exceeds TSD. A Hysteresis prevents the part

from turning on until the die temperature cools at TRSD.

NCP380, NCV380

http://onsemi.com

Reverse Voltage Protection

When the output voltage exceeds the input voltage by

VREV voltage during TREV

, the reverse voltage circuitry

disconnects the output in order to protect the power supply.

The same time TREV is needed to turn on again the power

MOS plus a rearming time TRREV.

Enable Input

Enable pin must be driven by a logic signal (CMOS or

TTL compatible) or connected to the GND or VIN. A logic

low on EN or high on EN turns−on the device. A logic high

on EN or low on EN turns off device and reduces the current

consumption down to IINOFF.

Blocking Control

The blocking control circuitry switches the bulk of the

power MOS. When the part is off, the body diode limits the

leakage current IREV from OUT to IN. In this mode, anode

of the body diode is connected to IN pin and cathode is

connected to OUT pin. In operating condition, anode of the

body diode is connected to OUT pin and cathode is

connected to IN pin preventing the discharge of the power

supply.

NCP380, NCV380

http://onsemi.com

APPLICATION INFORMATION

Power Dissipation

The junction temperature of the device depends on

different contributing factors such as board layout, ambient

temperature, device environment, etc... Yet, the main

contributor in terms of junction temperature is the power

dissipation of the power MOSFET. Assuming this, the

power dissipation and the junction temperature in normal

mode can be calculated with the following equations:

RD+RDS(on) ǒIOUTǓ2

(eq. 2)

PD = Power dissipation (W)

RDS(on) = Power MOSFET on resistance (W)

IOUT = Output current (A)

TJ+PD RqJA )TA(eq. 3)

TJ= Junction temperature (°C)

RqJA = Package thermal resistance (°C/W)

TA= Ambient temperature (°C)

Power dissipation in regulation mode can be calculated by

taking into account the drop VIN −VOUT link to the load by

the following relation:

PD+ǒVIN *RLOAD IOCPǓ IOCP (eq. 4)

PD= Power dissipation (W)

VIN = Input Voltage (V)

RLOAD = Load Resistance (W)

IOCP = Output regulated current (A)

Adjustable Current-Limit Programming (for adjustable

version only)

The NCP380xMUAJAA and NCP380xSNAJAA,

respectively mDFN and TSOP6 packages, are proposed to

have current limit flexibility for end Customer. Indeed, Ilim

pin is available to connect pull down resistor to ground,

which participate to the current threshold adjustment. It’s

strongly recommended to use 0.1 or 1% resistor tolerance to

keep the over current accuracy.

For this resistance selection, Customer should define first

of all, the USB current to sustain, without the device enters

in the protection sequence. Main rule is to select this pull

down resistor in order to make sure min current limit is

above the USB current to provide continuously to the

upstream accessory.

Following, the main table selection contains the USB

current port for the accessory, the standard resistor selection

and typical /max over current threshold.

Table 1. RESISTOR SELECTION FOR ADJUSTABLE CURRENT LIMIT VERSION

Min Current

Limit Value

(A)

Theoric Resistor Value

(kW)

Selected Resistor Value

(kW)

1% or 0.1%

Typical OCP Target Value

(A)

Maximum Current

Value

(A)

0.5 44.2 44.2 0.59 0.67

0.6 37.5 37.4 0.71 0.81

0.7 32.2 31.6 0.825 0.95

0.8 27.7 27.4 0.94 1.08

0.9 24.0 23.7 1.06 1.22

1.0 21.0 21 1.18 1.35

1.1 18.5 18.2 1.3 1.49

1.2 16.6 16.5 1.41 1.62

1.3 14.6 14.3 1.53 1.76

1.4 13.0 13 1.65 1.9

1.5 11.4 11.3 1.78 2.05

1.6 10.4 10.2 1.88 2.17

1.7 9.2 9.09 2.01 2.31

1.8 8.3 8.25 2.12 2.438

1.9 7.4 7.32 2.23 2.56

2.0 6.5 6.49 2.36 2.7

2.1 5.6 5.49 2.48 2.85

The “Min current limit Value” column, represents the DC

current to provide to the accessory without over current

activation.

Second column is the theoretical resistor value obtained

with following formula to achieve typical current target:

NCP380, NCV380

http://onsemi.com

Rlim +−5.2959 * ILIM5)45.256 * ILIM4*155.25 * ILIM3)274.39 * ILIM2*267.6 * ILIM )134.21

Figure 25. Rlim Curve versus Current Limit

When the resistor is choosing to fit with the Customer

application, the limits of the over current threshold can be

calculated with the following formula:

)0.0000009 (Rlim *22.375)4

IOCP min +1.6915129 *0.0330328 Rlim )0.0011207(Rlim *22.375)2*0.0000451 (Rlim *22.375)3

IOCP max +2.2885175 *0.0446914 Rlim )0.0015163(Rlim *22.375)2*0.000061 (Rlim *22.375)3

)0.0000012 (Rlim *22.375)4

IOCPtyp +1.9900152 *0.0388621 Rlim )0.0013185(Rlim *22.375)2*0.0000531 (Rlim *22.375)3

)0.0000011 (Rlim *22.375)4

NCP380, NCV380

http://onsemi.com

The minimum, typical and maximum current curves are described in the following graph:

Figure 26. Current Threshold vs Rlim Resistor

That is recommended to respect 6 kW − 47 kW resistor

range for two reasons.

