February 2007 Rev 9 1/11
11
STPS340
Power Schottky rectifier
Main product characteristics
Features and Benefits
■Very small conduction losses
■Negligible switching losses
■Low forward voltage drop
■Low thermal resistance
■Extremely fast switching
■Surface mounted device
■Avalanche capability specified
Description
Single chip Schottky rectifier suited for switch
mode power supplies and high frequency DC to
DC converters.
Packaged in DPAK, SMC, SMB, and low profile
SMB, this device is intended for use in low and
medium voltage operation, high frequency
inverters, free wheeling and polarity protection
applications where low switching losses are
required.
Order codes
IF(AV) 3 A
VRRM 40 V
Tj (max) 150° C
VF (max) 0.57 V
Part Number Marking
STPS340U U34
STPS340S S34
STPS340B S340
STPS340B-TR S340
STPS340UF FU34
K
A
SMB
STPS340U
SMC
STPS340S
NC
A
K
DPAK
STPS340B
K
A
K
A
SMB flat
STPS340UF
www.st.com
Characteristics STPS340
2/11
1 Characteristics
Table 1. Absolute Ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 40 V
IF(RMS) RMS forward current DPAK 6 A
IF(AV) Average forward current
Tc = 135° C δ = 0.5 DPAK
3ATL = 105° C δ = 0.5 SMB/SMC
TL = 115° C δ = 0.5 SMB flat
IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1300 W
Tstg Storage temperature range -65 to + 150 °C
TjOperating junction temperature (1)
1. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
Table 2. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to lead
SMB 25
°C/WSMB flat 15
SMC 20
Rth(j-c) Junction to case DPAK 5.5 °C/W
Table 3. Static electrical characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.42 x IF(AV) + 0.050 IF2(RMS)
Reverse leakage current Tj = 25° C VR = VRRM
20 µA
Tj = 125° C 2 10 mA
VF(1) Forward voltage drop
Tj = 25° C IF = 3 A 0.63
V
Tj = 125° C 0.52 0.57
Tj = 25° C IF = 6 A 0.84
Tj = 125° C 0.63 0.72
dPtot
dTj
--------------- 1
Rth j a–()
--------------------------
<
STPS340 Characteristics
3/11
Figure 1. Average forward power dissipation
versus average forward current (per
diode)
Figure 2. Average forward current versus
ambient temperature (δ = 0.5, per
diode) (DPAK / SMB / SMC)
0.0
0.5
1.0
1.5
2.0
2.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
P (W)
F(AV)
T
δ=tp/T tp
I (A)
F(AV)
δ= 1
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125 150
I (A)
F(AV)
T (°C)
amb
R =65°C/W
th(j-a)
R=R
th(j-a) th(j-l)
DPAK
SMB / SMC
T
δ=tp/T tp
Figure 3. Average forward current versus
ambient temperature (δ = 0.5, per
diode) (SMB flat)
Figure 4. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DPAK)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125 150
I (A)
F(AV)
SMB flat
T (°C)
amb
R=R
th(j-a) th(j-l)
T
δ=tp/T tp
R =40°C/W
. S =2.5 cm
th(j-a)
CU 2
0
10
20
30
40
50
60
1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ=0.5
I (A)
M
t(s)
T =25°C
c
T =75°C
c
T =125°C
c
DPAK
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMC)
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ=0.5
I (A)
M
t(s)
T =25°C
a
T =75°C
a
T =125°C
a
SMB
0
1
2
3
4
5
6
7
8
9
10
11
12
1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ=0.5
I (A)
M
t(s)
T =25°C
a
T =75°C
a
T =125°C
a
SMC
Characteristics STPS340
4/11
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB flat
Figure 8. Normalized avalanche power
derating versus pulse duration
0
5
10
15
20
25
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
SMB flat
IM
t
δ=0.5 t(s)
T =25°C
L
T =75°C
L
T =125°C
L
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
Figure 9. Normalized avalanche power
derating versus junction
temperature
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DPAK)
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(t)
P (25°C)
ARM p
ARM
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
DPAK
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMC)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMB
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMC
STPS340 Characteristics
5/11
Figure 13. Relative variation of thermal
impedance junction to lead
versus pulse duration - SMB flat
Figure 14. Reverse leakage current versus
reverse voltage applied (typical
values)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z/R
th(j-l) th(j-l)
SMB flat
t (s)
p
Single pulse
I (mA)
R
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0 5 10 15 20 25 30 35 40
T
j
=150°C
T
j
=125°C
T
j
=100°C
T
j
=75°C
T
j
=25°C
V (V)
R
Figure 15. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 16. Forward voltage drop versus
forward current
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (DPAK)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm)
(SMB / SMC)
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
I (A)
FM
0
0
1
10
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
T
j
=25°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Maximum values)
V (V)
FM
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
DPAK
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB / SMC
S (cm²)
CU
R (°C/W)
th(j-a)
Package Information STPS340
6/11
2 Package Information
●Band indicates cathode on SMB and SMC
●Epoxy meets UL94, V0
Figure 19. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (SMB flat)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
R (°C/W)
th(j-a)
SMB flat
Table 4. DPAK dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
H
L4
G
B
L2
E
B2
D
A1
R
R
C
A
C2
0.60 MIN.
V2
A2
STPS340 Package Information
7/11
Figure 20. DPAK footprint dimensions (in millimeters)
Figure 21. SMB footprint (dimensions in mm)
Table 5. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
6.7
6.7 3 3 1.6
1.6
2.3
2.3
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
Package Information STPS340
8/11
Figure 22. SMB Flat footprint (dimensions in mm)
Table 6. SMB Flat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b(1)
1. Applies to plated leads
1.95 2.20 0.077 0.087
c(1) 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
D
A
L
L
L1
L2
EE1
b
c
1.20 1.203.44
5.84
2.07
STPS340 Package Information
9/11
Figure 23. Foot print dimensions (in millimeters)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. SMC package mechanical data
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.40 0.030 0.063
E
CLE2
E1
D
A1
A2
b
5.03
8.11
1.54
3.15
1.54
Ordering information STPS340
10/11
3 Ordering information
4 Revision history
Ordering type Marking Package Weight Base qty Delivery mode
STPS340U U34 SMB 0.107 g 2500 Tape and reel
STPS340S S34 SMC 0.243 g 2500
STPS340B S340 DPAK 0.30 g 75 Tube
STPS340B-TR 2500 Tape and reel
STPS340UF FU34 SMB flat 0.50 g 5000 Tape and reel
Date Revision Description of Changes
Jul-2003 7B Last update.
Feb-2005 8 Layout update. No content change.
08-Feb-2007 9 Reformatted to current standard. Added ECOPACK
statement. Added SMB flat package.
STPS340
11/11
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