For the low resistor values, the current limit is pushed up

to high current level. Due to internal power dissipation

capability, a maximum of 2.4 A typical can be set for the

mDFN package if thermal consideration are respected. For

the TSOP6 version 1.2 A is the maximum recommended

value because the part could enter in thermal shutdown

mode before constant current regulation mode.

In the other side, if we want to keep 15% of accuracy, high

resistor values can be used up to 50 kW. With higher value,

the current threshold is lower than 500 mA, so in this case

degraded accuracy can be observed.

PCB Recommendations

The NCP380 integrates a PMOS FET rated up to 2 A, and

the PCB design rules must be respected to properly evacuate

the heat out of the silicon. The UDFN6 PAD1 must be

connected to ground plane to increase the heat transfer if

necessary. This pad must be connected to ground plane. By

increasing PCB area, the RqJA of the package can be

decreased, allowing higher power dissipation.

Figure 27. USB Host Typical Application

NCP380, NCV380

http://onsemi.com

ORDERING INFORMATION

Device Marking

Active

Enable

Level

Over

Current

Limit Evaluation Board

Listed

Scheme Package Shipping†

NCP380LSNAJAAT1G AAC

Low

Adj. NCP380LSNAJAG

EVB

Y Y TSOP−6

(Pb−Free)

3000

Tape / Reel

NCP380LSN05AAT1G AC5 0.5 A NCP380LSN05AG

EVB

Y Y

TSOP−5

(Pb−Free)

NCP380LSN10AAT1G AC6 1.0 A NCP380LSN10AG

EVB

Y Y

NCP380LMUAJAATBG AAC Adj. NCP380LMUAJA

GEVB

N Y

UDFN6

(Pb−Free)

NCP380LMU05AATBG AE 0.5 A NCP380LMU05A

GEVB

Y Y

NCP380LMU10AATBG AF 1.0 A NCP380LMU10A

GEVB

Y Y

NCP380LMU15AATBG AG 1.5 A NCP380LMU15A

GEVB

Y Y

NCP380LMU20AATBG AL 2.0 A NCP380LMU20A

GEVB

N N

NCP380HSNAJAAT1G AAD

High

Adj. NCP380HSNAJA

GEVB

Y Y TSOP−6

(Pb−Free)

NCP380HSN05AAT1G AC7 0.5 A NCP380HSN05A

GEVB

Y Y

TSOP−5

(Pb−Free)

NCP380HSN10AAT1G ADA 1.0 A NCP380HSN10A

GEVB

Y Y

NCP380HMUAJAATBG AC Adj. NCP380HMUAJA

GEVB

N Y

UDFN6

(Pb−Free)

NCP380HMU05AATBG AH 0.5 A NCP380HMU05A

GEVB

Y Y

NCP380HMU10AATBG AJ 1.0 A NCP380HMU10A

GEVB

Y Y

NCP380HMU15AATBG AK 1.5 A NCP380HMU15A

GEVB

Y Y

NCP380HMU20AATBG AM 2.0 A NCP380HMU20A

GEVB

N N

NCP380HMU21AATBG AU 2.1 A NCP380HMU21A

GEVB

N N

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements.

NCP380, NCV380

http://onsemi.com

PACKAGE DIMENSIONS

ÍÍÍ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

SEATING

PLANE

0.10 C

2X 0.10 C

UDFN6 2x2, 0.65P

CASE 517AB

ISSUE B

DIM

MIN MAX

MILLIMETERS

0.45 0.55

A1 0.00 0.05

A3 0.127 REF

b0.25 0.35

D2.00 BSC

D2 1.50 1.70

0.80 1.00

E2.00 BSC

e0.65 BSC

0.25 0.35

PIN ONE

REFERENCE

0.08 C

0.10 C

A0.10 C

0.05 C

BOTTOM VIEW

0.20 ---

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.47

0.40

0.65

1.70

2.30

DIMENSIONS: MILLIMETERS

0.95

PITCH

NCP380, NCV380

http://onsemi.com

PACKAGE DIMENSIONS

TSOP−5

CASE 483−02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

5. OPTIONAL CONSTRUCTION: AN

ADDITIONAL TRIMMED LEAD IS ALLOWED

IN THIS LOCATION. TRIMMED LEAD NOT TO

EXTEND MORE THAN 0.2 FROM BODY.

DIM MIN MAX

MILLIMETERS

A3.00 BSC

B1.50 BSC

C0.90 1.10

D0.25 0.50

G0.95 BSC

H0.01 0.10

J0.10 0.26

K0.20 0.60

L1.25 1.55

M0 10

S2.50 3.00

123

54 S

0.7

0.028

1.0

0.039

ǒmm

inchesǓ

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.20

CAB

T0.10

2X T0.20

NOTE 5

SEATING

PLANE

0.05

DETAIL Z

NCP380, NCV380

http://onsemi.com

PACKAGE DIMENSIONS

ÉÉÉ

TSOP−6

CASE 318G−02

ISSUE U

456

0.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM

LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D

AND E1 ARE DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX

MILLIMETERS

0.90 1.00 1.10

A1 0.01 0.06 0.10

b0.25 0.38 0.50

c0.10 0.18 0.26

D2.90 3.00 3.10

E2.50 2.75 3.00

e0.85 0.95 1.05

L0.20 0.40 0.60

0.25 BSC

−

0°10°

1.30 1.50 1.70

RECOMMENDED

NOTE 5

SEATING

PLANE

GAUGE

PLANE

DETAIL Z

0.60

3.20 0.95

0.95

PITCH

DIMENSIONS: MILLIMETERS

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

NCP380/D

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative